Abstract: A slide rail assembly includes a first rail, a second rail, an auxiliary member, a blocking member and an operating member. The auxiliary member is arranged on the second rail. The blocking member is pivotally connected to the second rail. When the second rail is located at an extended position relative to the first rail, a blocking feature on the first rail blocks the blocking member in a first state for preventing the second rail from displacing away from the extended position along a retracting direction. When the operating member moves from a first operating position to a second operating position to drive the blocking member to move to a second state, the blocking feature does not block the blocking member in the second state, and the operating member engages with a predetermined portion of the auxiliary member to retain the operating member at the second operating position.

Abstract: An electrostatic discharge circuit includes a discharge switch, a first trigger circuit and a second trigger circuit. A first terminal of the discharge switch is coupled to a first power domain, and a second terminal of the discharge switch is coupled to a second power domain. The first trigger circuit is coupled between the first terminal and a control terminal of the discharge switch. The second trigger circuit is coupled between the second terminal and the control terminal. When an electrostatic discharge voltage occurs in the first power domain, the second trigger circuit is configured to form a conduction voltage between the second terminal and the control terminal to turn on the discharge switch. When the electrostatic discharge voltage occurs in the second power domain, the second trigger circuit is configured to short the second terminal and the control terminal to turn on the discharge switch.

Abstract: A method of forming a semiconductor structure includes forming a fin over a semiconductor substrate, forming an isolation region on sidewalls of the fin, forming a metal gate over the fin and the isolation region, etching the metal gate to form a trench through the isolation region, passivating the top portion of the semiconductor substrate exposed in the trench to form a dielectric layer at a bottom of the trench, and depositing a dielectric material in the trench to form a dielectric structure. The dielectric structure divides the metal gate into two sections.

Abstract: In some embodiments, the present disclosure relates to a method of forming an integrated chip including forming a ferroelectric layer over a bottom electrode layer, forming a top electrode layer over the ferroelectric layer, performing a first removal process to remove peripheral portions of the bottom electrode layer, the ferroelectric layer, and the top electrode layer, and performing a second removal process using a second etch that is selective to the bottom electrode layer and the top electrode layer to remove portions of the bottom electrode layer and the top electrode layer, so that after the second removal process the ferroelectric layer has a surface that protrudes past a surface of the bottom electrode layer and the top electrode layer.

Abstract: There is provided an auto detection system including a thermal detection device and a host. The host controls an indication device to indicate a prompt message or detection results according to a slope variation of voltage values or 2D distribution of temperature values detected by the thermal detection device, wherein the voltage values include the detected voltage of a single pixel or the sum of detected voltages of multiple pixels of a thermal sensor.

Abstract: A low-temperature smoking body and a preparation method thereof are disclosed. The low-temperature smoking body includes tobacco particles. The tobacco particle includes a particle body and a shell wrapped on the particle body. A carrier is distributed in the particle body and/or the shell. The carrier includes at least one of a raw tobacco material, a non-tobacco material, and a porous material. The carrier carries a smoking agent, and the smoking agent includes a tobacco extract and/or an atomizer. In addition, a preparation method of the low-temperature smoking body is further disclosed. The low-temperature smoking body has better smoking stability and uniformity, and the tobacco particles having core-shell structures can effectively solve the problem of liquid leakage.

Abstract: An imaging lens assembly has an optical axis and includes a plastic lens element set. The plastic lens element set includes two plastic lens elements and at least one anti-reflective layer. The two plastic lens elements, in order from an object side to an image side along the optical axis are a first plastic lens element and a second plastic lens element. The anti-reflective layer has a nanostructure and is disposed on at least one of an image-side surface of the first plastic lens element and an object-side surface of the second plastic lens element.

Abstract: The invention discloses a glass carrier having a protection structure, comprising a glass body and a protection layer. The glass body has a top surface, a bottom surface, and a lateral surface. The protection layer covers the lateral surface of the glass body. The protection layer is a hard material with a stiffness coefficient higher than a stiffness coefficient of the glass body. The invention further discloses a manufacturing method of a glass carrier having a protection structure, comprising the following steps: covering the protection layer around the lateral surface of the glass body, wherein the protection layer is the hard material with the stiffness coefficient higher than the stiffness coefficient of the glass body.

Abstract: An electronic device includes a back board, plurality of light emitting units arranged on the base, an optical film arranged on the plurality of light emitting units, and a reflective component arranged on the base and including a first surface. The back board includes a base, a side portion, and a top portion, wherein in a cross section view, an extension direction of the side portion is different from an extension direction of the base and an extension direction of the top portion; wherein an end of the side portion is connected to the base and another end of the side portion is connected to the top portion.

Abstract: A method, computer system, and program product facilitate identification of error image labels in training data. The method comprises: evenly dividing a training dataset into N subsets, where the training dataset includes M data items each comprising a pair of image and its original image label; training a prediction model to label images by respectively using each of the N subsets as training data to generate N respective trained prediction models; respectively using each of the N trained prediction models trained by using one of the N subsets as training data to label the images in other N?1 subsets of the N subsets to generate N?1 prediction labels for each of the M images in the training dataset. For each image in the M data items, whether the original image label of the image is a potential error image label is based on the N?1 prediction labels of the image.

Abstract: A system of assisting in building machine learning model without programming and a method thereof is disclosed. A machine learning model building host provides an interactive question-and-answer area corresponding to a step process being executed, through an operation interface; the machine learning model building host provides a query message to an artificial intelligence platform through the Interactive question-and-answer area of an application programming interface, and the artificial intelligence platform provides the query message to a large language model to generate an answer message, the artificial intelligence platform transmits the answer message to the machine learning model building host, through the application programming interface, so as to achieve the technical effect of assisting in building a machine learning model without programming.

Abstract: A method includes bonding a supporting substrate to a semiconductor substrate of a wafer. A bonding layer is between, and is bonded to both of, the supporting substrate and the semiconductor substrate. A first etching process is performed to etch the supporting substrate and to form an opening, which penetrates through the supporting substrate and stops on the bonding layer. The opening has substantially straight edges. The bonding layer is then etched. A second etching process is performed to extend the opening down into the semiconductor substrate. A bottom portion of the opening is curved.

Abstract: A deposition system is provided capable of measuring at least one of the film characteristics (e.g., thickness, resistance, and composition) in the deposition system. The deposition system in accordance with the present disclosure includes a substrate process chamber. The deposition system in accordance with the present disclosure includes a substrate pedestal in the substrate process chamber, the substrate pedestal configured to support a substrate, and a target enclosing the substrate process chamber. A shutter disk including an in-situ measuring device is provided.

Abstract: The present disclosure relates to an integrated chip including a substrate and a pixel. The pixel includes a photodetector. The photodetector is in the substrate. The integrated chip further includes a first inner trench isolation structure and an outer trench isolation structure that extend into the substrate. The first inner trench isolation structure laterally surrounds the photodetector in a first closed loop. The outer trench isolation structure laterally surrounds the first inner trench isolation structure along a boundary of the pixel in a second closed loop and is laterally separated from the first inner trench isolation structure. Further, the integrated chip includes a scattering structure that is defined, at least in part, by the first inner trench isolation structure and that is configured to increase an angle at which radiation impinges on the outer trench isolation structure.

Abstract: An optical lens assembly includes at least four optical lens elements being, in order from an object side of the optical lens assembly to an image side thereof, a first optical lens element, a second optical lens element, a third optical lens element and a fourth optical lens element. At least one of the at least four optical lens elements is a filter lens element, the filter lens element includes a near-infrared light filter coating membrane, the filter lens element is made of a glass material, and the filter lens element has at least one aspheric surface. The near-infrared light filter coating membrane includes at least one low refractive index layer and at least one high refractive index layer, and the near-infrared light filter coating membrane is formed by alternately stacking the at least one high refractive index layer and the at least one low refractive index layer.

Abstract: This application provides a hinge mechanism and an electronic device. One example hinge mechanism includes a base, and a first rotating assembly and a second rotating assembly that are respectively disposed on two sides of the base. When the first rotating assembly and the second rotating assembly rotate toward each other, a length of the hinge mechanism may be increased; or when the first rotating assembly and the second rotating assembly rotate opposite to each other, a length of the hinge mechanism may be shortened, and a support surface for supporting a flexible display can be formed.

Abstract: A display device, including a pixel array substrate, a display layer, and a driving circuit, is provided. The pixel array substrate includes a support plate, a pixel circuit array disposed on a first surface of the support plate, first and second transmission pillars, and first and second transmission lines disposed on a second surface of the support plate. The first transmission pillars are located between the pixel circuit array and a first edge of the support plate. The second transmission pillars are located between the pixel circuit array and a second edge of the support plate. The first transmission lines are respectively connected to the first transmission pillars. The second transmission lines are respectively connected to the second transmission pillars. The display layer overlaps with the first and second transmission lines. The first transmission lines and the second transmission lines are electrically connected to the driving circuit.

Abstract: An aerial vehicle configured for operation within indoor spaces has a meshed construction with a housing defined by upper and lower sections having meshes provided above and below propellers and motors of the aerial vehicle. The aerial vehicle also includes a suite of sensors such as LIDAR sensors, time-of-flight sensors, cameras, ultrasonic sensors, or others. Meshes of the upper and lower sections include central openings along with spokes and concentric rings provided about the central openings. Meshes of the lower section have substantially larger central openings than meshes of the upper section, but feature more dense spokes or concentric rings beneath tips of the rotating propellers, which may be hinged or foldable in nature. Data captured by sensors of the aerial vehicle may be utilized for any purpose, such as to generate environment maps of an indoor space, or to monitor the indoor space for adverse conditions or events.

Abstract: An optical measurement system measuring optical parameters of an object is provided. The object includes at least two light-transmitting layers. The optical measurement system includes a light source module, an image capture module, and a controller. The light source module emits at least two measurement light beams toward the object. The measurement light beams are respectively incident on the object at different angles. The image capture module receives light spots formed on a sensing surface of the image capture module by at least two first light beams after the measurement light beams are reflected by the object and at least two second light beams after the measurement light beams are refracted and reflected between the object. The controller is electrically connected to the image capture module to obtain positions of the light spots. The controller calculates the optical parameters of the object according to the positions of the light spots.