Patents by Inventor Wen Su
Wen Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20110175774Abstract: A built-in FM transmitting antenna applied to a mobile device, includes a substrate unit, a first antenna unit, a conducting unit and a second antenna unit. The substrate unit has a circuit substrate, at least one grounding layer disposed on the circuit substrate, and a plurality of conducting pads disposed on the circuit substrate. The first antenna unit is disposed above the substrate unit and substantially parallel to the substrate unit. The conducting unit is electrically connected between the substrate unit and the first antenna unit. The second antenna unit is directly disposed on the edge of the top surface of the circuit substrate. The second antenna unit has two ends electrically connected between two of the conducting pads, respectively. The two ends of the second antenna unit are electrically connected to an FM chip module and the conducting unit through the two of the conducting pads, respectively.Type: ApplicationFiled: March 24, 2010Publication date: July 21, 2011Applicant: LITE-ON TECHNOLOGY CORPORATIONInventors: Saou-Wen Su, Chao-Hsu Chen, Kuo-Wei Yang
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Patent number: 7976758Abstract: A metal shell includes a metal cover and several latching portions disposed on the metal cover. The latching portions are made of plastic material, and integrally formed on the metal cover by an insert molding process. A method for making the metal shell is also described.Type: GrantFiled: June 11, 2009Date of Patent: July 12, 2011Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) LimitedInventors: Che-Yuan Hsu, Cheng-Wen Su, Gang Huang, Yan-Min Wang, Qiang Wang
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Publication number: 20110151810Abstract: A Multiple-Input-Multiple-Output (MIMO) antenna device is adapted for connecting electrically to a radio frequency (RF) circuit for transmitting and receiving RF signals. The MIMO antenna device includes a circuit board, a plurality of antenna units, and a plurality of multiplexer units. The antenna units are disposed on the circuit board proximate to a peripheral edge thereof, are arranged in a loop formation, and are divided into a plurality of groups of the antenna units. Each of the multiplexer units is connected electrically to a respective one of the groups of the antenna units for selecting one of the corresponding antenna units and for connecting electrically the selected one of the corresponding antenna units to the RF circuit, thereby achieving the MIMO technique with the independently and simultaneously operating antenna units.Type: ApplicationFiled: June 1, 2010Publication date: June 23, 2011Applicant: LITE-ON TECHNOLOGY CORP.Inventors: SAOU-WEN SU, LIN-HAN TSAI, CHUAN-HSING CHEN
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Patent number: 7965248Abstract: A dual-feed and dual-band antenna includes a substrate, a grounding unit disposed on the substrate and having two opposite sides, a first radiating unit disposed on the substrate near the first side of the grounding unit, and a second radiating unit disposed on the substrate near the second side. The second radiating unit has a short-circuit strip electrically connected to the grounding unit. The antenna further includes a first coaxial cable electrically connected to the first radiating unit and the grounding unit, and a second coaxial cable electrically connected to the second radiating unit and the grounding unit.Type: GrantFiled: July 10, 2008Date of Patent: June 21, 2011Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-One Technology CorporationInventors: Jui-Hung Chou, Saou-Wen Su
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Patent number: 7956810Abstract: An antenna device includes a first conductive piece, a second conductive piece, a third conductive piece and a feeding point. The second conductive piece is electrically coupled to a predetermined voltage level. The third conductive piece is electrically connected to the first conductive piece and the second conductive piece. The feeding point is located on the first conductive piece.Type: GrantFiled: March 5, 2008Date of Patent: June 7, 2011Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corp.Inventors: Saou-Wen Su, Jui-Hung Chou
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Publication number: 20110102281Abstract: A multi-loop antenna module with wide beamwidth includes a grounding unit and a plurality of first loop units and second loop units. The first loop units are vertically disposed on outer peripheral sides of the grounding unit. Each first loop unit has a first shorting pin disposed on the grounding unit, a first feeding pin separated from the first shorting pin and suspended above the grounding unit, and a first loop radiating body connected between the first shorting pin and the first feeding pin. The second loop units are vertically disposed on outer peripheral sides of the grounding unit. Each second loop unit has a second shorting pin disposed on the grounding unit, a second feeding pin separated from the second shorting pin and suspended above the grounding unit, and a second loop radiating body connected between the second shorting pin and the second feeding pin.Type: ApplicationFiled: May 25, 2010Publication date: May 5, 2011Applicants: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATIONInventor: Saou-Wen SU
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Patent number: 7926983Abstract: An electronic device is provided. The electronic device includes a body member defining a groove, a decorative member may be integrally insert-molded to the body member, a printed circuit board facing the body member and a lamp electrically mounted to the printed circuit board. The lamp is used to illuminate the decorative member.Type: GrantFiled: December 19, 2008Date of Patent: April 19, 2011Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) LimitedInventors: Cheng-Wen Su, Gang Huang, Zhong-Dan Deng, Yin-Jie Guo
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Publication number: 20110074654Abstract: The present invention is related to a shorted monopole antenna. The antenna includes a ground portion, a radiating portion, a shorting portion, an assembling portion, and a coaxial cable. The ground portion includes a signal grounding point. The radiating portion is located above the ground portion and bent at least once, and includes a signal feeding point. One end of the shorting portion is connected to one of the short edges of the ground portion, and the other end is connected to one edge portion of the radiating portion. The assembling portion is connected to the long edge of the ground portion. The coaxial cable includes an inner conductor and an outer conductor, which are connected to the signal feeding point and the signal grounding point respectively. The antenna invented has good impedance bandwidth and radiation characteristics, can easily be installed inside the housing of an electronic device, and is well suitable for applications in wireless communications devices.Type: ApplicationFiled: November 30, 2010Publication date: March 31, 2011Applicants: SILITEK ELECTRONIC (GUANGZHOU) CO, LTD., LITE-ON TECHNOLOGY CORPORATIONInventors: SAOU-WEN SU, JUI-HUNG CHOU
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Publication number: 20110066687Abstract: A system and method automatically rescales an electronic message having one or more associated content. When the electronic message is generated and the associated content connected to the message, an agent of the electronic message application checks predefined settings/configurations of the message client. The sender's e-mail client checks a plurality of conditions, such as, the condition of the network, the type of network, the status or capacity of the receiving inbox of an intended recipient client, and the geographic destination of the message. Based on these dynamic content rescale settings, the sender's client dynamically and optimally rescales the associated content before forwarding the electronic message with the rescaled content to the recipient client. Rescaling of the associated content may be performed by the message exchange server or the recipient client. The recipient client may later request and receive a copy of the associated content without rescaling.Type: ApplicationFiled: September 15, 2009Publication date: March 17, 2011Applicant: International Business Machines CorporationInventors: Danny Yen-Fu Chen, Ta-Wei Lin, Chih-Wen Su, Meng Li Wong
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Publication number: 20110063180Abstract: A dual-loop antenna includes a grounding unit, a shorting unit, a feeding unit, a first loop radiating unit and a second loop radiating unit. The shorting unit has at least one shorting pin disposed on the grounding unit. The feeding unit has at least one feeding pin separated from the shorting pin by a predetermined distance and suspended above the grounding unit at a predetermined distance. The first loop radiating unit is disposed above the grounding unit at a predetermined distance. The first loop radiating unit has two ends respectively electrically connected to the shorting unit and the feeding unit. The second loop radiating unit is disposed above the grounding unit at a predetermined distance and around the first loop radiating unit. The second loop radiating unit has two ends respectively electrically connected to the shorting unit and the feeding unit.Type: ApplicationFiled: January 29, 2010Publication date: March 17, 2011Applicants: (1) SILITEK ELECTRONIC (GUANGZHOU) CO., LTD., (2) LITE-ON TECHNOLOGY CORPORATIONInventor: Saou-Wen SU
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Publication number: 20110039408Abstract: Semiconductor devices and methods for fabricating the same. The devices includes a substrate, a first etch stop layer, a dielectric layer, an opening, and an anti-diffusion layer. The first etch stop layer overlies the substrate. The dielectric layer overlies the first etch stop layer. The opening extends through the dielectric layer and the first etch stop layer, and exposes parts of the substrate. The anti-diffusion layer overlies at least sidewalls of the opening, preventing contamination molecule diffusion from at least the first etch stop layer, wherein the anti-diffusion layer is respectively denser than the first etch stop layer and the dielectric layer.Type: ApplicationFiled: October 27, 2010Publication date: February 17, 2011Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Kuan-Chi Tsai, Chih-Hsun Lin, Sheng-Wen Su, Shaw-Jang Liou
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Patent number: 7889140Abstract: An ultra-wide band (UWB) antenna and a plug-and-play (PnP) device using the same are provided. A dielectric substrate of the PnP device has a ground plane. The UWB antenna includes a radiating metal plate and a feeding portion. The radiating metal plate is in a non-ground region of the dielectric substrate and has at least a slit cut. An opening of the slit cut is at the edge of the radiating metal plate facing the ground plane. The feeding portion is also at the edge of the radiating metal plate facing the ground plate for feeding a signal to the antenna.Type: GrantFiled: July 30, 2007Date of Patent: February 15, 2011Assignees: Lite-On Technology Corporation, National Sun Yat-Sen UniversityInventors: Kin-Lu Wong, Yu-Chan Yang, Wei-Yu Li, Saou-Wen Su, Jui-Hung Chou
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Publication number: 20100309083Abstract: A wideband antenna for receiving digital television signals includes a substrate, a radiating plate, a first radiating element, and a second radiating element. The radiating plate is formed on the substrate and the radiating plate has a first radiating area, a second radiating area and a slit formed between the first and the second radiating areas. The first and the second radiating elements are pivotedly connected to the radiating plate. The first radiating element and the second radiating element are constructed as a dipole antenna structure of the antenna so as to excite a first resonant mode. The radiating plate also acts as a matching circuit thereon so as to excite a second resonant mode. The center frequency of the second resonant mode is shifted toward the center frequency of the first resonant mode with the incorporation of the radiating plate so that the antenna has a wideband characteristic.Type: ApplicationFiled: September 15, 2009Publication date: December 9, 2010Applicants: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATIONInventor: Saou-Wen SU
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Patent number: 7846832Abstract: Semiconductor devices and methods for fabricating the same. The devices includes a substrate, a first etch stop layer, a dielectric layer, an opening, and an anti-diffusion layer. The first etch stop layer overlies the substrate. The dielectric layer overlies the first etch stop layer. The opening extends through the dielectric layer and the first etch stop layer, and exposes parts of the substrate. The anti-diffusion layer overlies at least sidewalls of the opening, preventing contamination molecule diffusion from at least the first etch stop layer, wherein the anti-diffusion layer is respectively denser than the first etch stop layer and the dielectric layer.Type: GrantFiled: July 7, 2005Date of Patent: December 7, 2010Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Kuan-Chi Tsai, Chih-Hsun Lin, Sheng-Wen Su, Shaw-Jang Liou
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Publication number: 20100295736Abstract: A built-in multi-antenna module includes a grounding unit, a plurality of first radiating units and a plurality of second radiating units. The first and the second radiating units are disposed on the grounding unit. Each first radiating unit has a first radiating body, a first feeding pin extended downwards from the first radiating body, and a first shorting pin extended downwards from the first radiating body and connected to the grounding unit. Each second radiating unit has a second radiating body, a second feeding pin extended downwards from the second radiating body, and a second shorting pin extended downwards from the second radiating body and connected to the grounding unit. The first radiating units and the second radiating units are alternately and symmetrically arranged on the grounding unit, and many included angles respectively formed between each first radiating unit and each second radiating unit are the same.Type: ApplicationFiled: September 15, 2009Publication date: November 25, 2010Applicants: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATIONInventor: Saou-Wen SU
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Publication number: 20100284149Abstract: A power supply and a housing structure with the power supply are disclosed. The power supply includes a power supply housing, a cooling fan, a circuit structure, and a plurality of lighting elements. One side of the power supply housing has a first wall, and the first wall has air inlet holes. Another side of the power supply housing has a second wall, and the second wall has air outlet holes. The cooling fan is located in the power supply housing and corresponds to the air inlet holes. The circuit structure is combined with the first wall and adjacent to the air inlet holes. The lighting elements are located at one side of the circuit structure to emit light to outside of the power supply housing. When the housing structure is installed with the power supply, the housing structure has a function of illuminating the interior of the housing structure.Type: ApplicationFiled: May 5, 2009Publication date: November 11, 2010Inventor: YEN-WEN SU
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Publication number: 20100265151Abstract: The invention relates to a dual-feed antenna. The dual-feed antenna includes a substrate, a first antenna unit and a second antenna unit. The second antenna unit includes a second radiating unit and a second grounding unit. The second radiating unit includes a second radiator which has a first groove. The first groove has a first bottom and a pair of first arms. The second grounding unit includes a first sub-grounding-area and a second sub-grounding-area. The second sub-grounding-area has a second groove which includes a second bottom and a pair of second arms. The first sub-grounding-area is cross-wise connected with the second sub-grounding-area at the bottom of the groove, and the second arms symmetrically distribute to both sides of the first sub-grounding-area, and the first groove has an opening direction opposite to the opening direction of the second groove.Type: ApplicationFiled: October 6, 2009Publication date: October 21, 2010Applicants: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATIONInventors: Jui-Hung CHOU, Saou-Wen Su
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Patent number: 7803896Abstract: The present invention relates to polyimide-titania hybrid thin film, which possesses relatively good surface planarization, excellent thermal properties (400<Td<550° C.), tunable refractive index (1.571<n<1.993), and highly optical transparency in the visible range. The present invention also relates to a method for preparing the polyimide-titania hybrid materials, which comprises producing a polyimide containing pendent and/or terminal carboxylic acid, coordinating the carboxylic acid with titanium of titanium alkoxide and sol-gel reacting of titanium alkoxide, to enhance the interaction between polyimide and titania and produce the polyimide-titania hybrid materials without macrophase separation. The present polyimide-titania hybrid materials are useful to produce the thin film having the above features.Type: GrantFiled: November 13, 2007Date of Patent: September 28, 2010Assignee: National Taiwan UniversityInventors: Wen-Chang Chen, Hung-Wen Su
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Publication number: 20100230816Abstract: Semiconductor devices and methods for forming the same in which damages to a low-k dielectric layer therein can be reduced or even prevented are provided. A semiconductor device is provided, comprising a substrate. A dielectric layer with at least one conductive feature therein overlies the substrate. An insulating cap layer overlies the top surface of the low-k dielectric layer adjacent to the conductive feature, wherein the insulating cap layer comprises metal ions.Type: ApplicationFiled: May 26, 2010Publication date: September 16, 2010Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Hung-Wen Su, Shih-Wei Chou, Ming-Hsing Tsai
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Patent number: 7768471Abstract: A dipole antenna device includes a first metal piece including at least one bending part and a first feeding point; a second metal piece including a second bending part and a second feeding point; and a third metal piece electrically connected to a first connection point of the first metal piece and a second connection point of the second metal piece; wherein the first metal piece and the second metal piece are not electrically connected to each other except the first connection point and the second connection point.Type: GrantFiled: March 19, 2008Date of Patent: August 3, 2010Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corp.Inventors: Saou-Wen Su, Jui-Hung Chou