Abstract: A heat dissipation mechanism is provided, comprising a main casing, an air exhaust device and a first sub-casing. The main casing includes an opening, an air outlet and a main joining portion. The air exhaust device is disposed in the main casing to exhaust air through the air outlet from the main casing. The first sub-casing includes a first through hole and a first joining portion, wherein the first through hole communicates with the opening, and the first joining portion engages with the main connecting portion, so as to fix the first sub-casing to the main casing.

Abstract: An electronic device including a main body, a carrying layer disposed at the main body, a waterproof layer stacked on the carrying layer and located between the carrying layer and the main body, a supporting element disposed on the carrying layer, a key disposed on the supporting element, and a guiding element connected to the key is provided. The main body has an inner space and an opening exposing the inner space. The carrying layer covering the opening has a first ventilation hole and an assembly hole. The waterproof layer has a second ventilation hole. The first ventilation hole is exposed by the second ventilation hole and connected with the inner space. The assembly hole is covered by the waterproof layer. The supporting element covers the first ventilation hole and has a third ventilation hole connected with the first ventilation hole. The guiding element is locked at the assembly hole.

Abstract: An electronic device including a main body, a carrying layer disposed at the main body, a waterproof layer stacked on the carrying layer and located between the carrying layer and the main body, a supporting element disposed on the carrying layer, a key disposed on the supporting element, and a guiding element connected to the key is provided. The main body has an inner space and an opening exposing the inner space. The carrying layer covering the opening has a first ventilation hole and an assembly hole. The waterproof layer has a second ventilation hole. The first ventilation hole is exposed by the second ventilation hole and connected with the inner space. The assembly hole is covered by the waterproof layer. The supporting element covers the first ventilation hole and has a third ventilation hole connected with the first ventilation hole. The guiding element is locked at the assembly hole.

Abstract: A radiating system for projector device includes a ventiduct structure with a ventiduct space, a light source having a lamp center and arranged in the ventiduct space, a baffle provided around the light source to divide the ventiduct space into a first ventiduct space and a second ventiduct space, and an arc-shaped inner bend provided for communicating the first ventiduct space and the second ventiduct space. A lamp radiating fan inhales an air blowing toward the lamp center and a radiating fan drains the air out it of the second ventiduct space to carry away a heat generated by the light source.

Abstract: A radiating system for projector device includes a ventiduct structure with a ventiduct space, a light source having a lamp center and arranged in the ventiduct space, a baffle provided around the light source to divide the ventiduct space into a first ventiduct space and a second ventiduct space, and an arc-shaped inner bend provided for communicating the first ventiduct space and the second ventiduct space. A lamp radiating fan inhales an air blowing toward the lamp center and a radiating fan drains the air out of the second ventiduct space to carry away a heat generated by the light source.