Abstract: Methods of cutting fins, and structures formed thereby, are described. In an embodiment, a structure includes a first fin and a second fin on a substrate, and a fin cut-fill structure disposed between the first fin and the second fin. The first fin and the second fin are longitudinally aligned. The fin cut-fill structure includes a liner on a first sidewall of the first fin, and an insulating fill material on a sidewall of the liner and on a second sidewall of the first fin. The liner is further on a surface of the first fin between the first sidewall of the first fin and the second sidewall of the first fin.

Abstract: The present invention provides a method of dynamic thermal management applied to a portable device, wherein the method includes the steps of: obtaining a surface temperature of the portable device; obtaining a junction temperature of a chip of the portable device; and calculating an upper limit of the junction temperature according to the junction temperature and the surface temperature.

Abstract: The surface temperature of a portable device is estimated. The portable device includes a sensor for detecting the internal temperature of the portable device. The portable device also includes circuitry for estimating the surface temperature, using the internal temperature and an ambient temperature of the portable device as input to a circuit model. The circuit model describes thermal behaviors of the portable device. The circuitry is operative to identify a scenario in which the portable device operates, and determine the ambient temperature using the scenario and at least the internal temperature.

Abstract: The surface temperature of a portable device is estimated. The portable device includes a sensor for detecting the internal temperature of the portable device. The portable device also includes circuitry for estimating the surface temperature, using the internal temperature and an ambient temperature of the portable device as input to a circuit model. The circuit model describes thermal behaviors of the portable device. The circuitry is operative to identify a scenario in which the portable device operates, and determine the ambient temperature using the scenario and at least the internal temperature.

Abstract: An overshoot reduction circuit for a buck converter includes an operational amplifier, a first sampler circuit, a pulse generator circuit, a pulse calculator circuit, a second sampler circuit and a comparator. The operational amplifier outputs an operation amplified signal according to a buck converted signal of the buck converter and a voltage feedback signal of the operational amplifier. The first sampler circuit samples a first capacitor voltage signal according to a lower bridge conducted signal of the buck converter. The pulse generator circuit outputs a pulse signal. The pulse calculator circuit outputs a first sample compared signal according to the first capacitor voltage signal and the pulse signal. The second sampler circuit samples a second capacitor voltage signal according to the lower bridge conducted signal. The comparator compares the second capacitor voltage signal with the first sample compared signal to output a comparing signal to the buck converter.

Abstract: The surface temperature of a portable device is estimated. A sensor detects the internal temperature of the portable device. The internal temperature and an ambient temperature are used as input to a circuit model that describes thermal behaviors of the portable device. Dynamic thermal management may be performed based on the estimated surface temperature.

Abstract: A semiconductor package includes a package substrate having a top surface and a bottom surface, an interposer mounted on the top surface of the package substrate, a first semiconductor die and a second semiconductor die mounted on the interposer in a side-by-side manner, and a stiffener ring secured to the top surface of the package substrate. The stiffener ring encircles the first semiconductor die and the second semiconductor die. The stiffener ring comprises a reinforcement rib striding across the interposer.

Abstract: Methods of cutting gate structures and fins, and structures formed thereby, are described. In an embodiment, a substrate includes first and second fins and an isolation region. The first and second fins extend longitudinally parallel, with the isolation region disposed therebetween. A gate structure includes a conformal gate dielectric over the first fin and a gate electrode over the conformal gate dielectric. A first insulating fill structure abuts the gate structure and extends vertically from a level of an upper surface of the gate structure to at least a surface of the isolation region. No portion of the conformal gate dielectric extends vertically between the first insulating fill structure and the gate electrode. A second insulating fill structure abuts the first insulating fill structure and an end sidewall of the second fin. The first insulating fill structure is disposed laterally between the gate structure and the second insulating fill structure.

Abstract: Methods of cutting fins, and structures formed thereby, are described. In an embodiment, a structure includes a first fin and a second fin on a substrate, and a fin cut-fill structure disposed between the first fin and the second fin. The first fin and the second fin are longitudinally aligned. The fin cut-fill structure includes a liner on a first sidewall of the first fin, and an insulating fill material on a sidewall of the liner and on a second sidewall of the first fin. The liner is further on a surface of the first fin between the first sidewall of the first fin and the second sidewall of the first fin.

Abstract: Methods of cutting gate structures and fins, and structures formed thereby, are described. In an embodiment, a substrate includes first and second fins and an isolation region. The first and second fins extend longitudinally parallel, with the isolation region disposed therebetween. A gate structure includes a conformal gate dielectric over the first fin and a gate electrode over the conformal gate dielectric. A first insulating fill structure abuts the gate structure and extends vertically from a level of an upper surface of the gate structure to at least a surface of the isolation region. No portion of the conformal gate dielectric extends vertically between the first insulating fill structure and the gate electrode. A second insulating fill structure abuts the first insulating fill structure and an end sidewall of the second fin. The first insulating fill structure is disposed laterally between the gate structure and the second insulating fill structure.

Abstract: Methods of cutting gate structures and fins, and structures formed thereby, are described. In an embodiment, a substrate includes first and second fins and an isolation region. The first and second fins extend longitudinally parallel, with the isolation region disposed therebetween. A gate structure includes a conformal gate dielectric over the first fin and a gate electrode over the conformal gate dielectric. A first insulating fill structure abuts the gate structure and extends vertically from a level of an upper surface of the gate structure to at least a surface of the isolation region. No portion of the conformal gate dielectric extends vertically between the first insulating fill structure and the gate electrode. A second insulating fill structure abuts the first insulating fill structure and an end sidewall of the second fin. The first insulating fill structure is disposed laterally between the gate structure and the second insulating fill structure.

Abstract: A semiconductor package includes a package substrate having a top surface and a bottom surface, and a stiffener ring mounted on the top surface of the package substrate. The stiffener ring includes a reinforcement rib that is coplanar with the stiffener ring on the top surface of the package substrate. At least two compartments are defined by the stiffener ring and the reinforcement rib. At least two individual chip packages are mounted on chip mounting regions within the at least two compartments, respectively, thereby constituting a package array on the package substrate.

Abstract: An electronic card and a detecting method are provided. The electronic card includes a connector. The detecting method detects whether an output signal from a host is received by Pin 41, Pin 43, Pin 47 and Pin 49 of the connector, or Pin 29, Pin 31, Pin 35 and Pin 37 of the connector, or Pin 17, Pin 19, Pin 23 and Pin 25 of the connector, or Pin 5, Pin 7, 11 and Pin 13 of the connector. According to the detecting result and the output signal, the electronic card judges the communication protocol of the host is a SATA communication protocol, a PCIe communication protocol or a USB3.0 communication protocol.

Abstract: A semiconductor package includes a package substrate having a top surface and a bottom surface, an interposer mounted on the top surface of the package substrate, a first semiconductor die and a second semiconductor die mounted on the interposer in a side-by-side manner, and a stiffener ring secured to the top surface of the package substrate. The stiffener ring encircles the first semiconductor die and the second semiconductor die. The stiffener ring comprises a reinforcement rib striding across the interposer.

Abstract: The surface temperature of a portable device is estimated. A sensor detects the internal temperature of the portable device. The internal temperature and an ambient temperature are used as input to a circuit model that describes thermal behaviors of the portable device. Dynamic thermal management may be performed based on the estimated surface temperature.

Abstract: A method for threshing and pneumatic separation of tobacco leaves, including: 1) transporting a mixture of the tobacco slices and stems from a primary threshing set into primary pneumatic separation unit for sorting out tobacco slices, and transporting a remaining mixture into a secondary threshing set; 2) transporting the mixture from the secondary threshing set into a secondary pneumatic separation unit for sorting out the tobacco slices and qualified stems, and transferring a remaining mixture to a tertiary threshing set; 3) transporting the mixture from the tertiary threshing set into a tertiary pneumatic separation unit for sorting out the tobacco slices and the qualified stems, and transferring a remaining mixture into a quaternary threshing set; 4) transporting the mixture from the quaternary threshing set into a quaternary pneumatic separation unit for sorting out the tobacco slices and the qualified stems, and returning a remaining mixture to the quaternary threshing set.

Abstract: An electronic card and a detecting method are provided. The electronic card includes a connector. The detecting method detects whether an output signal from a host is received by Pin 41, Pin 43, Pin 47 and Pin 49 of the connector, or Pin 29, Pin 31, Pin 35 and Pin 37 of the connector, or Pin 17, Pin 19, Pin 23 and Pin 25 of the connector, or Pin 5, Pin 7, 11 and Pin 13 of the connector. According to the detecting result and the output signal, the electronic card judges the communication protocol of the host is a SATA communication protocol, a PCIe communication protocol or a USB3.0 communication protocol.

Abstract: A USB-shaped connector, a data transmission device and a data storage device are provided. The connector has the appearance of a USB 3.0 Type-A connector. The pins of the connector can support various transmission protocols such as a SATA transmission protocol, a PCIe transmission protocol or a USB transmission protocol. The data transmission device determines the transmission protocol according to the result of detecting the pin definitions of the corresponding male connector. Consequently, the utilization flexibility of the data transmission device is enhanced.

Abstract: A camera array apparatus including a plurality of cameras and a light deflection module is provided. The cameras are arranged in an array. The light deflection module is disposed on the cameras. The light deflection module includes at least one prism set. The prism set has a plurality of prisms. The prism set is configured to deflect a light entering obliquely with respect to an optical axis of the cameras to at least a portion of the cameras. The angle between the optical axis and the deflected light is smaller than the angle between the optical axis and the light before being deflected.