Patents by Inventor Wen-Ji Lan
Wen-Ji Lan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9897393Abstract: The present invention relates to a heat dissipating module which comprises a first flat shell body and a plurality of second flat shell bodies. The first flat shell body has a first chamber and a first wick structure formed on an inner wall of the first chamber. Each of the second flat shell bodies defines a second chamber which is provided with a working fluid and a second wick structure therein. Each of the second flat shell bodies has a heat pipe plugged and connected to the first flat shell body. Therefore, the working fluid in each of the second chambers flows into the first chamber through the corresponding heat pipes to perform heat dissipation by liquid-vapor circulation.Type: GrantFiled: May 27, 2016Date of Patent: February 20, 2018Assignee: ASIA VITAL COMPONENTS CO., LTD.Inventor: Wen-Ji Lan
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Publication number: 20170343297Abstract: A heat dissipation device includes a first and a second housing, at least one pipe, and a working fluid. The first and the second housing internally respectively defines a first and a second chamber, in which a first and a second wick structure is respectively formed, and has at least one first and second opening communicated with the first and the second chamber respectively. The pipe has a pipe body, and a first and second extended portion, which respectively has a first and a second open end, and a first and a second through opening, and is inserted into and connected to the first and the second chamber via the first and the second opening respectively. The pipe internally defines a pipe chamber, in which a pipe wick structure is formed. The working fluid is provided in the first and the second, and the pipe chamber.Type: ApplicationFiled: May 27, 2016Publication date: November 30, 2017Inventor: Wen-Ji Lan
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Publication number: 20170343298Abstract: A heat dissipation component includes: a first main body having a first chamber; a second main body having a second chamber; a third main body having a third chamber; a first tubular body having a first flow way, two ends of the first tubular body being respectively connected with the first and second main bodies; and a second tubular body having a second flow way. The second tubular body is passed through the second main body and the first flow way. Two ends of the second tubular body are respectively connected with the first and third main bodies. A working fluid is filled in the first, second and third chambers.Type: ApplicationFiled: May 27, 2016Publication date: November 30, 2017Inventor: Wen-Ji Lan
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Publication number: 20170343295Abstract: An integrated heat dissipation device includes at least one first case, a second case and multiple third cases. The first and second cases respectively have a first case chamber and a second case chamber. Each third case has a third case chamber. Each third case is connected to the second case via a first heat pipe. The first case is connected to the corresponding third case via a second heat pipe passing through the second case. Accordingly, the working fluid in the third case chambers can flow through the respectively connected first and second heat pipes to the first and second case chambers to achieve the vapor-liquid circulation effect and dissipate the heat.Type: ApplicationFiled: May 27, 2016Publication date: November 30, 2017Inventor: WEN-JI LAN
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Publication number: 20170343296Abstract: The present invention relates to a heat dissipating module which comprises a first flat shell body and a plurality of second flat shell bodies. The first flat shell body has a first chamber and a first wick structure formed on an inner wall of the first chamber. Each of the second flat shell bodies defines a second chamber which is provided with a working fluid and a second wick structure therein. Each of the second flat shell bodies has a heat pipe plugged and connected to the first flat shell body. Therefore, the working fluid in each of the second chambers flows into the first chamber through the corresponding heat pipes to perform heat dissipation by liquid-vapor circulation.Type: ApplicationFiled: May 27, 2016Publication date: November 30, 2017Inventor: WEN-JI LAN
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Publication number: 20170347489Abstract: A heat dissipation element includes a first and a second housing, and a first and a second working fluid. The first housing has a first inner space. At least one pipe is formed on one side of the first housing and has a second inner space. The first and the second inner space are communicable and together define a first chamber. The second housing has a second chamber. A first and a second working fluid is, respectively, provided in the first and the second chamber. One side of the second housing is fixedly connected to one end of the pipe. The first and the second chamber are incommunicable. With these arrangements, the heat dissipation element not only can provide better heat spreading and heat transfer effect, but also can be produced at largely lower manufacturing costs.Type: ApplicationFiled: September 29, 2016Publication date: November 30, 2017Inventor: Wen-Ji Lan
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Publication number: 20170198980Abstract: A combination structure of heat dissipation module includes a heat dissipation set and at least one heat pipe, which is extended through the heat dissipation set. The heat dissipation set includes a first, a second, and a third portion, which are located respectively corresponding to a heat-dissipation section, a curved section, and a heat-absorption section of the heat pipe. The second and the third portion of the heat dissipation set are respectively provided with a plurality of second and third slots, which are gradually extended according to a length of the curved section and a horizontal length of the heat-absorption section of the heat pipe, and the third portion internally defines a receiving opening communicable with the third slots, so as to effectively remove heat through using the curved section of the heat pipe.Type: ApplicationFiled: January 11, 2016Publication date: July 13, 2017Inventor: Wen-Ji Lan
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Publication number: 20170153066Abstract: A heat dissipation device includes a housing and a heat pipe. The heat pipe has an open end, which is inserted into an opening on a top side of the housing, such that a heat pipe chamber of the heat pipe is communicated with a housing chamber of the housing and an extended portion extended from the open end of the heat pipe is pressed against a bottom side of the housing, as well as a heat pipe wick structure of the heat pipe is connected to a housing wick structure of the housing, so as to increase heat transfer effect.Type: ApplicationFiled: December 1, 2015Publication date: June 1, 2017Inventors: Yu-Min Lin, Wen-Ji Lan
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Publication number: 20170153065Abstract: An assembling structure of heat dissipation device includes at least one heat pipe, a first and a second radiating fin assembly. The heat pipe has a heat absorption section, at least one heat releasing section and a curved section between the heat absorption section and the heat releasing section. The heat releasing section is fitted in multiple perforations of the second radiating fin assembly. The curved section is fitted in multiple notches of the first radiating fin assembly. Each notch is defined with an open side and a closed side. The closed side extends along a curved outer side of the curved section and contacts and attaches to the curved outer side of the curved section. Accordingly, the utility ratio of the heat pipe is increased. Also, the heat dissipation area of the heat pipe is increased and the heat dissipation efficiency of the heat dissipation device is enhanced.Type: ApplicationFiled: December 1, 2015Publication date: June 1, 2017Inventor: Wen-Ji Lan
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Publication number: 20170153064Abstract: A heat dissipation unit is provided and includes a casing and a heat pipe. The casing has a casing chamber which contains therein a working fluid. Casing capillaries are disposed on an inner wall of the casing chamber. The heat pipe has an open end and a closed end. A heat pipe chamber is defined between the open end and the closed end and communicates with the casing chamber through the open end. Heat pipe capillaries are disposed on an inner wall of the heat pipe chamber and are in capillary connection with the casing capillaries through the open end of the heat pipe.Type: ApplicationFiled: December 1, 2015Publication date: June 1, 2017Inventor: Wen-Ji Lan
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Patent number: 9188322Abstract: A heat dissipation structure for LED lighting includes a light seat, a support body, a cap body and a lens. A heat sink and a fan are assembled on the support body and disposed in the opening of the light seat. The cap body has a first open end and a second open end. At least one air outlet is formed on the cap body in adjacency to the first open end. At least one air inlet is formed on the cap body at the second open end. The fan serves to forcedly drive airflow from the air inlet into the light seat and then drive the airflow to multiple radiating fins of the heat sink so as to directly carry the heat from the radiating fins to outer side through the air outlet. Accordingly, the heat dissipation effect is enhanced and the noise is reduced.Type: GrantFiled: March 26, 2012Date of Patent: November 17, 2015Assignee: ASIA VITAL COMPONENTS CO., LTD.Inventor: Wen-Ji Lan
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Patent number: 9103505Abstract: A heat dissipation structure for LED lighting includes a light shade, at least one LED module, a wind guide member and a light seat. The light shade has a first opening and a second opening. The light shade further has at least one first extension section between the first and second openings. The LED module is inlaid in the first extension section. The light seat is connected with the light shade to form at least one perforation therebetween. The wind guide member serves to directly suck in airflow through the perforation to dissipate the heat generated by the LED module. The heat of the LED module is carried out of the first opening so as to lower the temperature of the LED module. Accordingly, the heat dissipation structure is free from any radiating fin assembly so that the total weight is reduced and the heat dissipation efficiency is enhanced.Type: GrantFiled: August 17, 2011Date of Patent: August 11, 2015Assignee: Asia Vital Components Co., Ltd.Inventors: Ding-Hua Kuo, Wen-Ji Lan
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Patent number: 8632217Abstract: A light head structure with adjustable focal length and a lighting device thereof. The light head structure includes a base, a threaded collar and a soft lens. The threaded collar has an assembling section, a receiving space for receiving the base therein and a protrusion section formed on an inner circumference of the threaded collar. The base has a recess for receiving a light-emitting element therein and an outer connection section for movably assembling with the assembling section. The soft lens has a focusing section in alignment with the light-emitting element. The focusing section has an extension section. The protrusion section of the threaded collar abuts against the extension section to attach the extension section to the outer circumference of the base. The thickness of the soft lens is adjustable to change the focal length and enhance the illumination. The lighting device can be easily manufactured to lower manufacturing cost.Type: GrantFiled: August 9, 2011Date of Patent: January 21, 2014Assignee: Asia Vital Components Co., Ltd.Inventors: Xiao-Zhen Zeng, Wen-Ji Lan
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Patent number: 8608344Abstract: An LED lighting structure includes a main body and a filling body. The main body has a first side and a second side. The first side has multiple raised sections. The second side has multiple light incidence sections corresponding to the raised sections respectively. At least one recessed channel section is formed on the second side around the light incidence sections. The filling body is disposed in the channel section. The filling body provides waterproof effect to prevent humidity and alien particles from infiltrating into the channel section. Also, multiple main bodies can be quickly serially connected.Type: GrantFiled: September 6, 2011Date of Patent: December 17, 2013Assignee: Asia Vital Components Co., Ltd.Inventor: Wen-Ji Lan
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Publication number: 20130250578Abstract: A heat dissipation structure for LED lighting includes a light seat, a support body, a cap body and a lens. A heat sink and a fan are assembled on the support body and disposed in the opening of the light seat. The cap body has a first open end and a second open end. At least one air outlet is formed on the cap body in adjacency to the first open end. At least one air inlet is formed on the cap body at the second open end. The fan serves to forcedly drive airflow from the air inlet into the light seat and then drive the airflow to multiple radiating fins of the heat sink so as to directly carry the heat from the radiating fins to outer side through the air outlet. Accordingly, the heat dissipation effect is enhanced and the noise is reduced.Type: ApplicationFiled: March 26, 2012Publication date: September 26, 2013Inventor: Wen-Ji Lan
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Publication number: 20130058088Abstract: An LED lighting structure includes a main body and a filling body. The main body has a first side and a second side. The first side has multiple raised sections. The second side has multiple light incidence sections corresponding to the raised sections respectively. At least one recessed channel section is formed on the second side around the light incidence sections. The filling body is disposed in the channel section. The filling body provides waterproof effect to prevent humidity and alien particles from infiltrating into the channel section. Also, multiple main bodies can be quickly serially connected.Type: ApplicationFiled: September 6, 2011Publication date: March 7, 2013Applicant: ASIA VITAL COMPONENTS CO., LTD.Inventor: Wen-Ji Lan
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Publication number: 20130058097Abstract: An adaptive light-emitting-diode (LED) lighting structure includes a heat-dissipating element, at least one flexible support, a base, and an LED module. The heat-dissipating element has a first main body, and a heat-dissipating section and an electrically conductive section located at two opposite ends of the first main body. The base has a connecting face and an opposite heat-conducting face connected to the first main body. The flexible support includes a fixing section connected to the connecting face of the base, an extension section, and an LED holding section located at an end of the extension section opposite to the fixing section for holding the LED module thereon. The flexible support can be bent due to gravity force or an external force applied thereto by a user, so as to orient light from the LED module to different illuminating directions or areas, making the LED lighting structure very convenient for use.Type: ApplicationFiled: September 6, 2011Publication date: March 7, 2013Inventors: Ding-Hua Kuo, Wen-Ji Lan
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Publication number: 20130044490Abstract: A heat dissipation structure for LED lighting includes a light shade, at least one LED module, a wind guide member and a light seat. The light shade has a first opening and a second opening. The light shade further has at least one first extension section between the first and second openings. The LED module is inlaid in the first extension section. The light seat is connected with the light shade to form at least one perforation therebetween. The wind guide member serves to directly suck in airflow through the perforation to dissipate the heat generated by the LED module. The heat of the LED module is carried out of the first opening so as to lower the temperature of the LED module. Accordingly, the heat dissipation structure is free from any radiating fin assembly so that the total weight is reduced and the heat dissipation efficiency is enhanced.Type: ApplicationFiled: August 17, 2011Publication date: February 21, 2013Applicant: ASIA VITAL COMPONENTS CO., LTD.Inventors: Ding-Hua Kuo, Wen-Ji Lan
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Publication number: 20130039069Abstract: A light head structure with adjustable focal length and a lighting device thereof. The light head structure includes a base, a threaded collar and a soft lens. The threaded collar has an assembling section, a receiving space for receiving the base therein and a protrusion section formed on an inner circumference of the threaded collar. The base has a recess for receiving a light-emitting element therein and an outer connection section for movably assembling with the assembling section. The soft lens has a focusing section in alignment with the light-emitting element. The focusing section has an extension section. The protrusion section of the threaded collar abuts against the extension section to attach the extension section to the outer circumference of the base. The thickness of the soft lens is adjustable to change the focal length and enhance the illumination. The lighting device can be easily manufactured to lower manufacturing cost.Type: ApplicationFiled: August 9, 2011Publication date: February 14, 2013Applicant: ASIA VITAL COMPONENTS CO., LTD.Inventors: Xiao-Zhen Zeng, Wen-Ji Lan
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Publication number: 20130032325Abstract: A thermostatic control LED thermal module includes at least one fan, a heat dissipation unit, a sensing unit and a controller. One side of the heat dissipation unit is mated with the fan, while the other side of the heat dissipation unit is attached to an LED unit. The sensing unit is electrically connected to the LED unit for detecting the temperature of the LED unit and generating a sensing signal. The controller is electrically connected to the fan and the sensing unit. According to the received sensing signal, the controller operates and processes to generate a control signal to control rotational speed of the fan so as to achieve an excellent heat dissipation effect.Type: ApplicationFiled: August 5, 2011Publication date: February 7, 2013Inventors: Wei-Shan Deng, Wen-Ji Lan