Abstract: Disclosed is a multi-quantum well structure including a stress relief layer, an electron-collecting layer disposed on the stress relief layer, and an active layer including a first active layer unit that is disposed on the electron-collecting layer. The first active layer unit includes potential barrier sub-layers and potential well sub-lavers being alternately stacked, in which at least one of the potential barrier sub-layers has a GaN/Alx1Iny1Ga(1-x1-y1)N stack, where 0<x1?1 and 0?y1<1. An LED device including the multi-quantum well structure is also disclosed.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first substrate and a second substrate. The first substrate has a first surface and a second surface opposite to the first surface of the first substrate. The second substrate has a first surface facing the first substrate and a second surface opposite to the first surface of the second substrate. The semiconductor device package also includes a first electronic component disposed on the first surface of the second substrate and electrically connected to the first surface of the second substrate. The semiconductor device package also includes a first encapsulant and a second encapsulant between the first substrate and the second substrate. The first encapsulant is different from the second encapsulant. A method of manufacturing a semiconductor device package is also disclosed.

Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a package body and a shield. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a cavity from the second surface extending into the substrate. The first electronic component is disposed on the first surface of the substrate. The second electronic component is disposed within the cavity of the substrate. The package body is disposed on a portion of the first surface of the substrate and covers the first electronic component. The shield is disposed on external surfaces of the package body.

Abstract: Disclosed is a multi-quantum well structure including a stress relief layer, an electron-collecting layer disposed on the stress relief layer, and an active layer including a first active layer unit that is disposed on the electron-collecting layer. The first active layer unit includes potential barrier sub-layers and potential well sub-layers being alternately stacked, in which at least one of the potential barrier sub-layers has a GaN/Alx1Iny1Ga(1-x1-y1)N/GaN stack, where 0<x1?1 and 0?y1<1, and for the remainder of the potential barrier sub-layers, each of the potential barrier sub-layers is a GaN layer. An LED device including the multi-quantum well structure is also disclosed.

Abstract: A semiconductor device package includes a first carrier, a first electronic component, a second electronic component, a second carrier and an electrical connection structure. The first carrier has a first surface and a second surface opposite to the first surface. The first electronic component is disposed on the first surface of the first carrier. The second electronic component is disposed on the second surface of the first carrier. The second carrier has a first surface facing the second surface of the first carrier and a second surface opposite to the first surface. The electrical connection structure is electrically connecting the first carrier with the second carrier.

Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a package body and a shield. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a cavity from the second surface extending into the substrate. The first electronic component is disposed on the first surface of the substrate. The second electronic component is disposed within the cavity of the substrate. The package body is disposed on a portion of the first surface of the substrate and covers the first electronic component. The shield is disposed on external surfaces of the package body.

Abstract: A semiconductor device package includes a first carrier, a first electronic component, a second electronic component, a second carrier and an electrical connection structure. The first carrier has a first surface and a second surface opposite to the first surface. The first electronic component is disposed on the first surface of the first carrier. The second electronic component is disposed on the second surface of the first carrier. The second carrier has a first surface facing the second surface of the first carrier and a second surface opposite to the first surface.

Abstract: Systems and methods for a hack-proof security keyboard are described. In some embodiments, a keyboard module may include a first circuit configured to detect activation of a plurality of keys and a second circuit configured to detect activation of a subset of the plurality of keys, where the second circuit overlies the first circuit. In other embodiments, a method may include detecting an electrical signal received from a secondary membrane of a keyboard, where the keyboard includes a primary membrane configured to detect individual activation of any of a plurality of keys, and where the secondary membrane is configured to output the electrical signal in response to concurrent activation of a subset of the plurality of keys. The method may also include performing a selected action in response to the detection.

Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a package body and a shield. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a cavity from the second surface extending into the substrate. The first electronic component is disposed on the first surface of the substrate. The second electronic component is disposed within the cavity of the substrate. The package body is disposed on a portion of the first surface of the substrate and covers the first electronic component. The shield is disposed on external surfaces of the package body.

Abstract: An information handling system keyboard includes a backlight that illuminates keys by transmitting light from a light source through a light guide under the keys and reflects the light towards the keys with a reflector disposed under the light guide. Varied thickness of one or more of the light source, light guide and reflector at an intersection of the light source, light guide and reflector improve the efficiency of light transmission to the keys, thus providing for a thinner light guide and/or reduced illumination to have a given key illumination.

Abstract: Disclosed is a multi-quantum well structure including a stress relief layer, an electron-collecting layer disposed on the stress relief layer, and an active layer including a first active layer unit that is disposed on the electron-collecting layer. The first active layer unit includes potential barrier sub-layers and potential well sub-layers being alternately stacked, in which at least one of the potential barrier sub-layers has a GaN/Alx1Iny1Ga(1-x1-y1)N/GaN stack, where 0<x1?1 and 0?y1<1, and for the remainder of the potential barrier sub-layers, each of the potential barrier sub-layers is a GaN layer. An LED device including the multi-quantum well structure is also disclosed.

Abstract: Systems and methods for a hack-proof security keyboard are described. In some embodiments, a keyboard module may include a first circuit configured to detect activation of a plurality of keys and a second circuit configured to detect activation of a subset of the plurality of keys, where the second circuit overlies the first circuit. In other embodiments, a method may include detecting an electrical signal received from a secondary membrane of a keyboard, where the keyboard includes a primary membrane configured to detect individual activation of any of a plurality of keys, and where the secondary membrane is configured to output the electrical signal in response to concurrent activation of a subset of the plurality of keys. The method may also include performing a selected action in response to the detection.

Abstract: Systems and methods are disclosed for transitioning a magnetic keyboard between retracted and extended states using a retractable keyboard hinge structure. An information handling system may include a housing having a first housing portion and a second housing portion rotatably coupled by the retractable keyboard hinge structure. The first housing portion may include a magnetic keyboard, and a sliding plate including a plurality of magnets that may be disposed underneath the magnetic keyboard. The retractable keyboard hinge structure may include a first hinge and a first cam. The first hinge and the first cam, when the first housing portion is rotated in relation to the second housing portion, may cause the sliding plate to move in a first linear direction. In response to the sliding plate moving, the plurality of magnets may cause the magnetic keyboard to move in a second linear direction perpendicular to the first linear direction.

Abstract: Systems and methods for a keyboard backlight module are described. In some embodiments, a keyboard backlight module may include: a Light Guide Plate (LGP), a reflector coupled to the LGP, and a light bar at least partially sandwiched between the LGP and the reflector.

Abstract: A portable information handling system keyboard retracts from an extended position to a retracted position, the retracted position bring the keys into the portable information handling system housing to provide a compressed closed position of the housing. The keyboard keys are biased to the extended position with a metal dome that interacts with a scissor support structure.

Abstract: A nitride light emitting diode includes a substrate and a nitride buffer layer, an n-type layer, a quantum well light emitting layer, and a p-type layer over the substrate. The n-type layer is a superlattice structure formed by alternating undoped AlGaN layers and n-type doped GaN layers. The Al component of the undoped AlGaN layer is controlled to produce first stress that offsets the second stress produced by the n-type doped GaN layer, reducing crystal defects and wrapping caused by impurity doping of the n-type layer. Growth temperature and pressure of the n-type layer are controlled such that thickness of the n-type doped GaN layer is greater than that of the undoped AlGaN layer to improve surface roughness of the undoped AlGaN layer and form an n-type doped GaN layer with a flat surface. Series resistance, crystal defects and wrapping, and optoelectronic properties of the device are therefore improved.

Abstract: A portable information handling system keyboard retracts from an extended position to a retracted position, the retracted position bring the keys into the portable information handling system housing to provide a compressed closed position of the housing. The keyboard keys are biased to the extended position with a metal dome that interacts with a scissor support structure.

Abstract: A portable information handling system keyboard retracts from an extended position to a retracted position, the retracted position bring the keys into the portable information handling system housing to provide a compressed closed position of the housing. The keyboard keys are biased to the extended position with a metal dome that interacts with a scissor support structure.

Abstract: A portable information handling system keyboard retracts from an extended position to a retracted position, the retracted position bring the keys into the portable information handling system housing to provide a compressed closed position of the housing. The keyboard keys are biased to the extended position with a metal dome that interacts with a scissor support structure.

Abstract: A portable information handling system keyboard rests on a support surface of a housing with securing actions taken from above the housing, such as by screws that insert through the keyboard and then into the housing. A lattice cover having key openings fits over the keyboard to align adapters of its bottom surface with posts extending from the support surface through openings formed in the keyboard. The adapters snap to the posts to couple the cover against the keyboard so that the cover bottom surface presses the keyboard against the information handling systems upper support surface.