Patents by Inventor Wen Wei

Wen Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8097083
    Abstract: An operating method for a large dimension plasma enhanced atomic layer deposition cavity and an apparatus thereof are provided. The present invention reduces the time needed for filling the manufacturing gas into the large volume manufacturing cavity. Therefore, the plasma enhanced atomic layer deposition apparatus can switch the precursors rapidly to increase the thin film deposition rate, reduce the manufacturing gas consumption and lower the manufacturing cost.
    Type: Grant
    Filed: October 6, 2005
    Date of Patent: January 17, 2012
    Assignee: China Star Optoelectronics International (HK) Limited
    Inventors: Hung-Wen Wei, Hung-Che Ting
  • Publication number: 20110308049
    Abstract: A wire fastening band is made by a soft material and can be sheathed on a wire by using a commissure formed on a sleeve. The sleeve is extended with a wrapping member to fix and fasten the collected wire. The sleeve on the wire is also formed with a first fastening member, a second fastening member, and a first corresponding fastening member. The first fastening member is fastened with the first corresponding fastening member to fix the sheathed wire, and then the second fastening member is fastened with a second corresponding fastening member on the wrapping member to quickly and conveniently fix and fasten the collected wire.
    Type: Application
    Filed: March 18, 2008
    Publication date: December 22, 2011
    Inventor: Wen-Wei Sun
  • Publication number: 20110291262
    Abstract: A device includes a work piece including a metal bump; and a dielectric layer having a portion directly over the metal bump. The metal bump and a surface of the portion of the dielectric layer form an interface. A metal finish is formed over and contacting the metal bump. The metal finish extends from over the dielectric layer to below the interface.
    Type: Application
    Filed: May 28, 2010
    Publication date: December 1, 2011
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Wei Shen, Chen-Shien Chen, Chen-Cheng Kuo, Ming-Fa Chen, Rung-De Wang
  • Publication number: 20110285023
    Abstract: A bump structure that may be used to interconnect one substrate to another substrate is provided. A conductive pillar is formed on a first substrate such that the conductive pillar has a width different than a contact surface on a second substrate. In an embodiment the conductive pillar of the first substrate has a trapezoidal shape or a shape having tapered sidewalls, thereby providing a conductive pillar having base portion wider than a tip portion. The substrates may each be an integrated circuit die, an interposer, a printed circuit board, a high-density interconnect, or the like.
    Type: Application
    Filed: May 20, 2010
    Publication date: November 24, 2011
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Wei Shen, Ying-Ching Shih, Chen-Shien Chen, Ming-Fa Chen
  • Publication number: 20110272976
    Abstract: A tattoo chair, comprises a backrest (1), a seat (2), a brace (3) for supporting the said seat (2), and a base (4) for allowing the chair to stand stably, the lower end of the said backrest (1) is rotatablely attached to the inner side of the said seat (2); a supporting fixed plate (5) is provided under the bottom surface of the said seat (2); at least one fixed gear rack (10) is mounted from top to bottom on the rear surface of the said backrest (1); a supporting rod (50) is provided on the said supporting fixed plate (5); one end of the said supporting rod (50) is rotatablely attached to the said supporting fixed plate (5), and the other end is put into one of grooves of the said gear rack (10) on the rear surface of the said backrest (1).
    Type: Application
    Filed: September 22, 2008
    Publication date: November 10, 2011
    Inventors: Wen Wei, Michael Chen, Billy Chen
  • Patent number: 8054637
    Abstract: A electronic device (100) includes a removable chip card (40) for carrying information, comprise a housing (10) and a ejecting mechanism (30). The housing (10) defines a chamber (12) and a base (14) formed adjacent to the chamber. The chamber (12) is used for accommodating a battery (20) therein. The base (14) is used for receiving the chip card (40) therewith. The ejecting mechanism (30) is mounted in the housing (10) and includes a sliding member (32) and an elastic member (36). When the battery (20) is accommodated in the chamber (12), the chip card (40) is secured between the sliding member (32) and the battery (20). When the battery (20) is removed from the chamber (12), the elastic member (36) biases the sliding member (32) to eject the chip card (40) outwardly from the base (14).
    Type: Grant
    Filed: December 3, 2008
    Date of Patent: November 8, 2011
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Zhong-Shu Qin, Hsiao-Hua Tu, Wen-Wei Song, Jun Wang, Ye Liu, Xu-Ri Zhang
  • Patent number: 8055317
    Abstract: A sliding mechanism includes a first plate (32) having a sliding slot (322) and a control slot (325) defined therein. The sliding slot and the control slot having a certain angle therebetween and communicating with each other. A second plate (38) is longitudinally slidably connected to the first plate. The second plate including a sliding member (381) formed on a surface thereof facing the first plate. The sliding member engages with the sliding slot and includes an elastic positioning assembly (389). A control assembly (34) is slidably received in the control slot. A main elastic member (36) has one end thereof being fixed to one end of the sliding slot, the other end thereof being fixed with the sliding member. A portable electronic device (100) using the sliding mechanism is also disclosed.
    Type: Grant
    Filed: December 3, 2008
    Date of Patent: November 8, 2011
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Jun Wang, Hsiao-Hua Tu, Gang Yang, Wen-Wei Song, Peng Zhao
  • Patent number: 8038579
    Abstract: A system for training and evaluating bilateral symmetric force output of upper limbs has a force application unit of bilateral upper limbs, a movable link unit, a signal conversion unit, a computing unit and a driving unit. The force application unit of bilateral upper limbs has at least two force sensors. When stroke patients perform training, the system can instantaneously measure values of forces exerted by users and sensed by the sensors, and determine if the movable link unit is driven according to a pre-configured training pattern, so that both hands of patients are allowed to perform training movements pushing forward and pulling backward to promote training mechanism of dual-brain hemisphere organization and improve moving capability of upper limb of affected side.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: October 18, 2011
    Assignee: National Yang Ming University
    Inventors: Shun-Hwa Wei, Wen-Hsu Sung, Wen-Wei Tsai, Hsiu-Wen Tseng
  • Patent number: 8026766
    Abstract: A power circuit for a power amplifier which operates in an inactive period and an active period is provided and includes a power supply unit, a current limiting unit, a storage unit, and a converting unit. The power supply unit provides a first current. The current limiting unit is arranged to process the first current to generate a second current. The storage unit is arranged to provide a storage voltage. The storage unit is charged by the second current during the inactive period and discharged by a third current during the active period. The converting unit provides an active power to the power amplifier according to the storage voltage, the second current, and the third current during the active period.
    Type: Grant
    Filed: March 30, 2009
    Date of Patent: September 27, 2011
    Assignee: Mediatek Inc.
    Inventors: Long-Kun Yu, Wen-Wei Yang
  • Publication number: 20110230577
    Abstract: There is described an isocyanate-based polymer foam having improved anti-yellowing properties. The foam produced from a formulation comprising an isocyanate, a blowing agent, a first active hydrogen-containing compound and a second active hydrogen-containing compound different than the first active hydrogen-containing compound. The second active hydrogen-containing compound comprises an active hydrogen-containing phosphite compound. A process for producing such a foam is also described.
    Type: Application
    Filed: May 31, 2011
    Publication date: September 22, 2011
    Applicant: PROPRIETECT L.P.
    Inventors: WEN WEI ZHAO, MLADEN VIDAKOVIC, EUGENE SMEIANU
  • Patent number: 8021022
    Abstract: A lighting structure adapted to be disposed at an electronic apparatus is provided. The lighting structure includes a lighting module, a first elastic element, a latch, and a second elastic element. The lighting module has a light source and a stopper element. The first elastic element is connected to the lighting module. The latch has an interfering portion for blocking the stopper element and is capable of sliding in the electronic apparatus. The second elastic element is connected to the latch. When the latch is subjected to an external force and slides to deform the second elastic element, the stopper element disengages from the interfering portion, and the first elastic element rotates the lighting module, such that the lighting module is at a different position, and the light source is used to illuminate part of the electronic apparatus.
    Type: Grant
    Filed: July 10, 2008
    Date of Patent: September 20, 2011
    Assignee: Compal Electronics, Inc.
    Inventors: Kuo-Nan Ling, Wen-Wei Yang, Chih-Lung Hung, Wen-Chuan Su
  • Patent number: 8017941
    Abstract: A method of manufacturing a MESFET using ceramic materials includes providing a substrate; providing a ceramic semiconductor material to apply onto the substrate to form a first ceramic semiconductor layer; providing a ceramic semiconductor material which is blended with ions, wherein the ceramic semiconductor material is applied onto a central part of the first ceramic semiconductor layer to form a second ceramic semiconductor layer with ions; providing another ion-mixed ceramic semiconductor material is provided to apply over both sides of the first ceramic semiconductor layer to form a third ceramic semiconductor layer having ions; and respectively plating the second and third ceramic semiconductor layers with metal layers so that the second ceramic semiconductor layer has a gate electrode and the third ceramic semiconductor layer has a source and a drain. A transistor obtained by this method can be put into broader range of applications compared to III-V group transistor.
    Type: Grant
    Filed: October 29, 2008
    Date of Patent: September 13, 2011
    Assignee: Yuan Ze University
    Inventors: Chau-Kuang Liau, Wen-Wei Chou
  • Publication number: 20110217841
    Abstract: A method of forming a through silicon via (TSV) structure includes forming an interconnect pad over a substrate. An under layer is formed over the interconnect pad. A vertical conductive post is formed at least partially through the substrate. At least one dummy structure is formed at least partially through the under layer. A top pad is formed over the dummy structure and the vertical conductive post. The top pad covers a wider area than a cross section of the vertical conductive post. The interconnect pad is electrically connected to the top pad. The dummy structure connects the top pad and the under layer thereby fastening the top pad and the interconnect pad.
    Type: Application
    Filed: May 20, 2011
    Publication date: September 8, 2011
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chih-Hua CHEN, Chen-Shien CHEN, Chen-Cheng KUO, Wen-Wei SHEN
  • Patent number: 8013351
    Abstract: A leak-proof LED (Light Emitting Diode) base structure includes a ceramic substrate and a ceramic reflection ring. The ceramic reflection ring is coupled to the ceramic substrate by a heat-resistant epoxy resin to prevent encapsulant filled in an LED base from flowing out through a junction between the ceramic reflection ring and the ceramic substrate. A groove for receiving an overflow of the heat-resistant epoxy resin is formed on a coupling surface of the ceramic reflection ring. The ceramic reflection ring has a polished reflecting surface for reflecting light emitted by an LED die so as to increase luminosity of the light emitted by the LED. A lens positioning portion is formed on the top of the polished reflecting surface for allowing a lens to be precisely aligned with the ceramic reflection ring, enhancing preciseness of lens assembly, and improving resultant optical configuration of the light emitted by the LED.
    Type: Grant
    Filed: April 29, 2009
    Date of Patent: September 6, 2011
    Assignee: TCST Tech Co., Ltd.
    Inventors: Sheng Yan Hsiao, Hsiao Wen Wei, Chung Ching Lin
  • Publication number: 20110204174
    Abstract: A single pull wire winding device comprises a wire winding reel; the wire winding reel has two recesses respectively on both surfaces thereof for containing a flexible printed board and a coil spring, the wire winding reel having a peripheral groove on its periphery for containing a power connection wire, and a bulkhead on one side of the peripheral groove has at least one stopping portion; a switch is provided within the containing groove along a tangential direction of the wire winding reel so that the stopping block of the switch engages with the stopping portion of the wire winding reel to stop the rotation of the wire winding reel. Thus, the present invention, wherein a flatter flexible printed board is used to substitute for a portion of a thicker power connection wire to reduce the volume of the assembled device, is widely applied to various electronic products.
    Type: Application
    Filed: February 23, 2010
    Publication date: August 25, 2011
    Applicants: WANG WANG DAH ENTERPRISE CO., LTD., DONG GUAN TOP DEN ELECTRONICS LIMITED COMPANY
    Inventor: WEN-WEI SUN
  • Patent number: 8001524
    Abstract: A system uses software to perform a first portion of a linked list traversal process, where the first portion obtains a pointer that corresponds to a key and where the pointer points into a linked list. The system further uses hardware and the obtained pointer to perform a second portion of the linked list traversal process, where the second portion locates data from the linked list that is associated with the key.
    Type: Grant
    Filed: July 19, 2006
    Date of Patent: August 16, 2011
    Assignee: Juniper Networks, Inc.
    Inventors: Wen Wei, Dongping Luo, Lidong Zhao
  • Publication number: 20110156685
    Abstract: The present invention discloses a constant time buck-boost switching regulator, and a control circuit and a method for controlling the buck-boost switching regulator. The buck-boost switching regulator includes an inductor, a first and a second power switches coupled to a first end and a second end of the inductor respectively, and a first and a second power devices coupled to the first end and the second end of the inductor respectively, the first power switch being coupled between the first end of the inductor and an input voltage, the second power switch being coupled between the second end of the inductor and ground, the first power device being coupled between the first end of the inductor and ground, and the second power device being coupled between the second end of the inductor and an output voltage.
    Type: Application
    Filed: December 29, 2009
    Publication date: June 30, 2011
    Inventors: Wen-Wei Chen, Kuo-Chi Liu
  • Patent number: 7969013
    Abstract: A through silicon via structure includes a top pad and a vertical conductive post that is connected to the top pad. The top pad covers a wider area than the cross section of the vertical conductive post. An interconnect pad is formed at least partially below the top pad. An under layer is also formed at least partially below the top pad. At least one dummy structure connects the top pad and the under layer to fasten the top pad and the interconnect pad.
    Type: Grant
    Filed: June 2, 2010
    Date of Patent: June 28, 2011
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hua Chen, Chen-Shien Chen, Chen-Cheng Kuo, Wen-Wei Shen
  • Publication number: 20110146031
    Abstract: An ear hanger for fixing a transmission line comprises a frame, a first containing section, a second containing section and a third containing section. The frame includes a hook portion and an abutting portion. The hook portion is formed at the upper end of the frame. The abutting portion is formed at the lower end of the frame. The first containing section is shaped along the hook portion and has a first opening. The second containing section is shaped along the abutting portion and has a second opening. The third containing section is shaped along the abutting portion, located between the first containing section, and the third containing section has a third opening. The third opening is opened on the side opposite to the positions where the first opening and the second opening are opened. Thus, the transmission line can be firmly mounted and is not easy to fall off.
    Type: Application
    Filed: December 18, 2009
    Publication date: June 23, 2011
    Applicants: WANG WANG DAH ENTERPRISE CO., LTD., DONG GUAN TOP DEN ELECTRONICS LIMITED COMPANY
    Inventor: WEN-WEI SUN
  • Publication number: 20110136626
    Abstract: A system for training and evaluating bilateral symmetric force output of upper limbs has a force application unit of bilateral upper limbs, a movable link unit, a signal conversion unit, a computing unit and a driving unit. The force application unit of bilateral upper limbs has at least two force sensors. When stroke patients perform training, the system can instantaneously measure values of forces exerted by users and sensed by the sensors, and determine if the movable link unit is driven according to a pre-configured training pattern, so that both hands of patients are allowed to perform training movements pushing forward and pulling backward to promote training mechanism of dual-brain hemisphere organization and improve moving capability of upper limb of affected side.
    Type: Application
    Filed: December 8, 2009
    Publication date: June 9, 2011
    Applicant: NATIONAL YANG MING UNIVERSITY
    Inventors: Shun-Hwa WEI, Wen-Hsu SUNG, Wen-Wei TSAI, Hsiu-Wen TSENG