Abstract: One or more techniques or systems for mitigating density gradients between two or more regions of cells are provided herein. In some embodiments, an array of cells is associated with a dummy region. For example, the array of cells includes an array of gates and an array of OD regions. In some embodiments, the array of gates includes a first set of gates associated with a first gate dimension and a second set of gates associated with a second gate dimension. In some embodiments, the array of OD regions includes a first set of OD regions associated with a first OD dimension and a second set of OD regions associated with a second OD dimension. In this manner, at least one of a pattern density, gate density, or OD density is customized to a region associated with active cells, thus mitigating density gradients between respective regions.

Abstract: Apparatus includes a machine readable storage medium for storing a template library having at least one template. The template is to include a first layout representation of at least one pattern to be formed by multi-patterning a single layer of an IC. The pattern has a plurality of portions to be formed using a plurality of respectively different photomasks. The first layout representation includes data identifying on which photomask each portion is to be located. An electronic design automation (EDA) tool includes a processor configured to receive a hardware description language representation of at least a part of a circuit and generate a second layout representation of the part of the circuit having a plurality of polygons. The EDA tool has a matching module that identifies and outputs an indication of whether one or more of the plurality of portions matches a subset of the plurality of polygons.

Abstract: Provided is a method for evaluating and decomposing a semiconductor device level for triple pattern lithography in semiconductor manufacturing. The method includes generating a conflict graph and simplifying the conflict graph using various methods to produce a simplified conflict graph which can either be further simplified or evaluated for decomposition validity. The disclosure also provides for applying decomposition validity rules to a simplified conflict graph to determine if the conflict graph represents a semiconductor device layer that is decomposable into three masks. Methods of the disclosure are carried out by a computer and instructions for carrying out the method may be stored on a computer readable storage medium.

Abstract: The present disclosure relates a method of performing a design rule checking (DRC) procedure on a multi-tiered integrated chip. In some embodiments, the method is performed by defining layer databases for a plurality of tiers within a multi-tiered integrated chip. The layer databases respectively identify design layers within an associated tier. A DRC (design rule checking) deck is then generated, which defines one or more individual design layer definitions as a function of a plurality of layer databases, so that the one or more individual design layer definitions are defined for a plurality of tiers. One or more design rules for the one or more individual design layer definitions are defined within the DRC deck. Since the individual design layer definitions are defined as functions of the plurality of layer databases, the design rules apply to the plurality of tiers.

Abstract: The present disclosure relates to a method and apparatus for forming a multiple patterning lithograph (MPL) compliant integrated circuit layout by operating a construction validation check on unassembled IC cells to enforce design restrictions that prevent MPL conflicts after assembly. In some embodiments, the method is performed by generating a plurality of unassembled integrated circuit (IC) cells having a multiple patterning design layer. A construction validation check is performed on the unassembled IC cells to identify violating IC cells having shapes disposed in patterns comprising potential multiple patterning coloring conflicts. Design shapes within a violating IC cell are adjusted to achieve a plurality of violation free IC cells. The plurality of violation free IC cells are then assembled to form an MPL compliant IC layout. Since the MPL compliant IC layout is free of coloring conflicts, a decomposition algorithm can be operated without performing a post assembly color conflict check.

Abstract: The present disclosure relates a method of performing a design rule checking (DRC) procedure on a multi-tiered integrated chip. In some embodiments, the method is performed by defining layer databases for a plurality of tiers within a multi-tiered integrated chip. The layer databases respectively identify design layers within an associated tier. A DRC (design rule checking) deck is then generated, which defines one or more individual design layer definitions as a function of a plurality of layer databases, so that the one or more individual design layer definitions are defined for a plurality of tiers. One or more design rules for the one or more individual design layer definitions are defined within the DRC deck. Since the individual design layer definitions are defined as functions of the plurality of layer databases, the design rules apply to the plurality of tiers.

Abstract: A method of determining if a layout design for fabricating a layer of features of an integrated circuit is N-colorable, comprising identifying a set of candidate cells among layout cells of a layout design. Each candidate cell of the set of candidate cells is one of the set of base layout cells, or one of the set of composite layout cells, and constituent layout cells of the one of the set of composite layout cells having been determined as N-colorable. Whether a first candidate cell of the set of candidate cell is N-colorable is determined. An abutment-sensitive conflict graph of the first candidate cell is generated when the first candidate cell is N-colorable and the first candidate cell is not the top layout cell.

Abstract: A portion of a layout of a single layer of an integrated circuit is to be multi-patterned. A method for layout decomposition includes determining spacings between adjacent pairs of patterns, and generating a conflict graph having a plurality of sub-graphs, in which a respective vertex corresponds to each respective sub-graph. The patterns within each respective sub-graph are divided into at least a first group and a second group, each of which is assigned to be patterned on the single layer by a respectively different one of a first mask or a second mask. The method further include determining, in a processor, a count of color-rule violations in the plurality of patterns within each respective sub-graph based on a predetermined set of criteria; and within each sub-graph, assigning the first group of patterns in the sub-graph to the one of the first mask or the second mask which results in a smaller count of color-rule violations.

Abstract: A semiconductor chip includes a row of cells, with each of the cells including a VDD line and a VSS line. All VDD lines of the cells are connected as a single VDD line, and all VSS lines of the cells are connected as a single VSS line. No double-patterning full trace having an even number of G0 paths exists in the row of cells, or no double-patterning full trace having an odd number of G0 paths exists in the row of cells.

Abstract: In some embodiments, in a method for considering in-phase grouping for a voltage-dependent design rule, for a first net and a second net in a schematic, first data for obtaining the differences between first voltage values of the first and second nets, and between second voltage values of the first and second nets is provided. For each of the first and second nets, the first voltage value is larger than the second voltage value. A layout for the schematic is generated. In the layout, a relationship of a first shape and a second shape associated with the first and the second nets, respectively, is defined using the first data.

Abstract: A method includes determining one or more potential merges corresponding to a color set Ai and a color set Aj of N color sets, represented by A1 to AN, used in coloring polygons of a layout of an integrated circuit. N is a positive integer, i and j are integers from 1 to N, and i?j. One or more potential cuts corresponding to the color set Ai and the second color set Aj are determined. An index Aij is determined according to the one or more potential merges and the one or more potential cuts. A plurality of parameters F related to the index Aij is obtained based on various values of indices fi and fj. A parameter F is selected among the plurality of parameters F based on a definition of the index Aij.

Abstract: Provided is a method for evaluating and decomposing a semiconductor device level for triple pattern lithography in semiconductor manufacturing. The method includes generating a conflict graph and simplifying the conflict graph using various methods to produce a simplified conflict graph which can either be further simplified or evaluated for decomposition validity. The disclosure also provides for applying decomposition validity rules to a simplified conflict graph to determine if the conflict graph represents a semiconductor device layer that is decomposable into three masks. Methods of the disclosure are carried out by a computer and instructions for carrying out the method may be stored on a computer readable storage medium.

Abstract: A semiconductor chip includes a row of cells, with each of the cells including a VDD line and a VSS line. All VDD lines of the cells are connected as a single VDD line, and all VSS lines of the cells are connected as a single VSS line. No double-patterning full trace having an even number of G0 paths exists in the row of cells, or no double-patterning full trace having an odd number of G0 paths exists in the row of cells.

Abstract: A method embodiment includes identifying, by a processor, an empty region in an integrated circuit (IC) layout, wherein the empty region is a region not including any active fins. The method further includes providing a standard dummy fin cell and forming an expanded dummy fin cell. The standard dummy fin cell includes a plurality of partitions. The expanded dummy fin cell is larger than the standard dummy fin cell, and the expanded dummy fin cell includes integer multiples of each of the plurality of partitions. The empty region is filled with a plurality of dummy fin cells, wherein the plurality of dummy fin cells includes the expanded dummy fin cell. The plurality of dummy fin cells is implemented in an IC.

Abstract: Among other things, one or more techniques and systems for performing design layout are provided. An initial design layout is associated with an electrical component, such as a standard cell. A conflict graph is generated based upon the initial design layout. The conflict graph comprises one or more nodes, representing polygons within the initial design layout, connected by one or more edges. A same-process edge specifies that two nodes are to be generated by the same pattern process, while a different-process edge specified that two nodes are to be generated by different pattern processes, such as a mandrel pattern process and a passive fill pattern process. The conflict graph is evaluated to identify a conflict, such as a self-aligned multiple pattering (SAMP) conflict, associated with the initial design layout. The conflict is visually displayed so that the initial design layout can be modified to resolve the conflict.

Abstract: A method of decomposing a layout for triple pattern lithography generates a first conflict graph from the layout. The method generates a second conflict graph from the first conflict graph, and identifies loops in the second conflict graph as decomposition violations.

Abstract: A method embodiment includes identifying an empty region in an integrated circuit (IC) layout, wherein the empty region is a region not including any active fins and outside a minimum spacing boundary, applying a grid map over the empty region, wherein the grid map comprises a plurality of grids inside the empty region, and filling the empty region with a plurality of dummy fin cells by placing a dummy fin cell in each of the plurality of grids, wherein applying the grid map and filling the empty region is performed using a computer.

Abstract: Among other things, techniques for balancing mask loading are provided for herein. In some embodiments, one or more windows are defined within a layout. Based upon polygons comprised within respective windows, a localized mask loading is computed for the layout. In some embodiments, a global mask loading is also computed for the layout. Using the localized mask loading and the global mask loading, if computed, a loading effect of a plurality of mask pattern schemes is evaluated to identify a mask pattern scheme having a desired loading effect.

Abstract: A method embodiment includes identifying an empty region in an integrated circuit (IC) layout, wherein the empty region is a region not including any active fins and outside a minimum spacing boundary, applying a grid map over the empty region, wherein the grid map comprises a plurality of grids inside the empty region, and filling the empty region with a plurality of dummy fin cells by placing a dummy fin cell in each of the plurality of grids, wherein applying the grid map and filling the empty region is performed using a computer.

Abstract: Apparatus includes a machine readable storage medium for storing a template library having at least one template. The template is to include a first layout representation of at least one pattern to be formed by multi-patterning a single layer of an IC. The pattern has a plurality of portions to be formed using a plurality of respectively different photomasks. The first layout representation includes data identifying on which photomask each portion is to be located. An electronic design automation (EDA) tool includes a processor configured to receive a hardware description language representation of at least a part of a circuit and generate a second layout representation of the part of the circuit having a plurality of polygons. The EDA tool has a matching module that identifies and outputs an indication of whether one or more of the plurality of portions matches a subset of the plurality of polygons.