Abstract: Methods of cutting gate structures and fins, and structures formed thereby, are described. In an embodiment, a substrate includes first and second fins and an isolation region. The first and second fins extend longitudinally parallel, with the isolation region disposed therebetween. A gate structure includes a conformal gate dielectric over the first fin and a gate electrode over the conformal gate dielectric. A first insulating fill structure abuts the gate structure and extends vertically from a level of an upper surface of the gate structure to at least a surface of the isolation region. No portion of the conformal gate dielectric extends vertically between the first insulating fill structure and the gate electrode. A second insulating fill structure abuts the first insulating fill structure and an end sidewall of the second fin. The first insulating fill structure is disposed laterally between the gate structure and the second insulating fill structure.

Abstract: A semiconductor package includes a package substrate having a top surface and a bottom surface, and a stiffener ring mounted on the top surface of the package substrate. The stiffener ring includes a reinforcement rib that is coplanar with the stiffener ring on the top surface of the package substrate. At least two compartments are defined by the stiffener ring and the reinforcement rib. At least two individual chip packages are mounted on chip mounting regions within the at least two compartments, respectively, thereby constituting a package array on the package substrate.

Abstract: An electronic card and a detecting method are provided. The electronic card includes a connector. The detecting method detects whether an output signal from a host is received by Pin 41, Pin 43, Pin 47 and Pin 49 of the connector, or Pin 29, Pin 31, Pin 35 and Pin 37 of the connector, or Pin 17, Pin 19, Pin 23 and Pin 25 of the connector, or Pin 5, Pin 7, 11 and Pin 13 of the connector. According to the detecting result and the output signal, the electronic card judges the communication protocol of the host is a SATA communication protocol, a PCIe communication protocol or a USB3.0 communication protocol.

Abstract: A semiconductor package includes a package substrate having a top surface and a bottom surface, an interposer mounted on the top surface of the package substrate, a first semiconductor die and a second semiconductor die mounted on the interposer in a side-by-side manner, and a stiffener ring secured to the top surface of the package substrate. The stiffener ring encircles the first semiconductor die and the second semiconductor die. The stiffener ring comprises a reinforcement rib striding across the interposer.

Abstract: The surface temperature of a portable device is estimated. A sensor detects the internal temperature of the portable device. The internal temperature and an ambient temperature are used as input to a circuit model that describes thermal behaviors of the portable device. Dynamic thermal management may be performed based on the estimated surface temperature.

Abstract: A method for threshing and pneumatic separation of tobacco leaves, including: 1) transporting a mixture of the tobacco slices and stems from a primary threshing set into primary pneumatic separation unit for sorting out tobacco slices, and transporting a remaining mixture into a secondary threshing set; 2) transporting the mixture from the secondary threshing set into a secondary pneumatic separation unit for sorting out the tobacco slices and qualified stems, and transferring a remaining mixture to a tertiary threshing set; 3) transporting the mixture from the tertiary threshing set into a tertiary pneumatic separation unit for sorting out the tobacco slices and the qualified stems, and transferring a remaining mixture into a quaternary threshing set; 4) transporting the mixture from the quaternary threshing set into a quaternary pneumatic separation unit for sorting out the tobacco slices and the qualified stems, and returning a remaining mixture to the quaternary threshing set.

Abstract: An electronic card and a detecting method are provided. The electronic card includes a connector. The detecting method detects whether an output signal from a host is received by Pin 41, Pin 43, Pin 47 and Pin 49 of the connector, or Pin 29, Pin 31, Pin 35 and Pin 37 of the connector, or Pin 17, Pin 19, Pin 23 and Pin 25 of the connector, or Pin 5, Pin 7, 11 and Pin 13 of the connector. According to the detecting result and the output signal, the electronic card judges the communication protocol of the host is a SATA communication protocol, a PCIe communication protocol or a USB3.0 communication protocol.

Abstract: A USB-shaped connector, a data transmission device and a data storage device are provided. The connector has the appearance of a USB 3.0 Type-A connector. The pins of the connector can support various transmission protocols such as a SATA transmission protocol, a PCIe transmission protocol or a USB transmission protocol. The data transmission device determines the transmission protocol according to the result of detecting the pin definitions of the corresponding male connector. Consequently, the utilization flexibility of the data transmission device is enhanced.

Abstract: A camera array apparatus including a plurality of cameras and a light deflection module is provided. The cameras are arranged in an array. The light deflection module is disposed on the cameras. The light deflection module includes at least one prism set. The prism set has a plurality of prisms. The prism set is configured to deflect a light entering obliquely with respect to an optical axis of the cameras to at least a portion of the cameras. The angle between the optical axis and the deflected light is smaller than the angle between the optical axis and the light before being deflected.

Abstract: A head-mounted display having a first light incident region and a first light emitting region is provided. The head-mounted display includes a first light-guide plate, a first micro-display, a first reflector, a first collimating lens and a first filling structure. A first inner surface of the first light-guide plate has plural first hollow microstructures located in the first light emitting region. The first micro-display is located in the first light incident region and faces the first inner surface. The first reflector is located in the first light incident region, obliquely disposed at the first light-guide plate and faces the first micro-display. The first collimating lens is disposed between the first reflector and the first micro-display. The first filling structure fills in the first hollow microstructures, wherein a refractive index of the first filling structure is greater than a refractive index of the first light-guide plate.

Abstract: A prism group including a first, a second, and a third prisms is provided. The first prism has a first light incidence surface, a first light emitting surface, and a first connecting surface. The second prism has a second light incidence surface, a second light emitting surface, and a second connecting surface. The second light incidence surface is located between the first light emitting surface and the second light emitting surface. A first air gap is between the second light incidence surface and the first light emitting surface. The third prism has a third light incidence surface, a third light emitting surface, and a third connecting surface. The third light incidence surface is located between the second light emitting surface and the third light emitting surface. A second air gap is between the third light incidence surface and the second light emitting surface. A projection apparatus is also provided.

Abstract: A camera array apparatus including a plurality of cameras and a light deflection module is provided. The cameras are arranged in an array. The light deflection module is disposed on the cameras. The light deflection module includes at least one prism set. The prism set has a plurality of prisms. The prism set is configured to deflect a light entering obliquely with respect to an optical axis of the cameras to at least a portion of the cameras. The angle between the optical axis and the deflected light is smaller than the angle between the optical axis and the light before being deflected.

Abstract: A light guide plate including a first substrate, a second substrate opposite to the first substrate, a plurality of first microstructures, a plurality of second microstructures, and a plurality of third microstructures is provided. The first substrate has a light emitting surface, a first bottom surface, and a light incidence surface. The second substrate has a top surface and a second bottom surface. The top surface is located between the first substrate and the second bottom surface. The first microstructures and the second microstructures are disposed on the light emitting surface and the second bottom surface respectively and extend along a first direction parallel to the light incidence surface respectively. The third microstructures are connected between the first bottom surface and the top surface and extend along a second direction perpendicular to the light incidence surface respectively. A light source module is also provided.

Abstract: A prism group including a first, a second, and a third prisms is provided. The first prism has a first light incidence surface, a first light emitting surface, and a first connecting surface. The second prism has a second light incidence surface, a second light emitting surface, and a second connecting surface. The second light incidence surface is located between the first light emitting surface and the second light emitting surface. A first air gap is between the second light incidence surface and the first light emitting surface. The third prism has a third light incidence surface, a third light emitting surface, and a third connecting surface. The third light incidence surface is located between the second light emitting surface and the third light emitting surface. A second air gap is between the third light incidence surface and the second light emitting surface. A projection apparatus is also provided.

Abstract: A head-mounted display having a first light incident region and a first light emitting region is provided. The head-mounted display includes a first light-guide plate, a first micro-display, a first reflector, a first collimating lens and a first filling structure. A first inner surface of the first light-guide plate has plural first hollow microstructures located in the first light emitting region. The first micro-display is located in the first light incident region and faces the first inner surface. The first reflector is located in the first light incident region, obliquely disposed at the first light-guide plate and faces the first micro-display. The first collimating lens is disposed between the first reflector and the first micro-display. The first filling structure fills in the first hollow microstructures, wherein a refractive index of the first filling structure is greater than a refractive index of the first light-guide plate.

Abstract: A quasi-crystal organic light-emitting display panel including a first electrode layer, an organic light-emitting layer, a second electrode layer, a buffer layer, a 10-fold quasi-crystal layer and a package cover is provided. The organic light-emitting layer is located on the first electrode layer. The second electrode layer is located on the organic light-emitting layer. The buffer layer is located on the second electrode layer. The 10-fold quasi-crystal layer is located on the buffer layer. The package cover is located on the 10-fold quasi-crystal layer. A method for simulating optical efficiency of the quasi-crystal organic light-emitting display panel is also provided.

Abstract: An integrated gate driver circuit includes a control circuit, a plurality of drive stages and a plurality of discharge transistors. The control circuit is configured to output a plurality of clock signals within a frame period and to output a discharge enabling signal within a blanking period of the frame period. Each of the drive stages receives the clock signals and includes an output terminal configured to output a gate driving signal. Each of the discharge transistors is coupled to the output terminal of one of the drive stages and discharges the output terminal according to the discharge enabling signal thereby eliminating the voltage fluctuation of the output terminal in the blanking period.

Abstract: A secondary optical element including a light incidence surface, a light emitting surface, and a connecting surface is provided. The light incidence surface includes a first and a second light incidence surfaces. The first light incidence surface is a curved surface recessed toward the light emitting surface. The light emitting surface is opposite to the light incidence surface and includes a first and a second light emitting surfaces. The first light emitting surface is a free-form surface recessed toward the light incidence surface or a flat surface. The second light emitting surface is a free-form surface. A diameter of the second light emitting surface is larger than a diameter of the second light incidence surface, and the connecting surface is connected between the second light incidence surface and the second light emitting surface. A light source module is also provided.

Abstract: A computer system and a method for adaptive thermal resistance-capacitance (RC) network analysis of a semiconductor device for use in a portable device are provided. The method includes the steps of: receiving a device input file and a plurality of specific effective heat transfer coefficients (HTCs) associated with the portable device; repeatedly performing a thermal analysis of the portable device based on the device input file and a current effective HTC to estimate a target die temperature of the semiconductor device; calculating a target effective HTC based on the device input file and the target die temperature; and updating the current effective HTC with the target effective HTC; and generating an output file recording the target die temperature of the semiconductor device.

Abstract: An air discharge structure for a packaged air conditioner includes a front air outlet (7) disposed on the mid-upper part of a body (1), and an upper panel (9) mounted on the front air outlet (7) and slidable up and down along the body (1). An upper decorative panel (10), height of which is matched with the stroke of the upper panel (9), is mounted above the front air outlet (7) and slidable back and forth along the body (1). An upper and lower limit mechanism for the upper decorative panel is disposed between the upper decorative panel (10) and the body (1). The application can facilitate increasing the range of air supply in the air conditioner and maintain stable air supply.