Patents by Inventor Wen Te

Wen Te has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140029251
    Abstract: An LED spotlight includes a base and lampshade. The base includes a power connecting portion, a heat dissipating portion and circuit board which are connected to the power connecting portion; and an LED unit disposed at the circuit board for emitting first and second light. The center-to-edge distance of the circuit board is defined as a first distance. The LED unit is separated from the center of the circuit board by a second distance. The second distance equals at least 1/10 of the first distance. The lampshade includes an opaque pipe and convex lens. The pipe has one end connected to the heat dissipating portion and the other end connected to the convex lens. The first light penetrates the convex lens to form a first light-emitting area. The second light reflects off the inner wall of the pipe and penetrates the convex lens to form a second light-emitting area.
    Type: Application
    Filed: May 3, 2013
    Publication date: January 30, 2014
    Applicants: YUEN SHING INT'L CO., LTD., SUNNY GENERAL INTERNATIONAL CO., LTD.
    Inventors: CHIEN-LUNG CHANG, HUNG-YAO HSIEH, WEN-TE KUO, CHUANG-YU CHIU
  • Publication number: 20130297834
    Abstract: The present invention discloses a data transmission system. The data transmission system includes a processing unit, a first serial peripheral interface circuit, and a first display interface circuit. The processing unit is arranged to determine a length of a file, divide the file into at least one sub-file according to a system resolution, and produce a file transfer command. The first serial peripheral interface circuit is arranged to transmit the file transfer command to a second serial peripheral interface circuit. The first display interface circuit is arranged to transmit the at least one sub-file to a second display interface circuit, sequentially.
    Type: Application
    Filed: December 4, 2012
    Publication date: November 7, 2013
    Applicant: WISTRON CORP.
    Inventor: Wen-Te LIAO
  • Publication number: 20130179549
    Abstract: An intelligent method of building up a telecommunication network is used to set a Network Element (NE) and an Element Management System (EMS) within an in-band/out-of-band network management framework. The method provides the network element with a random address and makes it connect to the element management system according to a default remote address. After successful connection, the element management system automatically sets up, manages, and allocates the network element. If the network element cannot connect to the element management system by itself, it may receive a Link Layer Discovery Protocol packet about successful connection via multicast generated from network elements nearby. The network may likewise acquire correct connection information about successful connection to the element management system. Thus, this invention allows a newly added network element to be quickly and automatically set in the telecommunication network.
    Type: Application
    Filed: January 6, 2012
    Publication date: July 11, 2013
    Applicant: FIBER LOGIC COMMUNICATIONS, INC.
    Inventors: Yi-Neng Lin, Wen-Te Chiang, Ping-Ju Li
  • Patent number: 8406827
    Abstract: A housing for an electronic device is provided. The housing includes a substrate made of a light-transmittable ceramic. The substrate has an outer surface and an opposite inner surface defining at least one recess configured with patterns or symbols. An opaque layer is formed on the inner surface to prevent light penetrating through the substrate except through the at least one recess.
    Type: Grant
    Filed: June 11, 2010
    Date of Patent: March 26, 2013
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Yue-Ping Liu, Hsiang-Jung Su, Wen-Te Lai, You-Li Liu
  • Patent number: 8393421
    Abstract: A hull robot includes a robot body, at least one drive module for maneuvering the robot about the hull, an on-board power source, and a motive subsystem for the drive module powered by the on-board power source. A plurality of permanent magnet elements are associated with the drive module and each are switchable between a non-shunted state when adjacent the hull and a shunted state when not adjacent the hull.
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: March 12, 2013
    Assignee: Raytheon Company
    Inventors: Howard R. Kornstein, James H. Rooney, III, Jeremy C. Hermann, Jonathan T. Longley, Joel N. Harris, Wen-Te Wu
  • Patent number: 8273986
    Abstract: A device housing for an electronic device is provided. The device housing includes a main body and a decorative member. The main body and the decorative each has a metallic coating with a different color. The decorative member is positioned within the main body to form a desired symbol, logo, or pattern thereon.
    Type: Grant
    Filed: July 29, 2010
    Date of Patent: September 25, 2012
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Yue-Ping Liu, Liang Xiong, Hsiang-Jung Su, Wen-Te Lai
  • Patent number: 8242396
    Abstract: A keypad assembly, comprising: a main body made of metal, the main body defining a plurality of slots and the slots enclosing a plurality of pressing buttons thereon, each pressing button defining at least one symbol slot, the main body having a contact surface and a operating surface; and a light-transmissive filling member, the filling member defining a plurality of protruding strips and the protruding strips enclosing a plurality of button areas thereon, each button area having at least one symbol block protruding therefrom, the filling member bonding to the contact surface with the protruding strips and the symbol blocks respectively engaging in the corresponding slots and the symbol slots. A method for making the present keypad assembly is also described.
    Type: Grant
    Filed: December 7, 2009
    Date of Patent: August 14, 2012
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Hsu-Tang Chen, Wen-Te Lai, Hsiang-Jung Su, Liang Xiong, Kai-Ming Guo, You-Li Liu, Jian-Hua Wu, Zhao-Long Zheng
  • Patent number: 8232684
    Abstract: A method for power load management is provided in the present invention, wherein two different standard values are determined to be a basis for regulating power consumption. When power consumption exceeds a first standard value, a monitoring procedure is started to monitor consumption status. If the power consumption exceeds a second standard value, an unloading procedure is processed to reduce the power consumption of electrical devices under operation. In another embodiment, the present invention also provides a system for power load management comprising a control unit coupled to at least one electrical device and a power meter. By means of real-time recording of power consumption in the power meter, the control unit is capable of determining the power consumption status and determining whether it is necessary to unload or reload the at least one electrical device.
    Type: Grant
    Filed: September 5, 2008
    Date of Patent: July 31, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Tung-Jung Yeh, Sheng-Hsuan Peng, Horng-Shinn Ko, Wen-Te Hung
  • Patent number: 8232675
    Abstract: A method for power load management is provided in the present invention, wherein two different standard values are determined to be a basis for regulating power consumption. When power consumption exceeds a first standard value, a monitoring procedure is started to monitor consumption status. If the power consumption exceeds a second standard value, an unloading procedure is processed to reduce the power consumption of electrical devices under operation. In another embodiment, the present invention also provides a system for power load management comprising a control unit coupled to at least one electrical device and a power meter. By means of real-time recording of power consumption in the power meter, the control unit is capable of determining the power consumption status and determining whether it is necessary to unload or reload the at least one electrical device.
    Type: Grant
    Filed: April 28, 2010
    Date of Patent: July 31, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Tung-Jung Yeh, Sheng-Hsuan Peng, Horng-Shinn Ko, Wen-Te Hung
  • Publication number: 20120174805
    Abstract: The present application discloses a method for performing a hole-plugging process on a circuit board. The method comprises: forming at least two locating holes on the circuit board; delivering the circuit board to a locating area of a hole-plugging screen printer, and adjusting a moving path of the circuit board in the locating area according to a locating device of the hole-plugging screen printer and the locating holes; and transporting the circuit board to a screen printing area of the hole plugging screen printer automatically according to the moving path, and adjusting a hole-plugging stencil of the hole-plugging screen printer to align an inking point of the hole-plugging stencil with a hole to be plugged on the circuit board, so as to plug ink dropped from the inking point of the hole-plugging stencil into the hole. The present application discloses a system for executing above method.
    Type: Application
    Filed: July 13, 2010
    Publication date: July 12, 2012
    Applicants: ZHUHAI FOUNDER TECHNOLOGY MULTILAYER PCB CO., LTD. FUSHAN BRANCH, PEKING UNIVERSITY FOUNDER GROUP CO., LTD.
    Inventors: Wen Te Chen, Yueh Ching Chen, Chen Chen
  • Publication number: 20110283741
    Abstract: A tube bending apparatus for bending a straight lamp tube includes a horizontal heating chamber, a vertical heating chamber and a tube bending mold. The horizontal heating chamber includes a bending tube heating zone and two pre-heating zones. The bending tube heating zone has a working temperature higher than that of the two pre-heating zones. The vertical heating chamber communicates with the horizontal heating chamber and includes a mold heating zone. The mold heating zone has a working temperature higher than or equal to that of the bending tube heating zone. The tube bending mold is heated in the mold heating zone in a working temperature to bend the straight lamp tube held and heated in the horizontal heating chamber.
    Type: Application
    Filed: May 19, 2010
    Publication date: November 24, 2011
    Inventors: Tjong-Ren Chang, Wei-Yuan Tsou, Chun-Chieh Huang, Chin-Chia Chang, Wen-Te Liu
  • Publication number: 20110155452
    Abstract: A device housing for an electronic device is provided. The device housing includes a substrate and assembling members protruding from the substrate. The substrate includes a fiber member, a metal member embedded within the fiber member, and a transparent resin layer formed on the fiber member. The fiber member defines openings. The assembling members extend through the openings and connect with the metal member. A method for making the present device housing is also provided.
    Type: Application
    Filed: September 27, 2010
    Publication date: June 30, 2011
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: YUE-PING LIU, YOU-LI LIU, HSIANG-JUNG SU, WEN-TE LAI
  • Publication number: 20110151212
    Abstract: An exemplary method for making a device housing includes the following steps. Providing a substrate, and then forming a decorative coating on the substrate by paint jet printing. A device housing made by the method includes a substrate and a decorative coating formed on the substrate.
    Type: Application
    Filed: August 25, 2010
    Publication date: June 23, 2011
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: YUE-PING LIU, HSIANG-JUNG SU, WEN-TE LAI
  • Patent number: 7964282
    Abstract: A durable housing with a soft surface device (100) includes a substrate (10), an electrophoresis coating (20) formed on a surface of the substrate, an intermediate coating (30) formed on the electrophoresis coating, and a top coating (40) formed on the intermediate coating and configured for protecting the intermediate coating. The electrophoresis coating is made of a first resin paint. The intermediate coating is made of a second resin paint containing an isocyanate polymer and/or reaction products of the isocyanate polymer with hydroxyl groups. The top coating is made of a third resin paint an isocyanate polymer cross-linked to the second resin paint of the intermediate coating.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: June 21, 2011
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Gang-Yang Yu, Xue-Song Xiao, Hsiang-Jung Su, Wen-Te Lai
  • Publication number: 20110120901
    Abstract: A device housing for an electronic device is provided. The device housing includes a main body and a decorative member. The main body and the decorative each has a metallic coating with a different color. The decorative member is positioned within the main body to form a desired symbol, logo, or pattern thereon.
    Type: Application
    Filed: July 29, 2010
    Publication date: May 26, 2011
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: Yue-Ping LIU, Liang XIONG, Hsiang-Jung SU, Wen-Te LAI
  • Publication number: 20110120743
    Abstract: A housing for an electronic device is provided. The housing includes a substrate made of a light-transmittable ceramic. The substrate has an outer surface and an opposite inner surface defining at least one recess configured with patterns or symbols. An opaque layer is formed on the inner surface to prevent light penetrating through the substrate except through the at least one recess.
    Type: Application
    Filed: June 11, 2010
    Publication date: May 26, 2011
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: YUE-PING LIU, HSIANG-JUNG SU, WEN-TE LAI, YOU-LI LIU
  • Publication number: 20110083599
    Abstract: A hull robot includes a robot body, at least one drive module for maneuvering the robot about the hull, an on-board power source, and a motive subsystem for the drive module powered by the on-board power source. A plurality of permanent magnet elements are associated with the drive module and each are switchable between a non-shunted state when adjacent the hull and a shunted state when not adjacent the hull.
    Type: Application
    Filed: October 14, 2009
    Publication date: April 14, 2011
    Inventors: Howard R. Kornstein, James H. Rooney, III, Jeremy C. Hermann, Jonathan T. Longley, Joel N. Harris, Wen-Te Wu
  • Publication number: 20110048754
    Abstract: A housing for electronic device, comprising: a substrate, the substrate having an outer surface; a metallic coating formed on at least the outer surface of the substrate, the metallic coating defining a plurality of grooves thereon and forming a pattern; and a metal pattern layer formed in the grooves. A method for making the present housing is also provided.
    Type: Application
    Filed: March 10, 2010
    Publication date: March 3, 2011
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (Hong Kong) Limited
    Inventors: LIANG XIONG, YOU-LI LIU, HSIANG-JUNG SU, WEN-TE LAI
  • Publication number: 20110048755
    Abstract: A housing for electronic device, comprising: a metal substrate, the substrate having a bonding surface, a peripheral edge, and a ridge protruding from the peripheral edge and surrounding the bonding surface; a soft layer soft to the touch, the soft layer having an edge; and an adhesive layer located between the bonding surface of the substrate and the soft layer, thereby bonding the soft layer to the substrate, the ridge of the substrate blocking the edge of the soft layer. A method for making the present housing is also provided.
    Type: Application
    Filed: April 26, 2010
    Publication date: March 3, 2011
    Applicant: FIH (HONG KONG) LIMITED
    Inventors: HSIANG-JUNG SU, WEN-TE LAI
  • Publication number: 20110041553
    Abstract: A method for inlaying a gold ornament is disclosed. A substrate is provided which has an outer surface. A groove is defined in the substrate through the outer surface. A gold ornament is manufactured. The gold ornament has substantially the same shape as the groove. The gold ornament is placed in the groove wherein is positioned with metallic solder. Then the substrate is heated, whereby the melting and subsequent cooling of the solder bonds the gold ornament to the substrate. A housing for electronic device inlaid with a gold ornament made by the present method is also provided.
    Type: Application
    Filed: March 10, 2010
    Publication date: February 24, 2011
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: LIANG XIONG, YOU-LI LIU, HSIANG-JUNG SU, WEN-TE LAI, GANG-QIANG LIU