Abstract: A method of plating a metal layer on a work piece includes exposing a surface of the work piece to a plating solution, and supplying a first voltage at a negative end of a power supply source to an edge portion of the work piece. A second voltage is supplied to an inner portion of the work piece, wherein the inner portion is closer to a center of the work piece than the edge portion. A positive end of the power supply source is connected to a metal plate, wherein the metal plate and the work piece are spaced apart from each other by, and are in contact with, the plating solution.

Abstract: A voltage regulator circuit includes a soft start module, a pulse width modulation (PWM) module, and a voltage regulator module. The soft start module is used to receive a current feedback voltage corresponding to an input current, and compare the current feedback voltage with a comparison voltage, so as to output a switching signal. The PWM module is used to receive a clock signal and the switching signal, and determine a first PWM signal and a second PWM signal outputted by the PWM module is a high voltage level or a low voltage level according to the clock signal and the switching signal. The voltage regulator module is used to receive and adjust an output voltage corresponding to the first PWM signal and the second PWM signal.

Abstract: A protective circuit is provided. The protective circuit includes a charging unit, a voltage regulating unit, and a comparing unit. The charging unit receives a rise signal and an over-current signal, and outputs a first reference voltage. The voltage regulating unit receives the first reference voltage and adjusts an output voltage according, to the first reference voltage and a feedback voltage. The comparing unit receives the feedback voltage and compares the feedback voltage with a first threshold voltage to determine whether to output the rise signal to the charging unit.

Abstract: A wire antenna comprises a main radiating element, a grounding element, a shorting element, and a coaxial cable. The said main radiating element and the said grounding element are linked by the said shorting element. A central conducting wire and an outer grounding conductor of the coaxial cable are electrically connected to the first and the second points on the said main radiating element and the said grounding element respectively. The main radiating element and the grounding element are all made of a single metal wire with compact size and low cost. The present invention is capable of single or dual-band operation for applications in WLAN devices.

Abstract: A solid capacitor includes a body, a strip-shaped positive connection terminal and a strip-shaped negative connection terminal extending from the body comprising. Length directions of the positive connection terminal and the negative connection terminal are substantially parallel with each other while width directions of the positive connection terminal and the negative connection terminal are substantially perpendicular to each other.

Abstract: A multi-loop antenna system includes a substrate having opposite first and second surfaces, a first loop antenna disposed on the first surface, and a second loop antenna disposed on one of the first and second surfaces. Each of the first and second loop antennas is operable in a corresponding one of first and second frequency bands, and includes a signal-feed portion and a grounding portion that are disposed adjacent to each other and that are disposed proximate to a respective one of peripheral edges of the substrate, and a radiator portion that has opposite ends connected electrically and respectively to the signal-feed and grounding portions and that cooperates therewith to form a loop.

Abstract: A structure for an integrated circuit with reduced contact resistance is disclosed. The structure includes a substrate, a cap layer deposited on the substrate, a dielectric layer deposited on the cap layer, and a trench embedded in the dielectric layer. The trench includes an atomic layer deposition (ALD) TaN or a chemical vapor deposition (CVD) TaN deposited on a side wall of the trench, a physical vapor deposition (PVD) Ta or a combination of the PVD Ta and a PVD TaN deposited on the ALD TaN or CVD TaN, and a Cu deposited on the PVD Ta or the combination of the PVD Ta and the PVD TaN deposited on the ALD TaN or the CVD TaN. The structure further includes a via integrated into the trench at bottom of the filled trench.

Abstract: An antenna system includes: and antenna module and a system module. The antenna module includes a substrate, and a plurality of planar dipole antennas each including a short-circuit section, two first radiator sections operable in a first frequency band and connected to the short-circuit section, and two second radiator sections operable in a second frequency band and connected to the short-circuit section. The planar dipole antennas are arranged such that geometric centers thereof are respectively spaced apart from a center point bounded by the planar dipole antennas by a predetermined distance, such that each of the planar dipole antennas is spaced apart from an adjacent one of the planar dipole antennas by a predetermined minimum distance. The system module has a grounding plane that faces toward and that is spaced apart from and parallel to the substrate.

Abstract: A system and method automatically rescales an electronic message having one or more associated content. When the electronic message is generated and the associated content connected to the message, an agent of the electronic message application checks predefined settings/configurations of the message client. The sender's e-mail client checks a plurality of conditions, such as, the condition of the network, the type of network, the status or capacity of the receiving inbox of an intended recipient client, and the geographic destination of the message. Based on these dynamic content rescale settings, the sender's client dynamically and optimally rescales the associated content before forwarding the electronic message with the rescaled content to the recipient client. Rescaling of the associated content may be performed by the message exchange server or the recipient client. The recipient client may later request and receive a copy of the associated content without rescaling.

Abstract: A wireless communication apparatus and an antenna system therein are provided. The antenna system includes a grounding portion and an antenna body. The grounding portion includes a ground plane and a conducting element. The conducting element is perpendicular to the ground plane and is connected to the ground plane to provide a first current path. The antenna body includes a main radiating portion and a short circuit portion. The main radiating portion is parallel to the ground plane and provides a second current path. An end of the main radiating portion is electrically connected to a signal source. The short circuit portion is electrically connected between the main radiating portion and the conducting element and provides a third current path. The directions of the first current path, the second current path and the third current path are perpendicular mutually.

Abstract: A motor driving apparatus is applied to a fan and motor mechanism and a voltage supply unit. The motor driving apparatus includes a motor driving unit, a voltage division resistor, a first resistor, a first switch unit, a second resistor, a second switch unit, a third resistor, a third switch unit, a transistor switch, and a pulse width modulation unit. The first switch unit, the second switch unit, and the third switch unit are configured to select the rotational speed upper limitation of the fan and motor mechanism for suppressing noise.

Abstract: A built-in FM transmitting antenna applied to a mobile device, includes a substrate unit, a first antenna unit, a conducting unit and a second antenna unit. The substrate unit has a circuit substrate, at least one grounding layer disposed on the circuit substrate, and a plurality of conducting pads disposed on the circuit substrate. The first antenna unit is disposed above the substrate unit and substantially parallel to the substrate unit. The conducting unit is electrically connected between the substrate unit and the first antenna unit. The second antenna unit is directly disposed on the edge of the top surface of the circuit substrate. The second antenna unit has two ends electrically connected between two of the conducting pads, respectively. The two ends of the second antenna unit are electrically connected to an FM chip module and the conducting unit through the two of the conducting pads, respectively.

Abstract: An adjustable measurement device includes a case, a positive contact portion, a negative contact portion, a test probe, a first wire, and a second wire. The positive contact portion is positioned on an end of the case and electrically connected to the first wire. The negative contact portion is movably received in the case and electrically connected to the second wire. A receiving hole is defined in the negative contact portion for the test probe. The test probe includes a main body electrically connected to the negative contact portion, a tip portion electrically connected to the positive contact portion, and an insulating portion positioned between the main body and the tip portion. A distance between the positive contact portion and the negative contact portion is adjustable by moving the negative contact portion. The negative contact portion and the positive contact portion are isolated from each other.

Abstract: An antenna device includes: a substrate; micro-strip and grounding portions that are respectively disposed on opposite first and second surfaces of the substrate, the former including a signal-feed section for feeding of signals and a plurality of first connecting sections electrically connected to the signal-feed section; and a plurality of first loop antennas arranged along a peripheral edge of the grounding portion, each including a first radiator portion disposed on the first surface and electrically connected to a respective one of the first connecting sections, and a second radiator portion disposed on the second surface, electrically interconnecting the first radiator portion and the grounding portion, and cooperating with the first radiator portion to form a loop.

Abstract: A structure for an integrated circuit with reduced contact resistance is disclosed. The structure includes a substrate, a cap layer deposited on the substrate, a dielectric layer deposited on the cap layer, and a trench embedded in the dielectric layer. The trench includes an atomic layer deposition (ALD) TaN or a chemical vapor deposition (CVD) TaN deposited on a side wall of the trench, a physical vapor deposition (PVD) Ta or a combination of the PVD Ta and a PVD TaN deposited on the ALD TaN or CVD TaN, and a Cu deposited on the PVD Ta or the combination of the PVD Ta and the PVD TaN deposited on the ALD TaN or the CVD TaN. The structure further includes a via integrated into the trench at bottom of the filled trench.

Abstract: An electronic device with a casing is provided. The electronic device includes a first opening, a second opening, and a feed-in circuit. The first opening is formed at one side of the casing, and the first opening extends into the casing to form a first slit. The second opening is formed adjacent to the first opening, and the second opening extends into the casing to form a second slit. The feed-in circuit is coupled to the first slit and the second slit, and the projection of the feed-in circuit partly overlaps the first slit and second slit.

Abstract: A method, computer system, and program product dynamically adjusts a log level of a transaction. The method includes: buffering the most detailed logs of a transaction having highest log level into a memory; checking if all dependency-defined transactions within a dependency list/tree for the transaction are completed; and, in response to the completion of all dependency-defined transactions within the dependency list/tree for the transaction, obtaining a log filter level for the transaction in association with the transaction results (success/failure) of dependency-defined transactions, wherein the log filter level is a new log level for the transaction.

Abstract: A multi-band antenna includes an antenna substrate, an antenna ground, an antenna unit, and a matching conductor. The antenna ground has a signal ground terminal and at least one bend. The antenna unit is adjacent to the antenna ground. The matching conductor is electrically coupled to the antenna ground, and an angle exists between the matching conductor and the antenna ground. A length of the first matching conductor is about a quarter of the wavelength corresponding to a frequency of the first operating band. The antenna unit includes a coupling conductor, a feeding conductor, a radiating conductor, and a shorting conductor. The feeding conductor has a signal feeding terminal One end of the radiating conductor is facing to the antenna ground, and a distance exists between the feeding conductor the antenna ground. Two ends of the shorting conductor are respectively electrically coupled to the antenna ground and the coupling conductor.

Abstract: A dipole antenna includes interconnected first and second grounding portions, first and second connecting portions bending respectively from the first and second grounding portions in a substantially same direction, first and second extending portions extending respectively from the first connecting portion, and third and fourth extending portions extending respectively from the second connecting portion. The second extending portion is disposed closer to the first grounding portion than the first extending portion. The fourth extending portion is disposed closer to the second grounding portion than the third extending portion.

Abstract: A method of trimming spacers includes etching a silicon oxide spacer when forming an outmost spacer, so that a silicon carbon nitride spacer contacting the gate electrode exposes an area. The exposure area of the silicon carbon nitride spacer can then be partly removed by phosphate acid. At the end of the semiconductor process, at least part of the top surface of the silicon carbon nitride spacer will be lower than the top surface of a gate electrode.