Abstract: A portable information handling system keyboard rests on a support surface of a housing with securing actions taken from above the housing, such as by screws that insert through the keyboard and then into the housing. A lattice cover having key openings fits over the keyboard to align adapters of its bottom surface with posts extending from the support surface through openings formed in the keyboard. The adapters snap to the posts to couple the cover against the keyboard so that the cover bottom surface presses the keyboard against the information handling systems upper support surface.

Abstract: The present invention relates to a semiconductor package, comprising a carrier, a semiconductor device, a first wire and a second wire. The carrier has a first electrically connecting portion and a second electrically connecting portion. The semiconductor device has a plurality of pads. The first wire electrically connects one of the pads of the semiconductor device and the first electrically connecting portion of the carrier, and the first wire has a first length. The second wire electrically connects one of the pads of the semiconductor device and the second electrically connecting portion of the carrier, and the second wire has a second length. The second length is larger than the first length, and the diameter of the second wire is larger than that of the first wire. Thus, the material usage for the wire is reduced, and the manufacturing cost is reduced.

Abstract: In a method of manufacturing a semiconductor package including a wire binding process, a first end of the bonding wire is bonded to a first pad so as to form a first bond portion. A second end of the bonding wire is bonded to a second pad, wherein an interface surface between the bonding wire and the second pad has a first connecting area. The bonded second end of the bonding wire is scrubbed so as to form a second bond portion, wherein a new interface surface between the bonding wire and the second pad has a second connecting area larger than the first connecting area. A remainder of the bonding wire is separated from the second bond portion.

Abstract: Support foot apparatus that include a support foot structure that employs flexible flap members disposed on opposing sides of a central foot member, and that are configured for insertion into corresponding openings of a support foot location defined in an exterior surface of the chassis of an information handling system or other device or structure. Each of the flexible flap members may be provided with one or more securing apertures configured for placement over corresponding securing posts provided on an interior surface of the chassis to secure the flexible flap members of the support foot apparatus within the interior of the chassis at a support foot location to hold the central support body against an exterior surface of the chassis.

Abstract: Support foot apparatus that include a support foot structure that employs flexible flap members disposed on opposing sides of a central foot member, and that are configured for insertion into corresponding openings of a support foot location defined in an exterior surface of the chassis of an information handling system or other device or structure. Each of the flexible flap members may be provided with one or more securing apertures configured for placement over corresponding securing posts provided on an interior surface of the chassis to secure the flexible flap members of the support foot apparatus within the interior of the chassis at a support foot location to hold the central support body against an exterior surface of the chassis.

Abstract: The present invention relates to a semiconductor package, comprising a carrier, a semiconductor device, a first wire and a second wire. The carrier has a first electrically connecting portion and a second electrically connecting portion. The semiconductor device has a plurality of pads. The first wire electrically connects one of the pads of the semiconductor device and the first electrically connecting portion of the carrier, and the first wire has a first length. The second wire electrically connects one of the pads of the semiconductor device and the second electrically connecting portion of the carrier, and the second wire has a second length. The second length is larger than the first length, and the diameter of the second wire is larger than that of the first wire. Thus, the material usage for the wire is reduced, and the manufacturing cost is reduced.

Abstract: In a method of manufacturing a semiconductor package including a wire binding process, a first end of the bonding wire is bonded to a first pad so as to form a first bond portion. A second end of the bonding wire is bonded to a second pad, wherein an interface surface between the bonding wire and the second pad has a first connecting area. The bonded second end of the bonding wire is scrubbed so as to form a second bond portion, wherein a new interface surface between the bonding wire and the second pad has a second connecting area larger than the first connecting area. A remainder of the bonding wire is separated from the second bond portion.

Abstract: In a method of manufacturing a semiconductor package, a chip is disposed on a carrier. An inert gas is run around one end of a line portion of a copper bonding wire while the end is being formed into a spherical portion. The spherical portion is bonded to a pad of the chip. The chip and the copper bonding wire are sealed and the carrier is covered by a molding compound.

Abstract: A stacked semiconductor package, includes a carrier, a first semiconductor device, a second semiconductor device, a plurality of first wires and a plurality of second wires. The carrier has a plurality of electrically connecting portions. The first semiconductor device has a plurality of first pads. The second semiconductor device has a plurality of second pads. The second semiconductor device is disposed on the first semiconductor device. The first wires electrically connect the first pads of the first semiconductor device and the electrically connecting portions of the carrier, and the second wires electrically connect the second pads of the second semiconductor device and the electrically connecting portions of the carrier. The diameters of the second wires are larger than those of the first wires. Thus, the material of the wires is reduced, and the manufacturing cost is reduced.

Abstract: The present invention relates to a semiconductor package, comprising a carrier, a semiconductor device, a first wire and a second wire. The carrier has a first electrically connecting portion and a second electrically connecting portion. The semiconductor device has a plurality of pads. The first wire electrically connects one of the pads of the semiconductor device and the first electrically connecting portion of the carrier, and the first wire has a first length. The second wire electrically connects one of the pads of the semiconductor device and the second electrically connecting portion of the carrier, and the second wire has a second length. The second length is larger than the first length, and the diameter of the second wire is larger than that of the first wire. Thus, the material usage for the wire is reduced, and the manufacturing cost is reduced.

Abstract: The present invention relates to a stacked semiconductor package, comprising a carrier, a first semiconductor device, a second semiconductor device, a plurality of first wires and a plurality of second wires. The carrier has a plurality of electrically connecting portions. The first semiconductor device has a plurality of first pads. The second semiconductor device has a plurality of second pads. The second semiconductor device is disposed on the first semiconductor device. The first wires electrically connect the first pads of the first semiconductor device and the electrically connecting portions of the carrier, and the second wires electrically connect the second pads of the second semiconductor device and the electrically connecting portions of the carrier. The diameters of the second wires are larger than those of the first wires. Thus, the material of the wires is reduced, and the manufacturing cost is reduced.

Abstract: A method and apparatus thereof for flashing a BIOS of a data processing system remotely are provided. A BIOS flash instruction is given remotely from a remote console, transmitted to a microprocessor and a corresponding storage media of the data processing system via network, where the microprocessor is irresponsible for operating system. A BIOS image file is identified correct before performing BIOS of a system microprocessor that is responsible for operating system, where the system microprocessor is usually CPU. BIOS is remotely flashed with this method and apparatus, and since flash operation is performed independently of the operating system of the data processing system, BIOS re-flash can be performed and data processing system can be rebooted even when flash operation is failed or operating system is disable.

Abstract: A method and apparatus thereof for flashing a BIOS of a data processing system remotely are provided. A BIOS flash instruction is given remotely from a remote console, transmitted to a microprocessor and a corresponding storage media of the data processing system via network, where the microprocessor is irresponsible for operating system. A BIOS image file is identified correct before performing BIOS of a system microprocessor that is responsible for operating system, where the system microprocessor is usually CPU. BIOS is remotely flashed with this method and apparatus, and since flash operation is performed independently of the operating system of the data processing system, BIOS re-flash can be performed and data processing system can be rebooted even when flash operation is failed or operating system is disable.

Abstract: A multi-chip package structure including a carrier, a first chip having an active surface and a rear surface, multiple bumps, a second chip, multiple first bonding wires, a package unit disposed above the first chip, a spacer disposed between the package unit and the first chip, multiple second bonding wires, and an encapsulant is provided. The bumps are disposed between the active surface and the carrier to electrically connect the first chip and the carrier. The second chip is disposed on the rear surface of the first chip. The first bonding wires electrically connect the second chip and the carrier. The second bonding wires electrically connect the package unit and the carrier. The encapsulant is disposed on the carrier to encapsulate the first chip, the second chip, at least a portion of the package unit, the bumps, the spacer, the first bonding wires and the second bonding wires.

Abstract: The package module comprising a first substrate, a first package, a second package and a molding compound. The first substrate has a first surface. The first package comprises a first chip and a liquid encapsulating compound. The first chip is disposed on the first substrate and electrically connected to the first substrate by a first gold wire. The liquid encapsulating compound encloses a second surface of the first chip and part of the first gold wire. A surface of the liquid encapsulating compound provides a platform. The molding compound encloses at least partial first surface of the first substrate, the first package and the second package.

Abstract: A method and apparatus thereof for flashing a BIOS of a data processing system remotely are provided. A BIOS flash instruction is given remotely from a remote console, transmitted to a microprocessor and a corresponding storage media of the data processing system via network, where the microprocessor is irresponsible for operating system. A BIOS image file is identified correct before performing BIOS of a system microprocessor that is responsible for operating system, where the system microprocessor is usually CPU. BIOS is remotely flashed with this method and apparatus, and since flash operation is performed independently of the operating system of the data processing system, BIOS re-flash can be performed and data processing system can be rebooted even when flash operation is failed or operating system is disable.

Abstract: A bump structure on a contact pad and a fabricating process thereof. The bump comprises an under-ball-metallurgy layer, a bonding mass and a welding lump. The under-ball-metallurgy layer is formed over the contact pad and the bonding mass is formed over the under-ball-metallurgy layer by conducting a pressure bonding process. The bonding mass having a thickness between 4 to 10 ?m is made from a material such as copper. The welding lump is formed over the bonding mass such that a sidewall of the bonding mass is also enclosed.

Abstract: A bump structure on a contact pad and a fabricating process thereof. The bump comprises an under-ball-metallurgy layer, a bonding mass and a welding lump. The under-ball-metallurgy layer is formed over the contact pad and the bonding mass is formed over the under-ball-metallurgy layer by conducting a pressure bonding process. The bonding mass having a thickness between 4 to 10 ?m is made from a material such as copper. The welding lump is formed over the bonding mass such that a sidewall of the bonding mass is also enclosed.

Abstract: The present invention relates to a foldable keyboard comprising a left base plate, a right base plate, and a link shaft. Each of the base plates has a side pivotally connecting to the link shaft, enabling the base plates to expand and fold. The invention is characterized in that a first keypad secured on the left base plate; a second keypad glidingly mounted on the right base plate, and at least a linkage mechanism with a first pivot joint, a second pivot joint, and a third pivot joint; whereby the first, second, and third pivot joints are pivotally connected to the left base plate, the link shaft, and the second keypad respectively, allowing the linkage mechanism to pull the second keypad close to the first keypad when the left and right base plates are expanded horizontally; and when the left and right base plates are folded, the linkage mechanism pushes the second keypad away from the first keypad.

Abstract: A bump structure on a contact pad and a fabricating process thereof. The bump comprises an under-ball-metallurgy layer, a bonding mass and a welding lump. The under-ball-metallurgy layer is formed over the contact pad and the bonding mass is formed over the under-ball-metallurgy layer by conducting a pressure bonding process. The bonding mass having a thickness between 4 to 10 &mgr;m is made from a material such as copper. The welding lump is formed over the bonding mass such that a sidewall of the bonding mass is also enclosed.