Patents by Inventor Wen Wei

Wen Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PHOTOVOLTAIC POWERED SYSTEM
    Publication number: 20120230066
    Abstract: A photovoltaic powered system and an alternating current (AC) module thereof are disclosed. The photovoltaic powered system provides a direct current (DC) power through a photovoltaic module and converts the DC power into an AC power, which is grid-connected to an AC utility power. The AC module of the photovoltaic powered system produces a continuous quasi-sinusoidal current and the quasi-sinusoidal current is converted into a sinusoidal current. The high-frequency harmonic components of the sinusoidal current are filtered to produce a sinusoidal output current in phase with the AC utility power, thus realizing the maximum power point tracking (MPPT) of the photovoltaic module and feeding unity-power-factor power into the AC utility power.
    Type: Application
    Filed: March 7, 2011
    Publication date: September 13, 2012
    Inventors: Ching-Ming LAI, Ching-Tsai Pan, Chih-Hsing Fang, Wen-Wei Chan, Ming-Chieh Cheng
  • Sliding-type portable electronic device
    Patent number: 8249673
    Abstract: A portable electronic device comprises a cover, a base and a sliding mechanism. The sliding mechanism includes a connecting rod mechanism and a controlling mechanism. The connecting rod mechanism is rotatably mounted between the base and the cover and is configured to rotate the cover relative to the base. The controlling mechanism is configured to control the rotation of the connecting rod mechanism.
    Type: Grant
    Filed: July 24, 2009
    Date of Patent: August 21, 2012
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Ying-Zhuo Wang, Hsiao-Hua Tu, Gang Yang, Wen-Wei Song
  • Battery cover and portable electronic device using the same
    Patent number: 8241782
    Abstract: A battery cover which detachably mounted on a portable electronic device to protect the battery of the portable electronic device. The battery cover includes a main cover and a sliding cover, the sliding cover is slidably mounted on the main cover. Two opposite ends of the main cover and the sliding cover each includes at least one tab or projection protruding there from respectively. The battery cover has a simple structure, and is easy for operating. The invention also includes a portable electronic device using the battery cover.
    Type: Grant
    Filed: December 11, 2008
    Date of Patent: August 14, 2012
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Jun Wang, Hsiao-Hua Tu, Gang Yang, Wen-Wei Song, Ying-Zhuo Wang
  • Recessed pillar structure
    Patent number: 8241963
    Abstract: A bump structure that may be used to interconnect one substrate to another substrate is provided. A recessed conductive pillar is formed on a first substrate such that the recessed conductive pillar has a recess formed therein. The recess may be filled with a solder material. A conductive pillar on a second substrate may be formed having a contact surface with a width less than or equal to a width of the recess. The first substrate may be attached to the second substrate such that the conductive pillar on the second substrate is positioned over or in the recess of the first substrate. The substrates may each be an integrated circuit die, an interposer, a printed circuit board, a high-density interconnect, or the like.
    Type: Grant
    Filed: July 13, 2010
    Date of Patent: August 14, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Wei Shen, Yao-Chun Chuang, Chen-Shien Chen, Ming-Fa Chen
  • Housing with hook configuration
    Patent number: 8226179
    Abstract: A housing comprises a first outer shell, a second outer shell; and a hook configuration configured for assembling the first outer shell on the second outer shell. The hook configuration comprises two clasp units set in the first outer shell. Each of the two clasp units comprises a first clasp body and a first magnet. Two hook units are set in the second outer shell. Each of the two hook units comprises a first hook and a second magnet.
    Type: Grant
    Filed: February 3, 2010
    Date of Patent: July 24, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Kuo-Chang Yang, Yi-Wen Wei
  • THREE-PHASE POWER SUPPLY WITH THREE-PHASE THREE-LEVEL DC/DC CONVERTER
    Publication number: 20120155124
    Abstract: A three-phase power supply with a three-phase three-level DC/DC converter includes a full-bridge thyristor converter with three-set four in-series power switch elements, a three-phase isolated transformer, a full-bridge rectifier, a rectifying circuit, and a low-pass filtering circuit. The three-phase power supply is used to deliver power energy from the AC input voltage to the load. The power switch elements, which separated to each other at 120-degree phase differences, are controlled through a phase shift scheme. Therefore, the three-level circuit structure is provided to reduce withstanding voltage of the power switch elements, further the zero-voltage switching (ZVS) is achieved by the isolated transformer and the power switch elements to increase the efficiency of the DC/DC converter.
    Type: Application
    Filed: December 20, 2010
    Publication date: June 21, 2012
    Inventors: Chaur-Ping CHENG, Chih-Hsing Fang, Wen-Wei Chan, Po-Yuan Chen
  • Method of forming through silicon via with dummy structure
    Patent number: 8202800
    Abstract: A method of forming a through silicon via (TSV) structure includes forming an interconnect pad over a substrate. An under layer is formed over the interconnect pad. A vertical conductive post is formed at least partially through the substrate. At least one dummy structure is formed at least partially through the under layer. A top pad is formed over the dummy structure and the vertical conductive post. The top pad covers a wider area than a cross section of the vertical conductive post. The interconnect pad is electrically connected to the top pad. The dummy structure connects the top pad and the under layer thereby fastening the top pad and the interconnect pad.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: June 19, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hua Chen, Chen-Shien Chen, Chen-Cheng Kuo, Wen-Wei Shen
  • CONTROL CIRCUIT AND METHOD FOR A BUCK-BOOST SWITCHING CONVERTER
    Publication number: 20120146602
    Abstract: A control circuit and method for a buck-boost switching converter provides a mode determinative circuit to judge the timing of an operation under buck-boost mode based on the input voltage, the output voltage and the mode reference voltage; meanwhile, the control signal generating circuit is provided to turn off the second switch during the first switch being on, turn on the second switch during the first switch being off, turn off the fourth switch during the third switch being on, turn on the fourth switch during the third switch being off, wherein the duty cycles of the first and third switches are identical, and duty cycles of the second and fourth switches are identical.
    Type: Application
    Filed: April 6, 2011
    Publication date: June 14, 2012
    Applicant: Richtek Technology Corporation
    Inventors: WEN-WEI CHEN, Kuo-Chi Liu
  • DIGITAL RIGHTS MANAGEMENT (DRM) METHOD AND APPARATUS IN SMALL AND MEDIUM ENTERPRISE (SME) AND METHOD FOR PROVIDING DRM SERVICE
    Publication number: 20120136749
    Abstract: The present invention proposes a method for providing the user with the customized DRM software by the service provider, wherein a universal DRM system is installed and operated in said service provider, and a standard DRM software template is as well stored in said service provider, when the user makes a request for customizing DRM software to the service provider, a customized DRM software is generated from the standard DRM software template and a universal Rights Object of this use is generated; then the customized DRM software and the universal Rights Object are sent to this user. The customized DRM software operates in the user's system containing at least one client and server.
    Type: Application
    Filed: July 17, 2009
    Publication date: May 31, 2012
    Applicant: ALCATEL- LUCNET SHANGHAI BELL CO., LTD
    Inventors: Zhiyuan Hu, Wen Wei, Xiaorong Jin, Zhigang Luo
  • Method and apparatus to provide power to a backplane
    Patent number: 8189343
    Abstract: Embodiments are generally direct to a method and apparatus to provide power to a backplane. In one embodiment, a method is implemented in a backplane to receive power through an upper zone of the backplane. The power is provided by a rear transition power entry module (RT-PEM) operatively coupled to an interface in the upper zone. The power provided by the RT-PEM is routed to interfaces in a lower zone of the backplane. Each lower zone interface distributes at least a portion of the power to a component operatively coupled to the backplane.
    Type: Grant
    Filed: December 28, 2004
    Date of Patent: May 29, 2012
    Assignee: Intel Corporation
    Inventors: Wen Wei, Ron W. Smith, Jagadeesh Radhakrishnan
  • Strong interconnection post geometry
    Patent number: 8178970
    Abstract: A flip-chip packaging assembly and integrated circuit device are disclosed. An exemplary flip-chip packaging assembly includes a first substrate; a second substrate; and joint structures disposed between the first substrate and the second substrate. Each joint structure comprises an interconnect post between the first substrate and the second substrate and a joint solder between the interconnect post and the second substrate, wherein the interconnect post exhibits a width and a first height. A pitch defines a distance between each joint structure. The first height is less than half the pitch.
    Type: Grant
    Filed: November 23, 2009
    Date of Patent: May 15, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Wei Shen, Chen-Shien Chen, Chen-Cheng Kuo, Chih-Hua Chen, Ching-Wen Hsiao
  • Insertion apparatus for aligning cage of intervertebral fusion
    Patent number: 8177844
    Abstract: An apparatus for inserting an intervertebral fusion cage includes a dilatation set, a guiding set and an insert set. The dilatation set includes first and second dilatation barrels non-rotationally and telescopically connected to each other. The guiding set includes first and second guiding tubes provided around the first and second dilatation barrels. The second guiding tube includes a guiding hole defined therein and a smooth arched face formed thereon in the guiding hole. The insert set includes a leading rod inserted in the second guiding tube and a push rod pivotally connected to at the leading rod. The intervertebral fusion cage is located in the second guiding tube. The fusion cage is movable out of the second guiding tube along the smooth face and the guiding hole to shorten surgery time and position the fusion cage precisely.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: May 15, 2012
    Assignee: National Yang-Ming University
    Inventors: Yang-Hwei Tsuang, Cheng-Kung Cheng, Hung-Wen Wei, Chang-Jung Chiang, Ping-Sheng Yu
  • CONTROL CIRCUIT AND METHOD FOR A CURRENT MODE CONTROLLED POWER CONVERTER
    Publication number: 20120105030
    Abstract: A control circuit and method for a current mode controlled power converter to convert an input voltage into an output voltage, dynamically adjust the peak or the valley of a ramp signal depending on either or both of the input voltage and the output voltage. Under different conditions of the input voltage and the output voltage, the current mode controlled power converter can generate stable output voltages with an invariant inductor and an invariant compensation circuit, without sub-harmonic which otherwise may happen.
    Type: Application
    Filed: October 25, 2011
    Publication date: May 3, 2012
    Applicant: RICHTEK TECHNOLOGY CORP.
    Inventors: WEN-WEI CHEN, KUO-CHI LIU
  • Body massager with illumination effects
    Patent number: 8147435
    Abstract: The present invention discloses a massage apparatus having a housing with a massage formation for contacting a body part of a user. A massage mechanism is oriented within the housing for imparting a massage effect to the massage formation. A light source is provided on the massage formation for conveying an illumination effect from the massage formation. A partially translucent massager is disclosed for providing a visual effect of the underlying massage operation. Further, a roller massage assembly is provided wherein a load imparted to a roller is distributed directly to a structure of the massager for preventing distribution of the load to the massage mechanism.
    Type: Grant
    Filed: August 12, 2008
    Date of Patent: April 3, 2012
    Assignee: FKA Distributing Co.
    Inventors: Roman S. Ferber, Huang Wen Wei
  • Radio Frequency Signal Control Module and Radio Frequency Signal Controlling Method
    Publication number: 20120071108
    Abstract: A radio frequency (RF) signal control module is provided. The RF signal control module includes a detection and control device detecting at least one radio coupling value in a transmission band according to a radio coupling signal and generating a control signal for controlling transmission power an RF signal to be transmitted according to the detected radio coupling value.
    Type: Application
    Filed: May 23, 2011
    Publication date: March 22, 2012
    Applicant: MEDIATEK INC.
    Inventors: Wen-Wei Yang, Da-Wei Sung
  • Thin film solar cell structure and fabricating method thereof
    Publication number: 20120024366
    Abstract: A thin film solar cell structure and the fabricating method thereof are disclosed. A passivation layer is embedded into the thin film solar cell structure to be in contact with an absorbing layer. The interface trap density of the absorbing layer is reduced by the surface electric field of the passivation layer. The invention helps improve the power conversion efficiency and protect the absorbing layer.
    Type: Application
    Filed: October 26, 2010
    Publication date: February 2, 2012
    Applicant: NATIONAL TAIWAN UNIVERSITY
    Inventors: Chee Wee Liu, Wen Wei Hsu, Tzu Huan Cheng, Wei Shuo Ho
  • BACKLIGHT MODULE OF LIQUID CRYSTAL DISPLAY DEVICE
    Publication number: 20120025712
    Abstract: The disclosure provides a backlight module applied to a liquid crystal display device. The backlight module includes: a control circuit for outputting a driving signal according to an analog adjustment signal or a digital adjustment signal; a driving circuit for outputting a lamp voltage according to the driving signal; a fluorescent lamp set, including a plurality of lamps, for receiving the lamp voltage and thereby generating a lamp current; a lamp feedback circuit c for outputting a feedback signal according to the lamp voltage; and a dynamic protection circuit, for dynamically adjusting a protection command signal according to the analog dimming signal or the digital dimming signal, comparing the protection command signal and the feedback signal and thereby outputting a comparing result signal to the control circuit.
    Type: Application
    Filed: June 22, 2011
    Publication date: February 2, 2012
    Applicant: AU OPTRONICS CORP.
    Inventors: Shih-Wen Wei, Tsung-Shiun Lee, Yun-Pei Huang, Chun-Liang Kuo
  • BILATERAL UPPER LIMBS MOTOR RECOVERY REHABILITATION AND EVALUATION SYSTEM FOR PATIENTS WITH STROKE
    Publication number: 20120029391
    Abstract: A Bilateral Upper Limbs Motor Recovery Rehabilitation and Evaluation System for Patients with Stroke which gets feedback from the feeling of body about sense of sight or auditory sense, etc to let inspector's pair of hands process forward, back, drawing and multiple actions, and let strokes can execute task training of kinematic parameter diversification about multiple strength, spped, acceleration, etc to process rehabilitation that relate to the action-status of body and estimate the status of restoration. Devices of file at least includes a pair of double-axle connecting rod structure for upper limbs, an unit for physiological signal collection, an unit for processing estimated of rehabilitation and an unit of multimedia display.
    Type: Application
    Filed: September 24, 2010
    Publication date: February 2, 2012
    Inventors: Wen-Hsu Sung, Shun-Hua Wei, Chueh-Ho Lin, Wen-Wei Tsai, Yu-Da Chen
  • RADIO FREQUENCY SIGNAL PROCESSING CIRCUIT AND QUADRATURE POWER AMPLIFIER
    Publication number: 20120021697
    Abstract: A quadrature power amplifier capable of operating in a single-output mode and a multiple-output mode. When operating in the single-output mode, a first quadrature coupler receives a first input signal, and splits and phase-shifts the first input signal into two first split signals. A first power amplifier receives and amplifies one of the two first split signals to generate a first amplified signal. The second power amplifier receives and amplifies the other one of the two first split signals to generate a second amplified signal. The second quadrature coupler receives the first amplified signal and the second amplified signal, and phase-shifts and combines the first amplified signal and the second amplified signal into a first output signal.
    Type: Application
    Filed: July 22, 2011
    Publication date: January 26, 2012
    Applicant: MEDIATEK INC.
    Inventor: Wen-Wei Yang
  • Recessed Pillar Structure
    Publication number: 20120012997
    Abstract: A bump structure that may be used to interconnect one substrate to another substrate is provided. A recessed conductive pillar is formed on a first substrate such that the recessed conductive pillar has a recess formed therein. The recess may be filled with a solder material. A conductive pillar on a second substrate may be formed having a contact surface with a width less than or equal to a width of the recess. The first substrate may be attached to the second substrate such that the conductive pillar on the second substrate is positioned over or in the recess of the first substrate. The substrates may each be an integrated circuit die, an interposer, a printed circuit board, a high-density interconnect, or the like.
    Type: Application
    Filed: July 13, 2010
    Publication date: January 19, 2012
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Wei Shen, Yao-Chun Chuang, Chen-Shien Chen, Ming-Fa Chen