Abstract: A method includes rotating a wafer, dispensing a liquid from a center of the wafer to a peripheral edge of the wafer to control a temperature of the wafer, and etching an etch layer of the wafer with an etchant during or after dispensing the liquid. The liquid is dispensed through a nozzle.

Abstract: An imaging lens assembly includes optical elements and a light path folding mechanism. The light path folding mechanism is disposed on the optical axis to fold an optical axis at least once, and includes a light folding element, a light blocking structure and a nanostructure layer. The light folding element includes a reflecting surface, an incident surface and an exit surface. The reflecting surface is configured to fold an incident light path towards an exit light path. The light blocking structure is disposed on at least one of the incident surface and the exit surface, and includes a main light blocking portion located on a peripheral portion closest to the optical axis on a cross section passing through the optical axis. The nanostructure layer is continuously distributed over at least one of the incident surface and the exit surface and the main light blocking portion.

Abstract: Structural design of cranial nerve degeneration contrast agent precursor, the cranial nerve degeneration contrast agent prepared using the cranial nerve degeneration contrast agent precursor can be used for positron radiation tomography to detect alpha-synuclein.

Abstract: An intelligent speed regulation system of a connector production apparatus, including: a CCD detection system includes a CCD industrial camera and a CCD detection software module, wherein the CCD industrial camera is configured to shoot a connector plane picture; the CCD detection software module is configured to analyze and identify the connector plane picture, extract true position error value data and generate an error data table file; an intelligent speed regulation software unit configured to calculate an optimal operation speed value of the connector production apparatus according to the true position error value data of a connector; and a PLC apparatus configured to read the optimal operation speed value of the connector production apparatus, and control actions of mechanisms in the connector production apparatus to finish a speed regulation operation. The operation speed of the apparatus can be automatically adjusted according to quality of a connector product.

Abstract: An array type connection structure is disclosed. The structure includes a support and connecting assemblies. There is no signal cable routing in the support. Each connecting assembly penetrates through the support; a first side of each connecting assembly has a connector interface including a plurality of first signal terminals, and the connector interface is configured to be connected to a first electronic component located on a first side of the support. A second side of each connecting assembly is directly connected to a plurality of cables, the plurality of cables are in a one-to-one correspondence with the plurality of second signal terminals of the connecting assembly, and the cable is configured to be connected to a second electronic component located on a second side of the support. The support is provided with a heat dissipation through hole, which is at least partially located between two adjacent connecting assemblies.

Abstract: A spiky metal organic framework is provided in the present disclosure. The spiky metal organic framework is formed by a coordination reaction between at least one metal ion and an organic ligand, and includes a body and a plurality of spike-like structures. The body is a spherical shape, and a particle size of the body is 1 ?m to 3 ?m. The spike-like structures are distributed on a surface of the body, a diameter of each spike-like structure is 15 nm to 35 nm, and a length of each spike-like structure is 250 nm to 400 nm.

Abstract: A slide rail assembly includes a rail member ad a bracket device. The bracket device can be displaced with respect to the rail member and is provided with a first structure. The rail member is provided with a second structure. When the bracket device is at a predetermined position with respect to the rail member, the first structure and the second structure are blocked by each other to prevent the bracket device from being displaced with respect to the rail member in either of a first direction and a second direction.

Abstract: A metal light blocking element includes an outer diameter surface, a first annular surface, a second annular surface and an anti-reflecting layer. The outer diameter surface surrounds the metal light blocking element. The first annular surface is disposed opposite to the outer diameter surface, and the first annular surface is closer to a central axis than the outer diameter surface to the central axis. The second annular surface is disposed opposite to the outer diameter surface, the second annular surface is closer to the central axis than the outer diameter surface to the central axis, and the first annular surface is connected to the second annular surface to form a minimum opening structure. The anti-reflecting layer is disposed on the first annular surface and the second annular surface, and includes a light absorbing layer and a nanostructure layer. The nanostructure layer is disposed on the light absorbing layer.

Abstract: A method includes rotating a wafer, dispensing a liquid from a center of the wafer to an edge of the wafer to control a temperature of the wafer, and etching an etch layer of the wafer with an etchant during or after dispensing the liquid. The liquid is dispensed through a nozzle.

Abstract: Embodiment described herein provide a thermal treatment process following a high-pressure anneal process to keep hydrogen at an interface between a channel region and a gate dielectric layer in a field effect transistor while removing hydrogen from the bulk portion of the gate dielectric layer. The thermal treatment process can reduce the amount of threshold voltage shift caused by a high-pressure anneal. The high-pressure anneal and the thermal treatment process may be performed any time after formation of the gate dielectric layer, thus, causing no disruption to the existing process flow.

Abstract: An imaging lens assembly includes a plurality of optical elements and a lens barrel. At least one optical element of the optical elements is a lens element. The lens element includes an optical effective portion, a peripheral portion, a light-blocking coating layer and a nanostructure layer. The light-blocking coating layer is disposed on at least one surface of the object-side peripheral surface and the image-side peripheral surface and includes a tapered portion. The tapered portion is tapered adjacent to a boundary between the optical effective portion and the peripheral portion. The nanostructure layer is disposed on the optical effective portion and the tapered portion of the light-blocking coating layer, and the nanostructure layer has a plurality of irregular ridge-shaped protrusions. The tapered portion of the light-blocking coating layer forms a light-passing opening adjacent to the boundary along a direction surrounding the optical axis.

Abstract: An optical lens assembly includes at least one optical lens element and at least one optical element. At least one surface of the at least one optical lens element or the at least one optical element includes a low reflection layer, and the low reflection layer includes a rough layer, a nanocrystalline particle and a hydrophobic layer. The nanocrystalline particle is disposed between the rough layer and the hydrophobic layer, and the hydrophobic layer is farther away from the surface of the at least one optical lens element or the at least one optical element than the nanocrystalline particle. A material of the nanocrystalline particle at least includes SiO2.

Abstract: A signal processing method for processing a signal received by a receiver device includes: performing a first correlation calculation on the received signal to obtain a first calculation result; performing carrier frequency offset estimation and compensation on the received signal to obtain a first compensated signal; performing a second correlation calculation on the first compensated signal to obtain a second calculation result; performing carrier frequency offset compensation on the first compensated signal to obtain a second compensated signal; determining whether at least one phase of the second compensated signal is correct; and determining whether at least one decoding result of the second compensated signal is correct. The received signal is determined not a signal conforming to a predetermined standard when the at least one phase of the second compensated signal or the at least one decoding result of the second compensated signal is determined incorrect.

Abstract: A standing training mobile device for carrying a patient to perform active-assisted upright locomotion is provided. The standing training mobile device includes a base, a mobile module, a lifting module, a control module, and a support module. The mobile module and the lifting module are disposed on the base. The control module is disposed on the lifting module and is coupled to the mobile module. The control module includes a manipulation platform and two control assemblies disposed on the manipulation platform for use of the patient. The support module includes a support frame, a first support assembly, a second support assembly, and a third support assembly. The first support assembly, the second support assembly, and the third support assembly are slidably disposed on the support frame respectively. The second support assembly is disposed between the first support assembly and the third support assembly.

Abstract: An electronic package structure and manufacturing method thereof. The electronic package structure includes a circuit board, an interposer, a chip, a circuit structure, and a coaxial conductive element. The interposer is disposed on the circuit board. The interposer has a through groove. The chip is disposed in the through groove and located on the circuit board to electrically connect with the circuit board. The circuit structure is disposed on the interposer. The coaxial conductive element penetrates the interposer to electrically connect the circuit structure and the circuit board. The coaxial conductive element includes a first conductive structure, a second conductive structure, and a first insulating structure. The second conductive structure surrounds the first conductive structure. The first insulating structure is disposed between the first conductive structure and the second conductive structure.

Abstract: An electronic package structure and its manufacturing method are provided. The electronic package structure includes an interposer, a circuit board, a chip, and a circuit structure. The interposer includes an interposer substrate and a coaxial conductive element located in the interposer substrate. The interposer substrate includes a cavity. The coaxial conductive element includes a first conductive structure, a second conductive structure surrounding the first conductive structure, and a first insulation structure. The first insulation structure is disposed between the first and second conductive structures. The circuit board is disposed on a lower surface of the interposer substrate and electrically connected to the coaxial conductive element. The chip is disposed in the cavity and located on the circuit board, so as to be electrically connected to the circuit board.

Abstract: An optical lens assembly includes at least one optical element. At least one of the at least one optical element includes a multi-layer coating membrane, and the multi-layer coating membrane is formed by alternately stacking high refractive index layers and low refractive index layers. The multi-layer coating membrane is a dual-bandpass filtering membrane.

Abstract: A circuit board structure includes a circuit substrate having opposing first and second sides, a redistribution structure disposed at the first side, and a dielectric structure disposed at the second side. The circuit substrate includes a first circuit layer disposed at the first side and a second circuit layer disposed at the second side. The redistribution structure is electrically coupled to the circuit substrate and includes a first leveling dielectric layer covering the first circuit layer, a first thin-film dielectric layer disposed on the first leveling dielectric layer and having a material different from the first leveling dielectric layer, and a first redistributive layer disposed on the first thin-film dielectric layer and penetrating through the first thin-film dielectric layer and the first leveling dielectric layer to be in contact with the first circuit layer. The dielectric structure includes a second leveling dielectric layer disposed below the second circuit layer.

Abstract: Still frame detection for single pass video data, including: determining that an average quantization parameter of a frame of video data falls below a quantization parameter threshold; determining whether an amount of skipped macroblocks in the frame meets a skipped macroblock threshold; and responsive to the amount of skipped macroblocks exceeding the skipped macroblock threshold, identifying the frame as a still frame.

Abstract: A power supply system with self-excited drive function includes a power supply apparatus, a logic disconnection circuit, a self-boosting circuit, a protection circuit, and a current sensing unit. The logic disconnection circuit is coupled between a positive power wire and a negative power wire. The self-boosting circuit converts a voltage into an auxiliary voltage, and the self-boosting circuit is coupled to the logic disconnection circuit to receive the auxiliary voltage. The current sensing unit outputs a current sensing signal according to a current flowing through the positive power wire or the negative power wire. The protection circuit makes a short circuit or an open circuit between the positive power wire and the negative power wire according to the current sensing signal. The logic disconnection circuit disables or enables the self-boosting circuit according to the voltage between the positive power wire and the negative power wire.