Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.

Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.

Abstract: A cycling heat dissipation module is used for removing the heat generated by a heat-generating element of a circuit board and includes at least one main body and at least one conducting pipe. The main body has a chamber and a heat guiding part. The chamber is filled with a fluid and has a wall to divide the chamber into a first compartment and a second compartment adjacent to each other. The heat guiding part is used for conducting the heat generated from the heat generating element. The conducting pipe has a first end, a second end and a heat exchanging section. The fluid is pushed into the heat-exchanging section by the pressure difference after absorbing the heat of the heat guiding part, and then moved to the second compartment.

Abstract: An electronic device is provided. The electronic device includes a casing, a resonance cover, and a plurality of electronic components. The resonance cover covers a part of the casing so as to define a resonance chamber with the casing. The resonance chamber includes a plurality of openings. The electronic components are disposed in the casing and adapted to generate a plurality of audio frequencies, wherein a diameter of each of the openings is related to the corresponding audio frequency generated by the corresponding electronic component.

Abstract: A hinge assembly used for connecting between an arm and a display of an electronic device is provided. The display has a back surface. The hinge assembly includes a first hinge and a second hinge. The first hinge is pivoted between the display and the arm, such that the display is rotated relative to the arm. The second hinge is assembled to the first hinge. The second hinge has at least one positioning surface leaning against the back surface of the display. An electronic device using the hinge assembly is also provided.

Abstract: A heat dissipation module for an electronic component is provided. The heat dissipation module includes a supporting structure and a heat pipe. The supporting structure is adjacent to the heat electronic component. The heat pipe is connected to the supporting structure by soldering, and the bottom surface of the heat pipe is directly in contact with the upper surface of the electronic component.

Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.

Abstract: A cycling heat dissipation module is used for removing the heat generated by a heat-generating element of a circuit board and includes at least one main body and at least one conducting pipe. The main body has a chamber and a heat guiding part. The chamber is filled with a fluid and has a wall to divide the chamber into a first compartment and a second compartment adjacent to each other. The heat guiding part is used for conducting the heat generated from the heat generating element. The conducting pipe has a first end, a second end and a heat exchanging section. The fluid is pushed into the heat-exchanging section by the pressure difference after absorbing the heat of the heat guiding part, and then moved to the second compartment.

Abstract: A cycling heat dissipation module is used for removing the heat generated by a heat generating element and includes at least one main body and at least one conducting pipe. The main body has a chamber and a heat guiding part. The chamber is filled with fluid and has a wall to divide the chamber into a first compartment and a second compartment connected to each other. The first compartment has a first outlet, and the second compartment has a first inlet. The heat guiding part is used for conducting the heat generated from the heat generating element. The conducting pipe has a first end, a second end and a heat exchanging section. The fluid is pushed into the heat exchanging section by a pressure difference after absorbing the heat of the heat guiding part. After it is cooled, the fluid is flowed back to the chamber.

Abstract: A fluid heat exchange apparatus including a casing, and a heat-dissipating device is provided. The casing includes a chamber, an inlet, and an outlet. The chamber includes a first channel including a first entrance and a first exit and a second channel including a second entrance and a second exit. The cross-sectional area of the first channel decreases from the first entrance to the first exit and the cross-sectional area of the second channel decreases from the second entrance to the second exit. The heat-dissipating device is located between the first exit and the outlet. A first fluid flows from the inlet and flows through the first channel and the heat-dissipating device and then flows to the outlet. Part of the first fluid flowing through the heat-dissipating device absorbs heat and forms bubbles moving to the second channel and then forms a second fluid converging into the first channel.

Abstract: A hinge assembly used for connecting between an arm and a display of an electronic device is provided. The display has a back surface. The hinge assembly includes a first hinge and a second hinge. The first hinge is pivoted between the display and the arm, such that the display is rotated relative to the arm. The second hinge is assembled to the first hinge. The second hinge has at least one positioning surface leaning against the back surface of the display. An electronic device using the hinge assembly is also provided.

Abstract: A heat dissipation mechanism is provided, comprising a main casing, an air exhaust device and a first sub-casing. The main casing includes an opening, an air outlet and a main joining portion. The air exhaust device is disposed in the main casing to exhaust air through the air outlet from the main casing. The first sub-casing includes a first through hole and a first joining portion, wherein the first through hole communicates with the opening, and the first joining portion engages with the main connecting portion, so as to fix the first sub-casing to the main casing.

Abstract: An electronic device including a main body, a carrying layer disposed at the main body, a waterproof layer stacked on the carrying layer and located between the carrying layer and the main body, a supporting element disposed on the carrying layer, a key disposed on the supporting element, and a guiding element connected to the key is provided. The main body has an inner space and an opening exposing the inner space. The carrying layer covering the opening has a first ventilation hole and an assembly hole. The waterproof layer has a second ventilation hole. The first ventilation hole is exposed by the second ventilation hole and connected with the inner space. The assembly hole is covered by the waterproof layer. The supporting element covers the first ventilation hole and has a third ventilation hole connected with the first ventilation hole. The guiding element is locked at the assembly hole.

Abstract: An electronic device including a main body, a carrying layer disposed at the main body, a waterproof layer stacked on the carrying layer and located between the carrying layer and the main body, a supporting element disposed on the carrying layer, a key disposed on the supporting element, and a guiding element connected to the key is provided. The main body has an inner space and an opening exposing the inner space. The carrying layer covering the opening has a first ventilation hole and an assembly hole. The waterproof layer has a second ventilation hole. The first ventilation hole is exposed by the second ventilation hole and connected with the inner space. The assembly hole is covered by the waterproof layer. The supporting element covers the first ventilation hole and has a third ventilation hole connected with the first ventilation hole. The guiding element is locked at the assembly hole.

Abstract: A radiating system for projector device includes a ventiduct structure with a ventiduct space, a light source having a lamp center and arranged in the ventiduct space, a baffle provided around the light source to divide the ventiduct space into a first ventiduct space and a second ventiduct space, and an arc-shaped inner bend provided for communicating the first ventiduct space and the second ventiduct space. A lamp radiating fan inhales an air blowing toward the lamp center and a radiating fan drains the air out it of the second ventiduct space to carry away a heat generated by the light source.

Abstract: A radiating system for projector device includes a ventiduct structure with a ventiduct space, a light source having a lamp center and arranged in the ventiduct space, a baffle provided around the light source to divide the ventiduct space into a first ventiduct space and a second ventiduct space, and an arc-shaped inner bend provided for communicating the first ventiduct space and the second ventiduct space. A lamp radiating fan inhales an air blowing toward the lamp center and a radiating fan drains the air out of the second ventiduct space to carry away a heat generated by the light source.