Abstract: An electric connector suited for an electronic device is provided. The electric connector includes a body, a plurality of terminals, and an electrical connecting member. The body is suited to be disposed in the electronic device and has at least one receiving area located on at least one of a top portion and a bottom portion of an exterior of the body. The terminals are disposed in the body, and an external electric connector is suited to be butted to the body along a first axis to be electrically connected to the terminals. One end of the electrical connecting member is located at the receiving area to be electrically connected to the terminals, and another end of the electrical connecting member extends out of the receiving area along a second axis to be electrically connected to the electronic device. The first axis is different from the second axis.

Abstract: A cycling heat dissipation module suited for dissipating heat generated from a heat source is provided. The cycling heat dissipation module includes an evaporator, a condenser, and a micro/nano-structure. The evaporator is thermal contacted with the heat source to absorb heat generated therefrom. The condenser is connected to the evaporator to form a loop, and a working fluid is filled in the loop. The working fluid in liquid state is transformed to vapor state by absorbing heat in the evaporator, and the working fluid in vapor state is transformed to liquid state by dissipating heat in the condenser. The micro/nano-structure is disposed in the condenser to destroy a boundary layer of the working fluid while passing through the condenser.

Abstract: A fan structure including a fan housing and a fan body is provided. The fan housing includes a base and a cover assembled on the base. The cover includes a main portion, a periphery portion, a plurality of connecting portions and a plurality of flow guiding portions. The connecting portions are connected to the main portion and the periphery portion. The cover has a plurality of air inlet openings among the main portion, the periphery portion and connecting portions, wherein each of the flow guiding portions protrudes from the main portion and is adjacent to an inner side of the corresponding air inlet opening. The fan body is rotatably disposed in the fan housing. An electronic assembly is also provided.

Abstract: A hinge structure including a first fixing component, a second fixing component, a shaft, a first positioning component, and a second positioning component is provided. The shaft passes through the first fixing component and the second fixing component. The first positioning component is connected to the second fixing component, wherein the shaft passes through the first positioning component, and the first positioning component includes a positioning elastic piece. The shaft passes through the second positioning component, wherein the positioning elastic piece faces toward the second positioning component, and a side of the second positioning component facing toward the positioning elastic piece is configured with a plurality of positioning slots arranged circularly. The positioning elastic piece is configured to engage in any one of the positioning slots to lock an opened/closed state of the second fixing component and the first fixing component. An electronic device is also provided.

Abstract: A hinge structure including an axis body, a torque member, and a pressing assembly is provided. The axis body includes a contact surface. The torque member leans against the contact surface of the axis body. The torque member and the axis body are rotatable relatively around a central axis of the axis body. The contact surface pushes the torque member to move around the central axis of the axis body when the torque member and the axis body rotate relatively. The pressing assembly provides a pushing force to the torque member to push the torque member to push towards the contact surface. A plurality of electronic devices having the hinge structure are further provided.

Abstract: A heat dissipation system of an electronic device including a body, at least one heat source, and a heat dissipation module is provided. The body has a stack tunnel, and the heat source is disposed in the body. The heat dissipation module includes an evaporator and a pipe connecting to the evaporator to form a loop, and a working fluid is filled in the loop. The evaporator is in thermal contact with the heat source to absorb heat generated from the heat source, and the heat is transferred to the loop through phase transition of the working fluid in the loop, such that the loop heats the air in the stack tunnel in a two-dimensional manner.

Abstract: A rotary combination module for a tablet computer, which includes a pad and a dock, to engage the pad with the dock, the rotary combination module comprising: a rotation part, disposed on the back of the pad, for rotating on the pad as a rotation plane; an extension part, connected with the rotation part, for shifting in the rotation part and positioning at a predetermined location; and a stand, connected to the extension part, for turning away from the extension part and positioning at a predetermined angle.

Abstract: A heat dissipation fan including a hub and a plurality of metal fan blades disposed all around the hub. Each of the metal fan blades has a first end and a second end opposite to each other, wherein the first end is connected to the hub, and the metal fan blade has a flap wing at the second end. An angle is included between the flap wing and a surface of the metal fan blade.

Abstract: A blade module and a fan using the same are provided. The blade module includes a rotating shaft and a plurality of blades. Each blade is connected to the rotating shaft and includes a blade body and an airflow guiding portion. The airflow guiding portion is connected to the blade body and has an opening.

Abstract: A fluid heat exchange apparatus including a casing, and a heat-dissipating device is provided. The casing includes a chamber, an inlet, and an outlet. The chamber includes a first channel including a first entrance and a first exit and a second channel including a second entrance and a second exit. The cross-sectional area of the first channel decreases from the first entrance to the first exit and the cross-sectional area of the second channel decreases from the second entrance to the second exit. The heat-dissipating device is located between the first exit and the outlet. A first fluid flows from the inlet and flows through the first channel and the heat-dissipating device and then flows to the outlet. Part of the first fluid flowing through the heat-dissipating device absorbs heat and forms bubbles moving to the second channel and then forms a second fluid converging into the first channel.

Abstract: A heat dissipation fan including a hub and a plurality of heat dissipation blades is provided. The heat dissipation blades are arranged around the periphery of the hub. Each of the heat dissipation blades includes a curved surface body and a flow guiding portion. The curved surface body has a pressure bearing surface and a negative pressing surface opposite to the pressure bearing surface. The flow guiding portion is connected to the curved surface body. The flow guiding portion has a concave surface and a convex surface opposite to the concave surface, wherein the concave surface is recessed in the pressure bearing surface and the convex surface protrudes outward from the negative pressing surface.

Abstract: A portable electronic device includes a body, a heat source, an evaporator, a pipe, and at least one structural component. An inner space of the body is divided into a first space and a second space. The heat source is disposed at the first space and in thermal contact with the evaporator. The pipe is connected with the evaporator to form a loop and passes through at least one of the first space and the second space. At least a portion of the pipe surrounds and is in thermal contact with the structural component disposed inside the body. A working fluid is filled and is circulated in the loop. By absorbing heat in the evaporator, the working fluid in liquid state is vaporized to exit the evaporator. While passing through the pipe, the working fluid in vapor state dissipates heat to be condensed into liquid and flow into the evaporator.

Abstract: A fan module and an electronic device are provided. The fan module includes a fan housing, a fan and a heat dissipating member. The fan housing has an open side and an enclosing side which surrounds the open side, wherein the open side is provided with a first airflow guiding channel. The fan is disposed within the fan housing, the heat dissipating member is disposed at the open side, the heat dissipating member has a second airflow guiding channel which is communicated with the first airflow guiding channel, and the air generated by the fan passes through the first airflow guiding channel and the second airflow guiding channel and flows out for dust exhausting. The electronic device includes a chassis and the fan module, and the fan module is mounted in the chassis.

Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1 mm to be qualified to achieve a safety certification.

Abstract: A heat dissipation module being disposed in an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, a magnetic field generator and a plurality of magnetic powder. The heat source is heat conducting to the evaporator. The pipe is connected to the evaporator to form a loop therewith, and a working fluid is filled in the loop. The magnetic field generator is disposed outside of the evaporator. The magnetic powder is movably disposed in the evaporator. A magnetic field generated by the magnetic field generator drives the magnetic powder to form a channel in the evaporator where the working fluid passes through. The heat generated by the heat source is transmitted to the evaporator, and the working fluid in liquid phase absorbs the heat and is phase-transited to vapor phase and flows from the evaporator towards the pipe.

Abstract: A head mounted display includes a lens unit, at least one lens temperature sensor, an environment temperature sensor, an environment humidity sensor, a temperature controller, a housing, and a display unit. The lens unit includes a carrier having a touching surface and a back surface opposite to each other and two lenses disposed on the carrier. An enclosed space is formed between a user and the touching surface. The at least one lens temperature sensor is adjacent to the lenses, and the sensors are all disposed on the touching surface. The temperature controller is disposed on the back surface and increases or decreases a temperature of the enclosed space and lens temperatures of the lenses according to sensing actions of the at least one lens temperature sensor, the environment temperature sensor, and the environment humidity sensor, so as to adjust the environment temperature and humidity of the enclosed space.

Abstract: A hinge structure including an axis body, a torque member, and a pressing assembly is provided. The axis body includes a contact surface. The torque member leans against the contact surface of the axis body. The torque member and the axis body are rotatable relatively around a central axis of the axis body. The contact surface pushes the torque member to move around the central axis of the axis body when the torque member and the axis body rotate relatively. The pressing assembly provides a pushing force to the torque member to push the torque member to push towards the contact surface. A plurality of electronic devices having the hinge structure are further provided.

Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.

Abstract: A head mounted display includes a lens unit, at least one lens temperature sensor, an environment temperature sensor, an environment humidity sensor, a temperature controller, a housing, and a display unit. The lens unit includes a carrier having a touching surface and a back surface opposite to each other and two lenses disposed on the carrier. An enclosed space is formed between a user and the touching surface. The at least one lens temperature sensor is adjacent to the lenses, and the sensors are all disposed on the touching surface. The temperature controller is disposed on the back surface and increases or decreases a temperature of the enclosed space and lens temperatures of the lenses according to sensing actions of the at least one lens temperature sensor, the environment temperature sensor, and the environment humidity sensor, so as to adjust the environment temperature and humidity of the enclosed space.

Abstract: A heat dissipation module applicable to an electronic apparatus is provided. The electronic apparatus includes a heat source. The heat dissipation module includes an evaporator, a first pipe, and a working fluid. The evaporator includes a tank and a first sheet metal installed in the tank. The tank includes a cavity, and the first sheet metal includes a plurality of tabs that are arranged and stand in the cavity. The evaporator is in thermal contact with the heat source so as to absorb heat generated by the heat source. The first pipe is connected to the cavity to form a first loop. The working fluid is filled in the cavity and the first loop. In addition, a method for manufacturing the heat dissipation module is also provided.