Abstract: A semiconductor structure includes a substrate having a first device region and a second device region in proximity to the first device region. A trench isolation structure is disposed in the substrate between the first device region and the second device region. The trench isolation structure includes a first bottom surface within the first device region and a second bottom surface within the second device region. The first bottom surface is coplanar with the second bottom surface.

Abstract: A semiconductor device includes a plurality of active area structures extending in parallel, first and second dummy gate layers spanning the plurality of active area structures, a first active device including first portions of the plurality of active area structures between the first and second dummy gate layers, a metal layer spanning the plurality of active area structures between the first and second dummy gate layers, and a pair of vias positioned at opposite ends of the metal layer. A first via of the pair of vias is configured to be electrically connected to ground, and a second via of the pair of vias is configured to be electrically connected to a current source and a circuit configured to measure a voltage at the node.

Abstract: A method of using a quantum random number generator, QRNG, for security applications, a system for security applications, and a user device for a system for security applications. The method comprises the steps of generating one or more quantum keys using the QRNG; storing, using a secure network, corresponding sets of the quantum keys in a server located at a controlled access location and in a quantum key token, QKT, for a user, respectively; and using the corresponding sets of quantum keys for secure transmission between the server and a user device comprising the QKT when outside the secure network or for access control to the controlled access location.

Abstract: A pressure sensitive adhesive composition and a protective film employing the same are provided. The pressure sensitive adhesive composition includes 30-45 parts by weight of a tackifier and 55-70 parts by weight of a polymer. The polymer includes at least one block copolymer. The block copolymer includes a vinyl aromatic block polymerized by a vinyl aromatic monomer and a conjugated diene block polymerized by a conjugated diene monomer. The block copolymer meets one of the following conditions: (1) the content of the vinyl aromatic monomer is from 15 wt % to 25 wt % and the content of the vinyl group of the conjugated diene block is less than or equal to 45 wt % or, (2) the content of the vinyl aromatic monomer is from 10 wt % to 15 wt % and the content of the vinyl group of the conjugated diene block is less than or equal to 45 wt %, or greater than or equal to 60 wt %.

Abstract: A mask frame, comprises a central conduit connection aperture and lateral arms having a 3-D curvature. The lateral arms extend: outwardly from a center of the frame, rearwardly, towards the patients ears, and upwardly, along a vector passing from below the nose to a point between the temple the top of the ear. The lateral arms “twist” along their length, such that a bottom margin of an end of each lateral arm is positioned further away from a notional vertical plane passing through the centre of the conduit connection aperture than a top margin. Also provided is an anti-rotation feature which limits or prevents rotation between straps of a headgear, and the mask frame. Further provided is a buckle for a closed loop headgear the buckle being formed with a plurality of openings and posts configured to form an angled headgear strap path through the buckle through which part of a headgear strap loop can pass.

Abstract: Disclosed herein is a method for aramid polymerization using carbon dioxide as a solvent, comprising reacting phenylenediamine with benzenedicarbonyl dichloride, wherein an acid-binding agent is added to the reaction system, and liquid carbon dioxide and/or a supercritical carbon dioxide fluid is used as a reaction solvent. The method of the present application is environmentally friendly, saves resources, has low cost, and is safe for production and suitable for industrial production. The polycondensate obtained in the present application has a controllable molecular weight, a good product quality, and an intrinsic viscosity ?inh of 8-9 dl/g. The yield in the aramid condensation stage can reach 98%, and the recovery rate of the aramid condensation solvent is higher than 90%.

Abstract: The present disclosure relates to the preparation of synthetic cannabinol and homologs thereof having the structure of Formula (I), wherein, n is 1, 2, 3 or 4. The methods described herein provide for high yields and purity in a one-pot synthesis or high yields and purity without the need for lengthy column chromatography. The present disclosure also relates to solid forms of cannabinol.

Abstract: A camera driving module includes: a base including a central opening; a casing disposed on the base and including an opening hole corresponding to the central opening; a lens unit movably disposed on the casing; and a focus driving part. The focus driving part includes a carrier, an AF coil element, at least two permanent magnets and a Hall element. The carrier is disposed on the lens unit and movable in a direction parallel to an optical axis. The AF coil element is fixed to the base and faces toward the carrier. The permanent magnets are fixed on one side of the carrier facing toward the base and disposed opposite to each other about the optical axis. The Hall element faces toward a corresponding surface of one of the permanent magnets. The AF coil element and the corresponding surfaces are arranged in the direction parallel to the optical axis.

Abstract: A via opening including an etch stop layer (ESL) opening and methods of forming the same are provided which can be used in the back end of line (BEOL) process of IC fabrication. A metal feature is provided with a first part within a dielectric layer and with a top surface. An ESL is formed with a bottom surface of the ESL above and in contact with the dielectric layer, and a top surface of the ESL above the bottom surface of the ESL. An opening at the ESL is formed exposing the top surface of the metal feature; wherein the opening at the ESL has a bottom edge of the opening above the bottom surface of the ESL, a first sidewall of the opening at a first side of the metal feature, and a second sidewall of the opening at a second side of the metal feature.

Abstract: A semiconductor structure includes first and second inner seal rings each having a first section and a second section substantially perpendicular to the first section. The semiconductor structure further includes an outer seal ring. The outer seal ring has a third section, and a fourth section, and a fifth section. The semiconductor structure further includes dummy patterns substantially uniformly distributed in each of regions between the first inner seal ring and the outer seal ring and between the second inner seal ring and the outer seal ring.

Abstract: A stereoscopic image generating method is provided. The method includes: processing a first image to obtain depth data of each pixel in the first image, and generating a first depth-information map, wherein the first depth-information map includes depth information corresponding to each pixel; performing uniform processing on a plurality of edge pixels which are within a predetermined width from a plurality of edges of the first depth-information map, so that the processed edge pixels have the same depth information to establish a second depth-information map; setting a pixel offset corresponding to each pixel in the first image based on the depth information corresponding to each pixel of the second depth-information map; performing pixel offset processing on the first image to generate a second image; and outputting the first image and the second image to the display unit to display a stereoscopic image.

Abstract: The present disclosure provides an audio compression device, an audio compressing system and an audio compression method. The audio compression device comprises a first transceiver and a first processor. The first transceiver is connected to the first processor. The processor obtains an audio signal and an available bandwidth, and the processor performs an audio compression encoding on the audio signal to obtain a sample audio signal, and then compares with the audio signal and the sample audio signal to generate a residual signal, and the residual signal is transmitted according to the available bandwidth. The audio signal can be completely transmitted to an audio decompression device to reduce the distortion of the audio signal.

Abstract: A method includes a computer receiving a request to conduct an interaction from a mobile device. The computer obtains a computer address and provides the computer address to the mobile device. The mobile device provides an access request to the computer address, and the access request is thereafter routed to an identity provider computer. The identity provider computer identifies identity data associated with the mobile device or a user of the mobile device. The computer obtains the identity data or a derivative of the identity data from the identity provider computer. The computer determines if the identity data or the derivative of the identity data matches previously stored identity data or a previously stored derivative of identity data. If a match is determined, the computer provides a list of user device identifiers to the mobile device.

Abstract: A heat dissipating module includes a casing including a bottom plate and a water inlet; a cover plate disposed on one side of the casing opposite to the bottom plate; a pressurizing device moving back and forth in the casing and having a maximum stroke; a water pump disposed between the bottom plate and the pressurizing device, where liquid fills a space between the water pump and the pressurizing device to define a water tank; and a stop valve disposed in the water tank and located between the pressurizing device and the water pump. According to a direction from the bottom plate to the cover plate, the height of the water inlet is lower than the stop valve. The heat dissipating module has a small volume and is configured to flip at multiple angles. A projection device including the heat dissipating module and having structural reliability is also provided.

Abstract: The present invention disclosures a memory array structure, comprising an array composed of multiple memory devices arranged in rows and columns, each of the rows is set with a row leading-out wire, and each of the columns is set with a column leading-out wire, memory devices are correspondingly positioned at intersection points of each row leading-out wire and each column leading-out wire; wherein, the first terminal of each of the memory devices is individually connected to the row leading-out wire of the same row, and the second terminal of each of the memory devices is connected to a first terminal of a switch in the same column, the second terminal of the switch is connected to the column leading-out wire of the same column; wherein, each of the rows is set with one to multiple the switches, and the first terminal of each of the switches is connected to one to all of the second terminals of the memory devices in the same column.

Abstract: The optical film includes a main body and an optical structure. The optical structure protrudes from a surface of the main body. The optical structure includes a first side surface and a second side surface. A first connecting line and a first angle less than 90 degrees are formed between the first side surface and the surface of the main body. A second connecting line and a second angle less than 90 degrees are formed between the second side surface and the surface of the main body. When viewed from a normal vector of the surface of the main body, a third angle is formed between an extension line of the first connecting line and an extension line of the second connecting line, and the third angle is greater than 0 degree and less than 90 degrees.