Patents by Inventor Wen Tsay

Wen Tsay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8922004
    Abstract: A work piece includes a copper bump having a top surface and sidewalls. A protection layer is formed on the sidewalls, and not on the top surface, of the copper bump. The protection layer includes a compound of copper and a polymer, and is a dielectric layer.
    Type: Grant
    Filed: July 29, 2010
    Date of Patent: December 30, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jing-Cheng Lin, Ya-Hsi Hwung, Hsin-Yu Chen, Po-Hao Tsai, Yan-Fu Lin, Cheng-Lin Huang, Fang Wen Tsai, Wen-Chih Chiou
  • Publication number: 20140370623
    Abstract: An evaporation apparatus comprises a chamber configured to contain at least one dispensing nozzle and at least one substrate to be coated. The chamber has at least one adjustable shielding member defining an adjustable aperture. The member is positioned between the at least one dispensing nozzle and the at least one substrate. The aperture is adjustable in at least one of the group consisting of area and shape. The at least one adjustable shielding member has a heater.
    Type: Application
    Filed: June 13, 2013
    Publication date: December 18, 2014
    Inventors: Chung-Hsien WU, Chi-Yu CHIANG, Shih-Wei CHEN, Wen-Tsai YEN
  • Publication number: 20140366935
    Abstract: A solar cell device with improved performance and a method of fabricating the same is described. The solar cell includes a back contact layer formed on a substrate, an absorber layer formed on the back contact layer, a buffer layer formed on the absorber layer, and a front contact layer formed by depositing a transparent conductive oxide layer on the buffer layer and annealing the deposited TCO layer.
    Type: Application
    Filed: June 14, 2013
    Publication date: December 18, 2014
    Inventors: Chi-Yu CHIANG, Yung-Sheng CHIU, Wen-Tsai YEN
  • Patent number: 8912112
    Abstract: The present invention relates to a metal catalyst composition modified by a nitrogen-containing compound, which effectively reduces cathode catalyst poisoning. The catalyst composition applied on the anode also lowers the over-potential. The catalyst coupled with the nitrogen-containing compound has increased three-dimensional hindrance, which improves the distribution of the catalyst particles and improves the reaction activity.
    Type: Grant
    Filed: September 24, 2011
    Date of Patent: December 16, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Li-Duan Tsai, Sung-Chun Chang, Hui-Wen Tsai, Chi-Yun Kang, Jiunn-Nan Lin
  • Publication number: 20140360864
    Abstract: A method generally comprises providing heat to a substrate in at least one buffer chamber and transferring the substrate to at least one deposition chamber that is coupled to the buffer chamber via an conveyor. The method also includes depositing a first set of a plurality of elements, using sputtering, and a second set of a plurality of elements, using evaporation, onto at least a portion of the substrate in the deposition chamber.
    Type: Application
    Filed: June 7, 2013
    Publication date: December 11, 2014
    Inventors: Wen-Tsai YEN, Chung-Hsien WU, Chi-Yu CHIANG, Shih-Wei CHEN, Wen-Chin LEE
  • Publication number: 20140352751
    Abstract: A solar cell includes an absorber layer, a buffer layer on the absorber layer, a front contact layer where a glass substrate, a back contact layer on the glass substrate, the absorber layer on the back contact layer, the buffer layer, and the front contact layer are manufactured as a first module at a temperature exceeding 500 degrees Celsius. The solar further includes an extracted portion from the first module where the extracted portion includes the absorber layer, the buffer layer, and the front contact layer, and where the extracted portion is applied to a flexible substrate or other substrate.
    Type: Application
    Filed: May 31, 2013
    Publication date: December 4, 2014
    Inventors: Chung-Hsien WU, Wei-Lun XU, Shih-Wei CHEN, Wen-Tsai YEN, Li XU
  • Patent number: 8900994
    Abstract: A system and method for manufacturing a through silicon via is disclosed. An embodiment comprises forming a through silicon via with a liner protruding from a substrate. A passivation layer is formed over the substrate and the through silicon via, and the passivation layer and liner are recessed from the sidewalls of the through silicon via. Conductive material may then be formed in contact with both the sidewalls and a top surface of the through silicon via.
    Type: Grant
    Filed: June 9, 2011
    Date of Patent: December 2, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Shin-Puu Jeng, Wen-Chih Chiou, Fang Wen Tsai, Chen-Yu Tsai
  • Patent number: 8901001
    Abstract: A slurry composition has an amount of 100% and includes abrasives, an acid-base pH adjustor, an oxidant and water. A content of the abrasives is 10 wt % to 40 wt %, and a polydisperse index of the abrasives sizes is greater than 1.8. A content of the acid-base pH adjustor is 0.01 wt % to 10 wt %. A content of the oxidant is 0.01 wt % to 10 wt %. A remaining portion of the slurry composition is water.
    Type: Grant
    Filed: August 25, 2009
    Date of Patent: December 2, 2014
    Assignee: UWIZ Technology Co., Ltd.
    Inventors: Song-Yuan Chang, Wen-Tsai Tsai, Ming-Hui Lu, Po-Yuan Shen
  • Patent number: 8896136
    Abstract: In accordance with an embodiment, a structure comprises a substrate having a first area and a second area; a through substrate via (TSV) in the substrate penetrating the first area of the substrate; an isolation layer over the second area of the substrate, the isolation layer having a recess; and a conductive material in the recess of the isolation layer, the isolation layer being disposed between the conductive material and the substrate in the recess.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: November 25, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Yu Tsai, Shih-Hui Wang, Chien-Ming Chiu, Chia-Ho Chen, Fang Wen Tsai, Weng-Jin Wu, Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu
  • Patent number: 8848402
    Abstract: A power factor correction apparatus is applied to an alternating-current voltage apparatus and a rear end circuit. The power factor correction apparatus includes a power factor correction unit, a control unit, and a ripple detecting unit. The power factor correction unit is electrically connected to the rear end circuit and the alternating-current voltage apparatus. The control unit is electrically connected to the power factor correction unit. The ripple detecting unit is electrically connected to the rear end circuit, the power factor correction unit, and the control unit. The control unit is informed by the ripple detecting unit to control the power factor correction unit to adjust the power factor after the ripple of the signal outputted from the power factor correction unit is detected by the ripple detecting unit.
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: September 30, 2014
    Assignee: Chicony Power Technology Co., Ltd.
    Inventors: Wen-Nan Huang, Yao-Wen Tsai, Shiu-Hui Lee
  • Patent number: 8846438
    Abstract: A solar cell includes an absorber layer formed of a CIGAS, copper, indium, gallium, aluminum, and selenium. A method for forming the absorber layer provides for using an indium-aluminum target and depositing an aluminum-indium film as a metal precursor layer using sputter deposition. Additional metal precursor layers such as a CuGa layer are also provided and a thermal processing operation causes the selenization of the metal precursor layers. The thermal processing operation/selenization operation converts the metal precursor layers to an absorber layer. In some embodiments, the absorber layer includes a double graded chalcopyrite-based bandgap.
    Type: Grant
    Filed: March 19, 2014
    Date of Patent: September 30, 2014
    Assignee: TSMC Solar Ltd.
    Inventors: Wen-Tsai Yen, Chung-Hsien Wu, Shih-Wei Chen, Wen-Chin Lee
  • Patent number: 8845167
    Abstract: A display device includes a light guide plate, a first light source device, a second light source device, a display panel, and an image light source synchronization unit. The first and second light source devices are disposed adjacent to two opposite sides of the light guide plate respectively. A plurality of first micro structures are formed on a bottom surface of the light guide plate and capable of deflecting a light beam from the second light source device towards the right-hand side and deflecting a light beam from the first light source device towards the left-hand side. The image light source synchronization unit is capable of displaying the left-side image when the first light source device is turned on and the second light source device is turned off and displaying the right-side image when the first light source device is turned off and the second light source device is turned on.
    Type: Grant
    Filed: June 7, 2011
    Date of Patent: September 30, 2014
    Assignee: Coretronic Corporation
    Inventors: Han-Wen Tsai, Ming-Feng Kuo
  • Patent number: 8841360
    Abstract: The present invention relates to a coatings composition comprising an alkyd, a pigment, a rheology modifier, a radical producing oxidoreductase, and one or more additives, wherein the alkyd contains at least one C6-30—C(O)O— group having at least one diallylic group. The coatings composition of the present invention cures relatively rapidly without ancillary crosslinking agents and with minimal, if any, VOCs from solvents or coalescents.
    Type: Grant
    Filed: October 2, 2012
    Date of Patent: September 23, 2014
    Assignee: Rohm and Haas Company
    Inventors: Selvanathan Arumugam, Ralph Even, David L. Fratarelli, Kathleen Manna, Wei-Wen Tsai
  • Publication number: 20140273402
    Abstract: A method for cutting wafers includes following steps. A silicon wafer is provided. A metal layer is formed on a top side of the silicon wafer. A bump layer is formed on the metal layer. A backside grinding tape is attached on the bump layer. A bottom side of the silicon wafer is half cut to form a cutting race. The bottom side of the silicon wafer is ground, so that a thickness of the silicon wafer is a predetermined thickness and only partial cutting race remains. The backside grinding tape is removed. A dicing tape is attached on the bottom side of the silicon wafer. The metal layer is cut by a laser. The metal layer is communicated with the cutting race. The manufacturing cost is reduced without crumbling or cracking. The chippings on the top or bottom side of the silicon wafer can be removed.
    Type: Application
    Filed: January 16, 2014
    Publication date: September 18, 2014
    Applicant: SURETECH TECHNOLOGY CO., LTD.
    Inventors: Hung-Wen TSAI, Chun-Ting CHEN
  • Patent number: 8837173
    Abstract: A power converting device includes a switching unit, a resonant unit, a converting unit, a rectifying and filtering unit, an inductance-sensing unit, and a driver. The resonant unit is electrically connected to the switching unit and includes a resonant capacitor, a resonant inductor, and a variable magnetizing-inductor having at least two inductances, the resonant inductor is electrically connected to the resonant capacitor and the variable magnetizing-inductor. The converting unit is electrically connected to the resonant unit. The rectifying and filtering unit is electrically connected to the converting unit. The inductance-sensing unit is electrically connected to the rectifying and filtering unit, the inductance-sensing unit instantaneously senses inductances of the variable magnetizing-inductor.
    Type: Grant
    Filed: January 2, 2013
    Date of Patent: September 16, 2014
    Assignee: Chicony Power Technology Co., Ltd
    Inventors: Wen-Nan Huang, Shiu-Hui Lee, Gen-Zen Liu, Yao-Wen Tsai, Chih-Ching Huang
  • Publication number: 20140227822
    Abstract: A method for forming a thin film solar cell that includes one or more moisture barrier layer made of a water-insoluble material for protection against water and oxygen damage to the top electrode layer material is disclosed.
    Type: Application
    Filed: April 22, 2014
    Publication date: August 14, 2014
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wen-Chin LEE, Yung-Sheng CHIU, Wen-Tsai YEN, Liang-Sheng YU
  • Patent number: 8796063
    Abstract: A method of fabricating a solar cell includes forming a front contact layer over a substrate, and the front contact layer is optically transparent at specified wavelengths and electrically conductive. A first scribed area is scribed through the front contact layer to expose a portion of the substrate. A buffer layer doped with an n-type dopant is formed over the front contact layer and the first scribed area. An absorber layer doped with a p-type dopant is formed over the buffer layer. A back contact layer that is electrically conductive is formed over the absorber layer.
    Type: Grant
    Filed: August 13, 2013
    Date of Patent: August 5, 2014
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wen-Chin Lee, Wen-Tsai Yen, Liang-Sheng Yu, Yung-Sheng Chiu
  • Publication number: 20140210319
    Abstract: A motor includes a base, a rotor unit and a driving unit. The base has opposite first and second surfaces. The rotor unit includes a magnet unit disposed on a rotatable magnet carrier to face the first surface of the base. The driving unit includes induction coils disposed on a circuit board, a sensor unit that is disposed on the circuit board and spaced apart from the induction coils and that defines a first reference line with the rotation axis, and a rotor positioning component disposed on the second surface of the base, extending along a second reference line, and capable of magnet attraction with the magnet unit for positioning the rotor unit relative to the sensor unit when the rotor unit stops rotating.
    Type: Application
    Filed: January 25, 2013
    Publication date: July 31, 2014
    Applicant: Yen Sun Technology Corp.
    Inventors: Chien-Jung Chen, Hsien-Wen Liu, Chih-Tsung HSU, Tzu-Wen Tsai
  • Publication number: 20140210295
    Abstract: A motor includes a base, a rotor unit and a driving unit. The base has opposite first and second surfaces. The rotor unit includes a magnet unit disposed on a rotatable magnet carrier to face the first surface of the base. The driving unit includes a circuit board disposed between the base and the magnet unit, induction coils disposed on the circuit board and operatively associated with the magnet unit, a sensor unit disposed on the circuit board and spaced apart from the induction coils, and a rotor positioning component disposed on the second surface of the base and capable of magnet attraction with the magnet unit for positioning the rotor unit relative to the sensor unit when the rotor unit stops rotating.
    Type: Application
    Filed: January 25, 2013
    Publication date: July 31, 2014
    Applicant: Yen Sun Technology Corp.
    Inventors: Chien-Jung Chen, Hsien-Wen Liu, Chih-Tsung HSU, Tzu-Wen Tsai
  • Publication number: 20140206132
    Abstract: A solar cell includes an absorber layer formed of a CIGAS, copper, indium, gallium, aluminum, and selenium. A method for forming the absorber layer provides for using an indium-aluminum target and depositing an aluminum-indium film as a metal precursor layer using sputter deposition. Additional metal precursor layers such as a CuGa layer are also provided and a thermal processing operation causes the selenization of the metal precursor layers. The thermal processing operation/selenization operation converts the metal precursor layers to an absorber layer. In some embodiments, the absorber layer includes a double graded chalcopyrite-based bandgap.
    Type: Application
    Filed: March 19, 2014
    Publication date: July 24, 2014
    Applicant: TSMC SOLAR LTD.
    Inventors: Wen-Tsai YEN, Chung-Hsien WU, Shih-Wei CHEN, Wen-Chin LEE