Patents by Inventor Wen Yu

Wen Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250120097
    Abstract: A memory device includes a two-dimensional array of access transistors located on a semiconductor substrate; metal interconnect structures embedded in dielectric material layers and electrical connected to electrical nodes of the access transistors; and a two-dimensional array of resistive memory structures embedded in the dielectric material layers. The metal interconnect structures include two first source lines located at a first metal line level and laterally extending along a first horizontal direction; a second source line located at a second metal line level and laterally extending along the first horizontal direction; and a vertical connection structure including a plurality of interconnection via structures and at least one line-level metal structure and providing a vertical electrical connection between the two first source lines and the second source line.
    Type: Application
    Filed: April 8, 2024
    Publication date: April 10, 2025
    Inventors: Sheng-Hung Shih, Kuo-Chi Tu, Wan-Chen Chen, Tzu-Yu Chen, Wen-Ting Chu
  • Publication number: 20250118912
    Abstract: A bus connection cable reverse-welding structure includes a circuit board, a flat cable, and a first line. The circuit board includes a wiring side, an insertion side, a welding area, a first mating area. A wire exit direction is defined from the wiring side toward the insertion side. The welding area is on the wiring side, and the first mating area is on the insertion side. The flat cable includes a main segment, an attached segment, and a welding end. The main segment extends along the wire exit direction, and the attached segment is attached on the circuit board. The welding end is electrically connected to the welding area. The first line is arranged in the circuit board and includes a first embedded segment and a first extension segment. The first embedded segment is embedded in the circuit board and connected to the welding area.
    Type: Application
    Filed: November 30, 2023
    Publication date: April 10, 2025
    Inventors: Wen-Yu WANG, Chieh-Ming CHENG
  • Publication number: 20250115846
    Abstract: The invention provides an automatic stirring device in the field of fluid machinery and bioreactors, focusing on enhancing fluid control efficiency and consistency in biological cultivation processes. It utilizes a flexible channel body or reactor body to facilitate the flow of nutrient solution along specific channels (such as S-shaped flexible channels or S-shaped loop channels), designed to reduce shear forces and achieve iso-level uniform flow. A power system and monitoring and control system are employed to regulate the flow of nutrient solution and monitor cultivation conditions in real-time, thus supporting various bioprocess cultivation requirements.
    Type: Application
    Filed: October 4, 2024
    Publication date: April 10, 2025
    Inventors: Wen Quan WANG, Lei TANG, Xiu WANG, Xin Yu WEI, Yan YAN, Chao ZHANG
  • Publication number: 20250118913
    Abstract: A bus connection wire forward soldering structure includes a circuit board, a flat cable and a fixing member, and the circuit board has a solder area, a docking area, first and second surfaces and an outgoing line direction. The solder area is disposed on the first surface, the flat cable includes a solder terminal, first and second attaching sections, a folding section and a main body section, the solder terminal faces the docking area and is electrically connected to the solder area, the folding section is connected between the first and second attaching sections, the main body section extends along the outgoing line direction, the fixing member covers the solder terminal, the folding section, the first and second attaching sections, the fixing member has a notch defined corresponding to the second surface and located at junction of the second attaching section and the main body section junction.
    Type: Application
    Filed: November 30, 2023
    Publication date: April 10, 2025
    Inventors: Wen-Yu WANG, Chieh-Ming CHENG
  • Publication number: 20250116938
    Abstract: A method includes: forming a mask layer on a semiconductor wafer; forming a tin droplet, including: supplying tin to a high-pressure reservoir from a low-pressure reservoir; monitoring a level of tin in the high-pressure reservoir by at least two electrodes attached to the high-pressure reservoir; in response to the level of the tin exceeding a threshold value, supplying the tin to a droplet generator from the high-pressure reservoir; forming the tin droplet by the droplet generator using the tin supplied from the high-pressure reservoir; generating light by the tin droplet; and patterning the mask layer by the light.
    Type: Application
    Filed: October 9, 2023
    Publication date: April 10, 2025
    Inventors: Chi YANG, Po-Yuan YEH, Che-Hsin LIN, Jen Chieh YU, Chung Wen LUO
  • Patent number: 12269118
    Abstract: A laser soldering system using dynamic light spot and a method thereof are provided. A laser module is controlled to radiate toward multi-lens to form a light spot on a soldering target for soldering, and a lens distance between the multi-lens is adjusted to adjust a light spot size. The disclosure may provide multiple heating densities respectively adequate to different soldering status via adjusting the light spot size when using same laser power, so as to improve the soldering quality.
    Type: Grant
    Filed: September 9, 2021
    Date of Patent: April 8, 2025
    Assignee: Delta Electronics, Inc.
    Inventors: Chun-Lien Huang, Wen-Yu Chuang, Keng-Ning Chang, Ting-Yu Lu, Chun-Fei Kung
  • Patent number: 12271541
    Abstract: A system comprises an input device structurally configured to be utilized by an operator to control a medical device. The system further comprises a motion sensor associated with the input device and configured to detect a displacement distance of the input device. The system further comprises a control unit configured to determine a velocity cap defining a maximum velocity of the medical device based on the detected displacement distance. The control system is further configured to control movement of the medical device based on the velocity cap.
    Type: Grant
    Filed: February 7, 2024
    Date of Patent: April 8, 2025
    Assignee: INTUITIVE SURGICAL OPERATIONS, INC.
    Inventors: Nicola Diolaiti, Benjamin L. Lee, Shu-Wen Yu
  • Patent number: 12272592
    Abstract: A high voltage device includes: a semiconductor layer, a well, a bulk region, a gate, a source, and a drain. The bulk region is formed in the semiconductor layer and contacts the well region along a channel direction. A portion of the bulk region is vertically below and in contact with the gate, to provide an inversion region of the high voltage device when the high voltage device is in conductive operation. A portion of the well lies between the bulk region and the drain, to separate the bulk region from the drain. A first concentration peak region of an impurities doping profile of the bulk region is vertically below and in contact with the source. A concentration of a second conductivity type impurities of the first concentration peak region is higher than that of other regions in the bulk region.
    Type: Grant
    Filed: May 15, 2024
    Date of Patent: April 8, 2025
    Assignee: RICHTEK TECHNOLOGY CORPORATION
    Inventors: Kun-Huang Yu, Chien-Yu Chen, Ting-Wei Liao, Chih-Wen Hsiung, Chun-Lung Chang, Kuo-Chin Chiu, Wu-Te Weng, Chien-Wei Chiu, Yong-Zhong Hu, Ta-Yung Yang
  • Patent number: 12273389
    Abstract: A method, computer system, and a computer program product for smart SDN is provided. The present invention may include recording and clustering a pod's behavior to generate a behavior transition model for the pod. The present invention may include watching a behavior of the pod and comparing the behavior to the generated behavior transition model. The present invention may include triggering a network policy change based on determining that the behavior of the pod is a misbehavior.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: April 8, 2025
    Assignee: International Business Machines Corporation
    Inventors: Jeff Hsueh-Chang Kuo, June-Ray Lin, Ying-Chen Yu, Chih-Wen Su
  • Patent number: 12273108
    Abstract: The invention introduces an apparatus and a method for expanding round keys during data encryption. The method includes: configuring a word-processing circuitry to operate in a first mode to calculate a first intermediate calculation result corresponding to an even-number round key according to a last double word of a 0th double word to a 7th double word in each even-number clock cycle starting from a 2nd clock cycle; and configuring the word-processing circuitry to operate in a second mode to calculate a second intermediate calculation result corresponding to an odd-number round key according to the last double word of the 0th double word to the 7th double word in each odd-number clock cycle starting from a 3rd clock cycle. In the first mode, a first data path is formed in the word-processing circuitry, which includes a word split circuitry, a rotate-word circuitry, a substitute-word circuitry, a round-constant circuitry and a word concatenation circuitry.
    Type: Grant
    Filed: May 4, 2023
    Date of Patent: April 8, 2025
    Assignee: SILICON MOTION, INC.
    Inventors: Wun-Jhe Wu, Po-Hung Chen, Chiao-Wen Cheng, Jiun-Hung Yu, Chih-Wei Liu
  • Publication number: 20250111833
    Abstract: A display and a driving method thereof are disclosed. The display includes a plurality of pixel circuits. Each of the pixel circuits includes a display unit, a first scanning transistor, an equivalent boosting capacitor, a second scanning transistor, a third scanning transistor, and a storage capacitor. The display unit receives a first reference constant voltage and is coupled to a first node. The first scanning transistor is coupled to the first node and receives a first scanning signal. The equivalent boosting capacitor is coupled between the first node and a second node. The second scanning transistor is coupled to the second node and receives a second scanning signal. The third scanning transistor is coupled to the second node and receives the first scanning signal. The capacitor is coupled between a first terminal and a second terminal of the third scanning transistor.
    Type: Application
    Filed: December 13, 2024
    Publication date: April 3, 2025
    Applicant: E Ink Holdings Inc.
    Inventors: Wen-Yu Kuo, Kuang-Heng Liang
  • Patent number: 12266593
    Abstract: A semiconductor device includes a substrate, at least one via, a liner layer and a conductive layer. The substrate includes an electronic circuitry. The at least one via passes through the substrate. The at least one via includes a plurality of concave portions on a sidewall thereof. The liner layer fills in the plurality of concave portions of the at least one via. The conductive layer is disposed on the sidewall of the at least one via, covers the liner layer, and extends onto a surface of the substrate. The thickness of the conductive layer on the sidewall of the at least one via is varied.
    Type: Grant
    Filed: August 2, 2023
    Date of Patent: April 1, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Li Yang, Wen-Hsiung Lu, Jhao-Yi Wang, Fu Wei Liu, Chin-Yu Ku
  • Patent number: 12266619
    Abstract: An embodiment package comprises an integrated circuit die encapsulated in an encapsulant, a patch antenna over the integrated circuit die, and a dielectric feature disposed between the integrated circuit die and the patch antenna. The patch antenna overlaps the integrated circuit die in a top-down view. The thickness of the dielectric feature is in accordance with an operating bandwidth of the patch antenna.
    Type: Grant
    Filed: July 26, 2023
    Date of Patent: April 1, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chen-Hua Yu, Kai-Chiang Wu, Chung-Shi Liu, Shou Zen Chang, Chao-Wen Shih
  • Patent number: 12264601
    Abstract: A fluid storage tank can be configured to store a cooling fluid in a liquid state and a gas state. A first heat exchanger can be configured to release heat into the fluid storage tank. A second heat exchanger can be disposed fluidly downstream of the fluid storage tank and configured to exchange heat between the cooling fluid and a heat load. A pressure control device can be disposed fluidly downstream of the second heat exchanger. One of the first cooling fluid that has been heated by the second heat exchanger or a second cooling fluid different than the first cooling fluid can pass through the first heat exchanger and thereby heat upstream first cooling fluid resident in the fluid storage tank.
    Type: Grant
    Filed: February 22, 2023
    Date of Patent: April 1, 2025
    Assignee: Rolls-Royce North American Technologies Inc.
    Inventors: Eugene Charles Jansen, Jeffrey Wen-Yu Chen
  • Publication number: 20250105169
    Abstract: A semiconductor package includes a semiconductor die, an interposer disposed below the semiconductor die, first joints electrically coupling the semiconductor die to the interposer, at least one second joint coupling the semiconductor die to the interposer, and a first underfill disposed between the semiconductor die and the interposer to surround the active and second joints. The semiconductor die includes a first region, a seal ring region surrounding the first region, and a second region between the seal ring region and a die edge. The first joints are located within the first region, and the second joint is disposed at a die corner within the second region and is electrically floating in the semiconductor package.
    Type: Application
    Filed: September 26, 2023
    Publication date: March 27, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Leu-Jen Chen, Wen-Wei Shen, Kuan-Yu Huang, Yu-Shun Lin, Sung-Hui Huang, Hsien-Pin Hu, Shang-Yun Hou
  • Publication number: 20250107268
    Abstract: A plurality of holes in a top surface of a silicon medium form a plurality of sub-meta lenses to result in multiple focal points rather than a single point (resulting from using a single meta lens). As a result, optical paths for incoming light are reduced as compared with a single optical path associated with a single meta lens, which in turn reduces angular response of incident photons. Thus, a pixel sensor including the plurality of sub-meta lenses experiences improved light focus and greater signal-to-noise ratio. Additionally, dimensions of the pixel sensor are reduced (particularly a height of the pixel sensor), which allows for greater miniaturization of an image sensor that includes the pixel sensor.
    Type: Application
    Filed: September 22, 2023
    Publication date: March 27, 2025
    Inventors: Yi-Hsuan WANG, Cheng Yu HUANG, Chun-Hao CHUANG, Keng-Yu CHOU, Wen-Hau WU, Wei-Chieh CHIANG, Chih-Kung CHANG
  • Publication number: 20250098346
    Abstract: An image sensor structure and methods of forming the same are provided. An image sensor structure according to the present disclosure includes a semiconductor substrate including a photodiode, a transfer gate transistor disposed over the semiconductor substrate and having a first channel area, a first dielectric layer disposed over the semiconductor substrate, a semiconductor layer disposed over the first dielectric layer, a source follower transistor disposed over the semiconductor layer and having a second channel area, a row select transistor disposed over the semiconductor layer and having a third channel area, and a reset transistor disposed over the semiconductor layer and having a fourth channel area. The second channel area is greater than the first channel area, the third channel area or the fourth channel area.
    Type: Application
    Filed: January 19, 2024
    Publication date: March 20, 2025
    Inventors: Wen-Chung Chen, Chia-Yu Wei, Kuo-Cheng Lee, Cheng-Hao Chiu, Hsiu Chi Yu, Hsun-Ying Huang, Ming-Hong Su
  • Publication number: 20250098343
    Abstract: Various embodiments of the present application are directed towards an image sensor including a wavelength tunable narrow band filter, as well as methods for forming the image sensor. In some embodiments, the image sensor includes a substrate, a first photodetector, a second photodetector, and a filter. The first and second photodetectors neighbor in the substrate. The filter overlies the first and second photodetectors and includes a first distributed Bragg reflector (DBR), a second DBR, and a first interlayer between the first and second DBRs. A thickness of the first interlayer has a first thickness value overlying the first photodetector and a second thickness value overlying the second photodetector. In some embodiments, the filter is limited to a single interlayer. In other embodiments the filter further includes a second interlayer defining columnar structures embedded in the first interlayer and having a different refractive index than the first interlayer.
    Type: Application
    Filed: December 4, 2024
    Publication date: March 20, 2025
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Kazuaki Hashimoto, Keng-Yu Chou, Wei Chieh Chiang, Wen-Hau Wu, Chih-Kung Chang
  • Publication number: 20250093593
    Abstract: Optical devices and methods of manufacture are presented in which a mirror structure is utilized to transmit and receive optical signals to and from an optical device. In embodiments the mirror structure receives optical signals from outside of an optical device and directs the optical signals through at least one mirror to an optical component of the optical device.
    Type: Application
    Filed: January 3, 2024
    Publication date: March 20, 2025
    Inventors: Wen-Chih Lin, Cheng-Yu Kuo, Yen-Hung Chen, Hsuan-Ting Kuo, Chia-Shen Cheng, Chao-Wei Li, Ching-Hua Hsieh, Wen-Chih Chiou, Ming-Fa Chen, Shang-Yun Hou
  • Patent number: D1069164
    Type: Grant
    Filed: March 17, 2023
    Date of Patent: April 1, 2025
    Assignee: GENEREACH BIOTECHNOLOGY CORPORATION
    Inventors: Chi-Horng Bair, Wen-Shan Yang, Pei-Cheng Huang, Te-Yu Chung