Abstract: A method and system of detecting website visit attempts by browsers includes monitoring networking operations generated by a client and intercepting a network address associated with the networking operations, detecting a type of website from the intercepted network address, and determining that a browser on the client has attempted to visit a website of the detected type based on the browser being in a running state and a website identified as historically visited by the browser matching the detected type of website. This can allow for the accurate detection of a browser's attempt to visit a restricted website, thereby accomplishing accurate monitoring of networking activities of the browser and enhancing the accuracy of subsequent prompting or intercepting of the networking activities of the browser.

Abstract: The present disclosure discloses a method of identifying malicious websites. The method includes: filtering a target website using a local website-filtering list; if the target website is not on the local website-filtering list, filtering the target website using a server website-filtering list. The present disclosure also discloses, based on the above-described method, a system for identifying malicious websites. By using the disclosed malicious website identifying method and system, the number of times needed to access a network to identify malicious websites can be reduced effectively. That is, the number of times that the identification calculation is performed by a network server can be reduced and, thus, increasing the speed of the identification process and reducing network traffic. As a result, the efficiency of the malicious website identifying process can be improved.

Abstract: Improved methods, systems and apparatus for storing and repairing multimedia files are provided that overcome the limitations of existing multimedia file repair technologies. Backup copies of the multimedia container information associated with given multimedia content data are stored, along with the multimedia content data, on an external storage detachably coupled to a recording device. A primary copy of the multimedia container information is stored on an internal storage associated with the recording device. The recording of the primary container information and the content data is performed in real-time or nearly real-time as the content data is captured by the recording device. In the case of an abnormal event (e.g., battery failure, disconnect of storage media), container information may be selected from the primary copy or the backup copies of the container information, thereby increasing the likelihood that the container file can be successfully repaired or regenerated.

Abstract: A solar concentrator is composed of the cascading of the first light guiding module and a second light guiding module. The solar light is collected and guided simultaneously toward the light propagation destination by the light guiding modules. By cascading the light guiding modules in the direction of guiding, the solar concentrator has thinner thickness than the traditional concentrator and has a zero back focal distance to reduce the assembly cost. The solar concentrator utilizes the optical design concept of coincident image points from both the relay and converging optics such that the optical flux is increased in the cascading light guiding modules while the light propagation direction within the concentrator is maintained.

Abstract: An actuator for controlling an air damper includes a motor, an output connector for connecting the actuator to the air damper, a transmission mechanism connecting the motor to the output connector, and an energy storage device that drives the output connector to close the air damper when power to the motor is cut off. The motor has a stator and a rotor. The stator has a stator core including a yoke and nine poles extending from the yoke. The rotor has a shaft and an annular permanent magnet. The magnet forms twelve poles with alternate N and S polarities. An inclination angle of boundaries between adjacent poles of the magnet relative to an axis of the motor is in the range of 13 to 17 degrees.

Abstract: A semiconductor structure includes a gate structure disposed on a substrate and having an outer spacer, a recess disposed in the substrate and adjacent to the gate structure, a doped epitaxial material filling up the recess, a cap layer including an undoped epitaxial material and disposed on the doped epitaxial material, a lightly doped drain disposed below the cap layer and sandwiched between the doped epitaxial material and the cap layer, and a silicide disposed on the cap layer and covering the doped epitaxial material to cover the cap layer together with the outer spacer without directly contacting the lightly doped drain.

Abstract: An exposure-suppressing imaging system has a first optical assembly forming a first image of an object on a focal plane thereof, a beam splitter positioned between the first optical assembly and the focal plane of the first optical assembly; an LCOS reflective light modulator positioned on the focal plane, and selectively and partially altering the reflectivity thereof to reflect the first image back to the beam splitter; a second optical assembly positioned on a side of the beam splitter and receiving the reflected first image to form a second image on a focal plane of the second optical assembly; a light sensor converting the second image into a signal; and a controller receiving the signal computed as a third image, and selectively controlling the reflectivity of the LCOS reflective light modulator according to whether the signal contains information of overexposure on the third image.

Abstract: An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.

Abstract: A patterning method is provided. First, a material layer is formed over a substrate. Thereafter, a plurality of directed self-assembly (DSA) patterns are formed on the material layer. Afterwards, a patterned photoresist layer is formed by using a single lithography process. The patterned photoresist layer covers a first portion of the DSA patterns and exposes a second portion of the DSA patterns. Further, the material layer is patterned by an etching process, using the patterned photoresist layer and the second portion of the DSA patterns as a mask.

Abstract: A semiconductor structure includes a gate structure disposed on a substrate and having an outer spacer, a recess disposed in the substrate and adjacent to the gate structure, a doped epitaxial material filling up the recess, a cap layer including an undoped epitaxial material and disposed on the doped epitaxial material, a lightly doped drain disposed below the cap layer and sandwiched between the doped epitaxial material and the cap layer, and a silicide disposed on the cap layer and covering the doped epitaxial material to cover the cap layer together with the outer spacer without directly contacting the lightly doped drain.

Abstract: A method of manufacturing the glass substrate is provided. First, a glass substrate having a target surface is provided. Next, an abrasive blasting process for the target surface is performed. After the abrasive blasting process, an etching process for the target surface is performed. The present invention further provides a glass substrate having a target surface. The target surface has an average etching depth between 1 ?m and 100 ?m, a roughness (Ra) between 0.05 ?m and 1.5 ?m, and a friction below 0.4.

Abstract: A pharmaceutical composition for treating diabetes is provided in this invention. The composition contains a lanostane compound as a potent component. A suitable source of the lanostane compound is a Poria extract from metabolite, sclerotium, or fermentation product of Poria cocos (Schw) Wolf. The Poria extract contains 1-60% of the lanostane compounds by weight of the extract, and is devoid of secolanostane.

Abstract: A multifunction socket device is connected to a main AC power and comprises a frame unit, at least one power outlet, a cover unit and a first illuminating unit. The multifunction socket device can provide power source and illumination device, which bring more convenience and options to modern lifestyle.

Abstract: A method for packaging an light emitting diode, includes: arranging one or more light emitting diode dies on a film; encapsulating the one or more light emitting diode dies on the film; removing the film from the one or more encapsulated light emitting diode dies to expose a surface of the one or more encapsulated light emitting diode dies; forming an isolating layer on the exposed surface encapsulation surface portion of the one or more encapsulated light emitting diode dies so as to define a plurality of recesses; and forming a plurality of leads in the plurality of recesses of the one or more encapsulated light emitting diode dies, with each one of the plurality of leads being connected to one of the un-encapsulated electrodes of the one or more light emitting diode dies.

Abstract: A pharmaceutical composition is used to enhance immunity of the human body. The composition contains potent components of lanostane compounds. A method is devised to obtain an extract from metabolite, sclerotium, or fermentation product of Poria cocas (Schw) Wolf. The extract contains 5-60% of the lanostane compounds by weight of the extract. The extract is devoid of secolanostane capable of inhibiting immunity development.

Abstract: An exposure-suppressing imaging system has a first optical assembly forming a first image of an object on a focal plane thereof, a beam splitter positioned between the first optical assembly and the focal plane of the first optical assembly; an LCOS reflective light modulator positioned on the focal plane, and selectively and partially altering the reflectivity thereof to reflect the first image back to the beam splitter; a second optical assembly positioned on a side of the beam splitter and receiving the reflected first image to form a second image on a focal plane of the second optical assembly; a light sensor converting the second image into a signal; and a controller receiving the signal computed as a third image, and selectively controlling the reflectivity of the LCOS reflective light modulator according to whether the signal contains information of overexposure on the third image.

Abstract: A light emitting diode package (LED) includes two electrodes spaced from each other, an insulating layer sandwiched between the two electrodes, an LED die arranged on the two electrodes and electrically connecting therewith, and an encapsulation layer covering the LED die and the coating layer. Each electrode includes a conductive sheet and a plurality of connecting pins connecting to the conductive sheet. A thickness of each of the connecting pins is smaller than that of the conductive sheet. A top surface of each of the connecting pins is lower than that of the conductive sheet. The LED package further includes a coating layer coating the connecting pin, part of the coating pin is sandwiched between the top surface of the connecting pin and the encapsulation layer.

Abstract: A light emitting diode package (LED) includes two electrodes spaced from each other, an insulating layer sandwiched between the two electrodes, an LED die arranged on the two electrodes and electrically connecting therewith, and an encapsulation layer covering the LED die. Each electrode includes a conductive sheet and a plurality of connecting pins connecting to the conductive sheet. A thickness of the connecting pin is smaller than that of the conductive sheet. A top surface of the connecting pin is coplanar with that of the conductive sheet. The LED package further includes a coating layer coating the connecting pin, part of the coating pin is sandwiched between the top surface of the connecting pin and the encapsulation layer.

Abstract: A curable composition comprises the following: (A) a polymer having at least two silicon-bonded alkenyl groups and having an average unit formula (I?): (R12SiO2/2)a1(R23SiO1/2)b1(CH2CH2)e1; (B) a branched organopolysiloxane having at least one silicon-bonded alkenyl group and having a siloxane unit of formula R4SiO3/2; (C) an organopolysiloxane having an average unit formula (II) being capped with H: (R52SiO2/2)f(R63SiO1/2)g(R7SiO3/2)h(SiO4/2)i(CH2CH2)j; and (D) a catalyst, wherein R1, R2 and R4 to R7 and a1, b1, e1 and f to j are as defined in the specification.

Abstract: An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Front side and rear side faces of the first and second electrodes are exposed out of a front side face and a rear side face of the substrate whereby the front or rear side faces of the first and second electrodes can connect with welding pads of a printed circuit board. Circumferential side faces of the third electrode are encapsulated in the substrate.