Abstract: A method for performing memory access of a Flash cell of a Flash memory includes: performing a series of sensing operations respectively corresponding to a plurality of sensing voltages, wherein a sensing voltage of a specific sensing operation of the series of sensing operations has a sensing voltage determined according to a result of an initial sensing operation of the series of sensing operations; determining a threshold voltage of the Flash cell according to at least a digital value generated by the series of sensing operations; and using the determined threshold voltage to perform soft decoding of the Flash cell.

Abstract: A memory array and an operation method of the memory array are provided. The memory array includes first and second ferroelectric memory devices formed along a gate electrode, a channel layer and a ferroelectric layer between the gate electrode and the channel layer. The ferroelectric memory devices include: a common source/drain electrode and two respective source/drain electrodes, separately in contact with a side of the channel layer opposite to the ferroelectric layer, wherein the common source/drain electrode is disposed between the respective source/drain electrodes; and first and second auxiliary gates, capacitively coupled to the channel layer, wherein the first auxiliary gate is located between the common source/drain electrode and one of the respective source/drain electrodes, and the second auxiliary gate is located between the common source/drain electrode and the other respective source/drain electrode.

Abstract: An evaluation method of sleep quality and a computing apparatus related to sleep quality are provided. In the evaluation method, sensing data is obtained. The sensing data is generated based on a radar echo. The sensing data is transformed into feature data. The feature data includes a statistic of a plurality of feature points on a waveform of the radar echo. Sleep quality information is determined according to the feature data. Accordingly, sleep quality may be evaluated through non-touch sensing.

Abstract: A connector configured to connect densely disposed cables to a board. The connector may include two or more rows of terminals held by a housing such that the two or more rows of terminals are at a same height with respect to a board that the connector would be mounted to. Such a configuration enables the connector to fit into a space limited by, for example, another component mounted to the board. The terminals may include first contact portions configured to be mounted onto a surface of the board when pressure is applied to the terminals so as to avoid the use of materials that may cause undesired shorting such as soldering materials. The terminals may include second contact portions configured to receive the cables. The second contact portions of ground terminals of a same row may be connected by a strip configured to contact shields of cables attached to the row.

Abstract: A receptacle connector having a plurality of airflow holes positioned to avoid heat buildup inside a receptacle shell, preventing deformation to the housing of a short, high density connector during solder reflow. The airflow holes may be in a bent portion joining a top face and rear face of the shell. The receptacle connector may be mounted to a substrate, such as a printed circuit board, leaving a gap between the connector and the substrate, forming an airflow passage between the substrate and the receptacle connector, enabling heated air to reach mounting portions of terminals of the connector during soldering, but reducing heat buildup within the shell. The passage, alone or in combination with a cutout in a face of the shell, may expose terminal contacts of the receptacle connector to provide for easy inspection and rework of the solder joints between the terminal contacts and the substrate.

Abstract: A receptacle connector having a plurality of airflow holes positioned to avoid heat buildup inside a receptacle shell, preventing deformation to the housing of a short, high density connector during solder reflow. The airflow holes may be in a bent portion joining a top face and rear face of the shell. The receptacle connector may be mounted to a substrate, such as a printed circuit board, leaving a gap between the connector and the substrate, forming an airflow passage between the substrate and the receptacle connector, enabling heated air to reach mounting portions of terminals of the connector during soldering, but reducing heat buildup within the shell. The passage, alone or in combination with a cutout in a face of the shell, may expose terminal contacts of the receptacle connector to provide for easy inspection and rework of the solder joints between the terminal contacts and the substrate.

Abstract: A connector assembly configured for compact, high speed electronic systems. The assembly includes a board connector and a cable connector that may be mated by moving the cable connector in a mating direction perpendicular to a printed circuit board to which the board connector is mounted. The cable and board connectors may latch when mated and may be unlatched and unmated by pulling on a tab at a top of the cable connector in a direction opposite the mating direction. As a result, little clearance is required around the board connector to access the latching components. Such a connector may enable an electronic device with high signal integrity because the connector can be mounted close to an electronic component that processes high speed signals, providing a short, and high integrity signal paths for high speed signals.

Abstract: A receptacle connector having a plurality of airflow holes positioned to avoid heat buildup inside a receptacle shell, preventing deformation to the housing of a short, high density connector during solder reflow. The airflow holes may be in a bent portion joining a top face and rear face of the shell. The receptacle connector may be mounted to a substrate, such as a printed circuit board, leaving a gap between the connector and the substrate, forming an airflow passage between the substrate and the receptacle connector, enabling heated air to reach mounting portions of terminals of the connector during soldering, but reducing heat buildup within the shell. The passage, alone or in combination with a cutout in a face of the shell, may expose terminal contacts of the receptacle connector to provide for easy inspection and rework of the solder joints between the terminal contacts and the substrate.

Abstract: A receptacle connector having a plurality of airflow holes positioned to avoid heat buildup inside a receptacle shell, preventing deformation to the housing of a short, high density connector during solder reflow. The airflow holes may be in a bent portion joining a top face and rear face of the shell. The receptacle connector may be mounted to a substrate, such as a printed circuit board, leaving a gap between the connector and the substrate, forming an airflow passage between the substrate and the receptacle connector, enabling heated air to reach mounting portions of terminals of the connector during soldering, but reducing heat buildup within the shell. The passage, alone or in combination with a cutout in a face of the shell, may expose terminal contacts of the receptacle connector to provide for easy inspection and rework of the solder joints between the terminal contacts and the substrate.

Abstract: A connector assembly with latching provided by a rotating latch bar. The connector has a low height, with the rotating latch bar providing secure engagement between mated connectors of the connector assembly. The latch bar may be shaped to provide spring force that urges the mated connectors together. The connector assembly may be formed with a cable connector and a board connector. The low height of the board connector enables the connector to be mounted close to high speed electronic components, such as a processor, even if covered by a heat sink, as the connector may fit under the heat sink. The cable connector may be coupled, via a cable, to an I/O connector or other component remote from the high speed electronic component.

Abstract: A receptacle connector having a plurality of airflow holes positioned to avoid heat buildup inside a receptacle shell, preventing deformation to the housing of a short, high density connector during solder reflow. The airflow holes may be in a bent portion joining a top face and rear face of the shell. The receptacle connector may be mounted to a substrate, such as a printed circuit board, leaving a gap between the connector and the substrate, forming an airflow passage between the substrate and the receptacle connector, enabling heated air to reach mounting portions of terminals of the connector during soldering, but reducing heat buildup within the shell. The passage, alone or in combination with a cutout in a face of the shell, may expose terminal contacts of the receptacle connector to provide for easy inspection and rework of the solder joints between the terminal contacts and the substrate.

Abstract: A receptacle connector having a plurality of airflow holes positioned to avoid heat buildup inside a receptacle shell, preventing deformation to the housing of a short, high density connector during solder reflow. The airflow holes may be in a bent portion joining a top face and rear face of the shell. The receptacle connector may be mounted to a substrate, such as a printed circuit board, leaving a gap between the connector and the substrate, forming an airflow passage between the substrate and the receptacle connector, enabling heated air to reach mounting portions of terminals of the connector during soldering, but reducing heat buildup within the shell. The passage, alone or in combination with a cutout in a face of the shell, may expose terminal contacts of the receptacle connector to provide for easy inspection and rework of the solder joints between the terminal contacts and the substrate.

Abstract: A handheld electronic device includes a case, an electronic unit and a cooling fan. The case includes at least one rib, an air inlet and a heat outlet. The at least one rib delimits a heat chamber. The air inlet and the heat outlet intercommunicate with an outside of the case. The electronic unit includes a heat source located in the heat chamber. The cooling fan is located in the heat chamber and includes an air entrance and an air exit. The air entrance intercommunicates with the air inlet of the case, and the air exit intercommunicates with the heat outlet of the case.

Abstract: A handheld electronic device includes a case, an electronic unit and a cooling fan. The case includes at least one rib, an air inlet and a heat outlet. The at least one rib delimits a heat chamber. The air inlet and the heat outlet intercommunicate with an outside of the case. The electronic unit includes a heat source located in the heat chamber. The cooling fan is located in the heat chamber and includes an air entrance and an air exit. The air entrance intercommunicates with the air inlet of the case, and the air exit intercommunicates with the heat outlet of the case.

Abstract: A battery cartridge, a battery carrier module, and a battery charging system are provided. The battery cartridge includes a carrier case and a dismantable assembly. The battery cartridge has an accommodating space for accommodating a rechargeable battery. The accommodating space has a maximum width and a maximum depth, the rechargeable battery has a predetermined width and a predetermined depth. The dismantable assembly is disposed in the accommodating space of the carrier case. The dismantable assembly includes a width adjustment part and a depth adjustment part. The maximum width and the maximum depth of the accommodating space are respectively greater than the predetermined width and the predetermined depth of the rechargeable battery, and one of the width adjustment part and the depth adjustment part is disposed between the carrier case and the rechargeable battery so as to maintain the relative position between the rechargeable battery and the carrier case.

Abstract: A battery exchange system and a battery exchange method are provided. The battery exchange system includes a plurality of battery exchange stations, a central control station and a handheld electronic device. Each battery exchange station includes a battery exchange device. The battery exchange device includes a battery carrier module. The battery carrier module includes a cabinet and at least one battery storage case disposed in the cabinet. The battery storage case has a storage space for accommodating a fully-charged battery. The fully-charged battery provides a second battery-location information and a battery in-stock information through the corresponding battery exchange station.

Abstract: The present disclosure illustrates an electrochemical test strip and manufacturing method thereof. In the embodiment, a manufacturing process which is not complex and has well precision and convenience is provided to manufacture the electrochemical test strip for testing human body fluid. A surface metallization layer serves as a conductive signal transmission medium, so that the manufacturing cost can be reduced, and the material can be recovered by dissolving the metal in surface metallization.