Abstract: A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate having a fin-shaped structure thereon; forming a first shallow trench isolation (STI) around the fin-shaped structure; dividing the fin-shaped structure into a first portion and a second portion; and forming a second STI between the first portion and the second portion.

Abstract: A recombinant cytotoxin is provided. The recombinant cytotoxin of the present invention comprises a cytotoxin, a cell penetrating peptide (CPP), and Asp-Glu-Val-Asp (DEVD) sequence inserted in the cytotoxin. The recombinant cytotoxin can induce a targeting cell into the apoptotic pathway and be cleaved by the enzyme generated from apoptotic pathway. The present invention also provides a method for treating cancer, comprising administrating the recombinant cytotoxin to a subject.

Abstract: Improved methods, systems and apparatus for storing and repairing multimedia files are provided that overcome the limitations of existing multimedia file repair technologies. Backup copies of the multimedia container information associated with given multimedia content data are stored, along with the multimedia content data, on an external storage detachably coupled to a recording device. A primary copy of the multimedia container information is stored on an internal storage associated with the recording device. The recording of the primary container information and the content data is performed in real-time or nearly real-time as the content data is captured by the recording device. In the case of an abnormal event (e.g., battery failure, disconnect of storage media), container information may be selected from the primary copy or the backup copies of the container information, thereby increasing the likelihood that the container file can be successfully repaired or regenerated.

Abstract: A carrying device for belongings contains: a body and at least one clamper. The body includes a connection portion, the connection portion has at least one curved arm arranged on at least one side thereof respectively, each curved arm has a first rotatable coupling part, and the first rotatable coupling part has at least one first ratchet tooth. Each clamper includes a second rotatable coupling part arranged on one end thereof and rotatably coupled with the first rotatable coupling part, wherein among the at least one clamper and the body forms an adjustable clamping space, the second rotatable coupling part has a flexible column, and the flexible column has a plurality of second ratchet teeth which engage with the at least one first ratchet tooth of the first rotatable coupling part of said each curved arm.

Abstract: A method of manufacturing the glass substrate is provided. First, a glass substrate having a target surface is provided. Next, an abrasive blasting process for the target surface is performed. After the abrasive blasting process, an etching process for the target surface is performed. The present invention further provides a glass substrate having a target surface. The target surface has an average etching depth between 1 ?m and 100 ?m, a roughness (Ra) between 0.05 ?m and 1.5 ?m, and a friction below 0.4.

Abstract: The present disclosure provides a light emitting diode die which includes a substrate; an N type semiconductor layer, an active layer, and a P type semiconductor layer formed on the substrate in sequence; at least one recess, and a pair of electrodes. The recess extends to the N type semiconductor layer. The insulating layer covers the all of side surfaces of the N type semiconductor layer, the active layer, the P type semiconductor layer, and covers top of the P type semiconductor layer except an opening on the P semiconductor layer. One of the electrodes is filled in the recess and electrically connected to the N type semiconductor layer, and the other one of the electrodes is connected to the P type semiconductor layer in the opening. The present disclosure further provides an LED package having the LED die and a method for manufacturing the same.

Abstract: A semiconductor device and a method of fabricating the same, the semiconductor device including a fin structure, a first liner, a first insulating layer and a dummy gate structure. The fin structure is disposed on a substrate, where the fin structure has a trench. The first liner disposed in the trench. The first insulating layer disposed on the first liner. The dummy gate structure is disposed on the first insulating layer and disposed above the trench, where a bottom surface of the dummy gate and a top surface of the fin structure are on a same level.

Abstract: An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.

Abstract: A semiconductor device and a method of fabricating the same, the semiconductor device includes a substrate, a plurality of fin shaped structures, a first trench and at least one bump. The substrate has a base. The fin shaped structures protrude from the base of the substrate. The first trench recesses from the base of the substrate and has a depth being smaller than a width of each of the fin shaped structures. The at least one bump is disposed on a surface of the first trench.

Abstract: A semiconductor device and a method of fabricating the same, the semiconductor device includes a substrate, a plurality of fin shaped structures, a first trench and at least one bump. The substrate has a base. The fin shaped structures protrude from the base of the substrate. The first trench recesses from the base of the substrate and has a depth being smaller than a width of each of the fin shaped structures. The at least one bump is disposed on a surface of the first trench.

Abstract: The present invention provides a semiconductor structure including a fin structure formed on a substrate, and an isolation structure formed in the fin structure. The isolation structure includes a trench, and a first dielectric layer disposed in the trench wherein the first dielectric layer includes a body portion in the bottom, a protruding portion in the top with a top surface, and a shoulder portion connecting the body portion and the protruding portion. The protruding portion has a smaller width than the body portion. The semiconductor structure further includes a second dielectric layer covering a top corner of the trench and sandwiched between the protruding portion, the shoulder portion of the first dielectric layer and the upper sidewall of the trench.

Abstract: This invention discloses a process for the synthesis of a rubbery polymer by emulsion polymerization that comprised polymerizing (1) a conjugated diolefin monomer and (2) a functionalized monomer having the structural formula: wherein the R1 groups can be the same or different and represent hydrogen atoms or alkyl groups containing from 1 to about 8 carbon atoms, wherein R2 represents a hydrogen atom or an alkyl group containing from 1 to about 8 carbon atoms, wherein R3 represents a hydrogen atom or an alkyl group containing from 1 to about 8 carbon atoms, and wherein R4 represents a hydrogen atom or an alkyl group containing from 1 to about 8 carbon atoms, with the proviso that if R3 represent an alkyl group then R4 represents a hydrogen atom, and with the proviso that R4 represents an alkyl group then R3 represents a hydrogen atom, wherein said polymerization is conducted in an aqueous medium, and wherein said polymerization is initiated with a free radical initiator.

Abstract: A fluid generating device and an electric apparatus utilizing the fluid generating device are provided. The fluid generating device includes a motor and an impeller driven by the motor. The motor is a single phase direct current brushless motor which includes a stator and a rotor. The stator includes a stator core and a stator winding. The stator core includes an outer ring portion, teeth extending inwardly from the outer ring portion, a pole shoe formed at the tooth. Slot openings are formed between the pole shoes. The rotor is received in a receiving chamber defined by the pole shoes. Inner surfaces of the pole shoes and the rotor form therebetween a substantially even air gap. The presence of even air gap can reduce the cogging torque of the motor, thus reducing the startup current and noise of the motor.

Abstract: A power tool includes a main body and a working portion. The working portion is rotatably coupled to the main body. A single phase brushless motor is mounted in the main body to drive the working portion to rotate bidirectionally. In comparison with a traditional motor, the single phase brushless motor make the power tool has a reduced size and reduced cost while ensuring the stable performance.

Abstract: A board connector assembly has a receptacle connector and a plug connector. The receptacle connector has a first insulative housing, two sets of first terminals and two first metal reinforcing members mounted respectively on two opposite ends of the first insulative housing. The plug connector is detachably engaged with the receptacle connector and has a second insulative housing, two sets of second terminals and two second metal reinforcing members mounted respectively on two opposite ends of the second insulative housing. The first and second metal reinforcing members enhance structural strength and durability of the receptacle connector and plug connector.

Abstract: A semiconductor device and a method of fabricating the same, the semiconductor device including a fin structure, a first liner, a first insulating layer and a dummy gate structure. The fin structure is disposed on a substrate, where the fin structure has a trench. The first liner disposed in the trench. The first insulating layer disposed on the first liner. The dummy gate structure is disposed on the first insulating layer and disposed above the trench, where a bottom surface of the dummy gate and a top surface of the fin structure are on a same level.

Abstract: The present disclosure provides a light emitting diode package which includes a plurality of electrodes, an LED die, a reflecting cup, a reflecting layer, and a phosphor layer. The LED die are electrically connected with the electrodes. The reflecting cup is formed on the electrodes and surrounds the LED die. The reflecting cup includes an inner surface. The reflecting layer is formed between the inner surface and LED die, and the reflecting layer has a higher pyrogenation temperature than the reflecting cup. The phosphor layer covers the LED die.

Abstract: An energy saving air conditioning system is disclosed which provides different air conditioning modes, including a closed-loop mode, an open-loop mode, and a partial-loop mode, for controlling the environment in a high-density apparatus room. The energy saving air conditioning system uses a cloud operating center to monitor the temperature and the moisture inside and outside the high-density apparatus room. The cloud operating system dynamically selects the air conditioning mode in such a manner that energy can be saved and the environment in the high-density apparatus room can be optimally managed.

Abstract: A light emitting device includes a light source and a lens. The lens includes a light emitting surface, a top surface, four edge surfaces, and a bottom surface. The light emitting surface includes a central recess and two convex regions connecting the central recess at opposite sides. The light emitting surface is symmetrical about the central recess. The lens further defines a receiving space in the bottom surface and four positioning pins on the bottom surface. The receiving space includes a light incident surface. The two convex regions of the light emitting surface and the light incident surface are non-spherical surfaces. A maximum distance, dn, between the light source and the light incident surface is larger than a maximum distance, Dm, between the light incident surface and the light emitting surface. The light emitting device provides a wide-angle light distribution.

Abstract: A high-admittance local suppression highlight imaging system includes a first optical zoom lens having a plurality of lenses, inclusive of at least three aspheric lenses, to thereby function as an imaging system; a second optical zoom lens including a plurality of lenses symmetrically arranged to thereby function as a relay system; a polarizing beam splitter disposed between the first optical zoom lens and the second optical zoom lens; a LCoS disposed at an imaging point at an end of the first optical zoom lens; and a photosensitive component provided in form of a CCD or a CMOS and disposed at an imaging point at an end of the second optical zoom lens. Therefore, the imaging system features enhanced admittance of light, ensures that images captured during a nocturnal picture-taking process will be clear but not overexposed, and is applicable to nocturnal vehicle surveillance and the other safety detection systems.