Patents by Inventor Wen Tsay

Wen Tsay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120133257
    Abstract: An exemplary side plate assembly includes a side plate and an elongated reinforcing member. The side plate includes a main portion and two mounting portions at two opposite sides of the main portion. The reinforcing member is arranged at a middle of a side of the side plate. Two ends of the reinforcing member are respectively connected to the two mounting portions of the side plate. An inner side of the reinforcing member abuts the main portion of the side plate.
    Type: Application
    Filed: December 26, 2010
    Publication date: May 31, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHIH-HUA CHEN, CHIA-WEN TSAI, CHIH-WEI KE
  • Publication number: 20120128457
    Abstract: An apparatus includes a robot arm, and a plurality of guide pins mounted on the robot arm.
    Type: Application
    Filed: November 24, 2010
    Publication date: May 24, 2012
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsin Chang, Hsin-Yu Chen, Fang Wen Tsai, Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu
  • Publication number: 20120125580
    Abstract: An oil cooler includes an oil guiding arrangement an oil guiding arrangement and an air guiding arrangement. The oil guiding arrangement has an oil inlet, an oil outlet, and a plurality of oil passageways communicatively between the oil inlet and the outlet and spacedly being stacked apart from each other. The air guiding arrangement has a plurality of air guiding passageways alternating with the oil passageways and arranged for guiding air flowing through the air guiding passageways to heat exchange with the oil so as to cool down the oil before exiting at the oil outlet. A plurality of embossed plates are disposed in the oil passageways respectively for creating a three-dimensional oil movement within the oil passageway to heat exchange with the air, so as to enhance the heat exchange efficiency.
    Type: Application
    Filed: November 19, 2010
    Publication date: May 24, 2012
    Inventor: Chao-Wen Tsai
  • Publication number: 20120126420
    Abstract: The present invention relates to a package having a semiconductor device. The semiconductor device includes a substrate body, a plurality of conductive vias and a plurality of metal pads. The conductive vias are disposed in the through holes of the substrate body. The metal pads are electrically connected to the conductive vias. At least one of the metal pads has at least one curved side wall and at least one reference side wall. The curvature of the curved side wall is different from that of the reference side wall, so as to allow the metal pads to be closer to each other. This arrangement allows the conductive to be closer to each other. Therefore, more conductive vias can be arranged in a limited space.
    Type: Application
    Filed: May 23, 2011
    Publication date: May 24, 2012
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Kuo Hua Chen, Li Wen Tsai
  • Patent number: 8184208
    Abstract: A method for processing video data including a plurality of fields is disclosed. The method includes: dividing the plurality of fields into a plurality of image blocks; examining each image block of a target field to determine whether each image block of the target field corresponds to a film mode or a non-film mode, wherein the target field is one of the plurality of fields; examining each image block of the target field that corresponds to the film mode to determine whether each image block corresponds to a pure film mode or a mix film mode; and utilizing a specific image processing mechanism to process each of the plurality of image blocks.
    Type: Grant
    Filed: June 15, 2007
    Date of Patent: May 22, 2012
    Assignee: Realtek Semiconductor Corp.
    Inventors: Sen-Huang Tang, Wen-Tsai Liao
  • Publication number: 20120119606
    Abstract: A motor stator includes a stator unit and an auxiliary induction unit. The stator unit includes a circuit substrate, and a plurality of induction coils embedded within the circuit substrate. The auxiliary induction unit includes an insulating member, a magnetic conductor, and at least one coil winding assembly. The coil winding assembly includes a conductive rod and an auxiliary coil. The rod has an insert rod section extending through the magnetic conductor, the insulating member, and the circuit substrate, and a wound rod section permitting the auxiliary coil to be wound thereon, such that the auxiliary coil is disposed outwardly of the magnetic conductor. During assembly, the induction coil assembly is mounted to the magnetic conductor, and the insulating member is superposed on the circuit substrate. Subsequently, the rod is inserted through the insulating member and into the circuit substrate.
    Type: Application
    Filed: April 25, 2011
    Publication date: May 17, 2012
    Applicant: YEN SUN TECHNOLOGY CORP
    Inventors: Chien-Jung CHEN, Hsien-Wen LIU, Chih-Tsung HSU, Tzu-Wen TSAI, Cheng- Tien SHIH, Hsin-Hsien WU, Jia-Ching LEE
  • Publication number: 20120119607
    Abstract: A motor stator includes an insulating frame having a plurality of projecting rods, an induction unit, and a plurality of conductive members. The induction unit includes an induction circuit board, a plurality of induction coils embedded within the induction circuit board, and a plurality of coil windings wound respectively on the projecting rods. The conductive members extend through the insulating frame and the induction circuit board for establishing an electrical connection between each of the induction coils and a corresponding one of the coil windings. The turn numbers of the coil windings are not limited by the area and thickness of the induction circuit board, and can be increased. Alternatively, the coil windings may be positioned to increase the magnetic pole slot number when energized. As such, a driving force of the motor stator can be increased.
    Type: Application
    Filed: March 29, 2011
    Publication date: May 17, 2012
    Applicant: YEN SUN TECHNOLOGY CORP
    Inventors: Chien-Jung CHEN, Hsien-Wen LIU, Chih-Tsung HSU, Tzu-Wen TSAI, Cheng-Tien SHIH, Hsin-Hsien WU, Jia-Ching LEE
  • Publication number: 20120119608
    Abstract: A motor stator includes a stator unit and at least one auxiliary unit. The stator unit includes a circuit substrate, and a plurality of spaced-apart induction coils embedded within the circuit substrate. The auxiliary unit includes an auxiliary coil attached to and disposed outwardly of the circuit substrate.
    Type: Application
    Filed: March 29, 2011
    Publication date: May 17, 2012
    Applicant: YEN SUN TECHNOLOGY CORP
    Inventors: Chien-Jung CHEN, Hsien-Wen LIU, Chih-Tsung HSU, Tzu-Wen TSAI, Cheng- Tien SHIH, Hsin-Hsien WU, Jia-Ching LEE
  • Patent number: 8176621
    Abstract: A method for forming an antenna structure is provided, including the following steps of: providing a non-conductive frame and disposing a plating resist material on the non-conductive frame, removing a part of the plating resist material within a predetermined region on the non-conductive frame and forming a roughened surface on the non-conductive frame within the predetermined region by laser marking, forming a medium layer on the roughened surface, wherein the medium layer comprises Pd or Ag, removing the plating resist material on the non-conductive frame, and forming a metal layer on the medium layer.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: May 15, 2012
    Assignee: Wistron NeWeb Corp.
    Inventors: Wen-Kuei Lo, Sheng-Chieh Chang, Bau-Yi Huang, Chi-Wen Tsai, Hsin-Hui Hsu, Tzuh-Suan Wang
  • Patent number: 8169275
    Abstract: A circuit board with jumper structure is disclosed. The circuit board includes a substrate, a ground layer, a first signal transmission line, and a second signal transmission line. The ground layer is formed on a second plane of the substrate. The first signal transmission line is formed on a first plane of the substrate, and coupled to a first signal end and a second signal end. A first signal transmitted on the first signal transmission line in a combination method of a microstrip line to co-planar waveguide transition and a co-planar waveguide to microstrip line transition. The second signal transmission line is formed on the second plane of the substrate, and coupled to a third signal end and a fourth signal end. A second signal is transmitted on the second signal transmission line in the co-planar waveguide transmission.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: May 1, 2012
    Assignee: Wistron NeWeb Corporation
    Inventors: Wen-Tsai Tsai, Wen-Chen Lan
  • Publication number: 20120098186
    Abstract: A paper pickup structure of a paper feeding device is provided. The paper pickup structure includes: a rotating arm, including a connection portion, a base, and a combination member, in which the connection portion and the combination member are located on the base; a first gear, combined with the connection portion to be switched between a forward rotation state and a reverse rotation state, so as to drive the rotating arm to rotate; a limiting member, located on the rotating arm, in which one end of the limiting member is combined with the combination member of the rotating arm, or one end of the limiting member is separated from the combination member through the rotation of the rotating arm; a second gear, located on the base; and a third gear, driven by the second gear to rotate when the rotating arm rotates to a predetermined position.
    Type: Application
    Filed: July 5, 2011
    Publication date: April 26, 2012
    Applicant: TECO IMAGE SYSTEM CO., LTD.
    Inventors: Ming-Chieh CHUNG, Po-Wen Tsai
  • Patent number: 8165206
    Abstract: A method for controlling a video data to enter a film mode for processing is disclosed, the video data including a plurality of target fields, the method including: determining whether a target field of the target fields is capable of being merged with a first neighboring field of the target field; if the target field can be merged with the first neighboring field, adding one to a merging number; and repeating the above steps until the merging number is determined to be not less than N, and then entering the film mode to process the video data; wherein N is a positive integer not less than two.
    Type: Grant
    Filed: July 5, 2007
    Date of Patent: April 24, 2012
    Assignee: Realtek Semiconductor Corp.
    Inventors: Sen-Huang Tang, Wen-Tsai Liao, Ming-Jane Hsieh
  • Publication number: 20120091304
    Abstract: A mounting apparatus for a data storage device includes a first fixed member, a second fixed member, a torsion spring, and a positioning member. The first fixed member includes a first bottom plate and a first sidewall. The first bottom plate includes a pair of first convex tabs. The pair of first convex tabs each defines a first pin hole therein. The second fixed member includes a second bottom plate and a second sidewall. The second bottom plate includes a pair of second convex tabs. The pair of second convex tabs each defines a second pin hole therein. The positioning member includes a pin. The pin is passed through the first pin holes of the pair of first convex tabs, the second pin holes of the pair of second convex tabs and a center of the torsion spring.
    Type: Application
    Filed: November 12, 2010
    Publication date: April 19, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: KEN-YAO CHUANG, CHIA-WEN TSAI
  • Publication number: 20120056315
    Abstract: A device includes a substrate, and an alignment mark including a conductive through-substrate via (TSV) penetrating through the substrate.
    Type: Application
    Filed: September 2, 2010
    Publication date: March 8, 2012
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsin Chang, Fang Wen Tsai, Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng
  • Publication number: 20120044715
    Abstract: A backlight module includes a light guide plate, at least one first light source, and at least one second light source. A first light incident surface and a second light incident surface are alternately arranged on a light incident side of the light guide plate and form an angle with each other. The first light source is disposed adjacent to the first light incident surface, and a light beam emitted by the first light source is guided towards a left half of the light guide plate. The second light source is disposed adjacent to the second light incident surface, and a light beam emitted by the second light source is guided towards a right half of the light guide plate. The first light source and the second light source are alternately turned on and off in succession.
    Type: Application
    Filed: June 17, 2011
    Publication date: February 23, 2012
    Inventors: Han-Wen Tsai, Chih-Chieh Yu, Ming-Feng Kuo
  • Publication number: 20120042505
    Abstract: A method for manufacturing an antenna includes steps as follows. First, a substrate is provided, wherein a surface of the substrate has an antenna region. Then, the surface of the substrate is electroless plated with a metal medium, so that the surface is covered with the metal medium. Then, the metal medium is covered with a resist. Then, a portion of the resist in the antenna region is removed. Then, the antenna region is electroplated with metal material to form an antenna main body. Then, a remaining portion of the resist is removed, and excluding a portion of the metal medium in the antenna region, the other portion of the metal medium is also removed from the substrate.
    Type: Application
    Filed: December 20, 2010
    Publication date: February 23, 2012
    Applicant: WISTRON NEWEB CORPORATION
    Inventors: Wen-Kuei LO, Sheng-Chieh CHANG, Bau-Yi HUANG, Chi-Wen TSAI, Hsin-Hui HSU, Tzuh-Suan WANG
  • Publication number: 20120027707
    Abstract: A lycogen extract comprising active ingredient of ?-carotene, neurosporene, spheroidenone and/or methoxyneurosporene is described. A composition comprising the lycogen extract of the present invention and food scientific or pharmaceutical acceptable carrier is also presented. A method for the treatment of disease in need of the lycogen extract which comprises administering to a patient in need thereof a therapeutically effective amount of lycogen extract of the present invention is further described.
    Type: Application
    Filed: July 21, 2011
    Publication date: February 2, 2012
    Applicant: ASIA-PACIFIC BIOTECH DEVELOPING, INC.
    Inventors: WEN-SHENG LIU, FU-HSIN CHANG, YA-WEN TSAI
  • Publication number: 20120027951
    Abstract: A method for forming an antenna structure is provided, including the following steps of: providing a non-conductive frame and forming a photosensitive medium layer on the non-conductive frame, wherein the medium layer comprises a catalyzer for electroless deposition; applying a light beam through a transparent portion of a mask to the medium layer, such that a part of the medium layer is solidified within a predetermined region on the non-conductive frame; removing a part of the medium layer outside of the predetermined region; and forming a metal layer on the medium layer within the predetermined region.
    Type: Application
    Filed: January 26, 2011
    Publication date: February 2, 2012
    Applicant: WISTRON NEWEB CORP.
    Inventors: Sheng-Chieh Chang, Bau-Yi Huang, Chi-Wen Tsai, Hsin-Hui Hsu, Wen-Kuei Lo
  • Publication number: 20120017427
    Abstract: A method for forming an antenna structure is provided, including the following steps of: providing a non-conductive frame and disposing a plating resist material on the non-conductive frame, removing a part of the plating resist material within a predetermined region on the non-conductive frame and forming a roughened surface on the non-conductive frame within the predetermined region by laser marking, forming a medium layer on the roughened surface, wherein the medium layer comprises Pd or Ag, removing the plating resist material on the non-conductive frame, and forming a metal layer on the medium layer.
    Type: Application
    Filed: December 15, 2010
    Publication date: January 26, 2012
    Applicant: WISTRON NEWEB CORP.
    Inventors: Wen-Kuei Lo, Sheng-Chieh Chang, Bau-Yi Huang, Chi-Wen Tsai, Hsin-Hui Hsu, Tzuh-Suan Wang
  • Publication number: 20120001337
    Abstract: In accordance with an embodiment, a structure comprises a substrate having a first area and a second area; a through substrate via (TSV) in the substrate penetrating the first area of the substrate; an isolation layer over the second area of the substrate, the isolation layer having a recess; and a conductive material in the recess of the isolation layer, the isolation layer being disposed between the conductive material and the substrate in the recess.
    Type: Application
    Filed: June 30, 2010
    Publication date: January 5, 2012
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Yu Tsai, Shih-Hui Wang, Chien-Ming Chiu, Chia-Ho Chen, Fang Wen Tsai, Weng-Jin Wu, Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu