Patents by Inventor Wen Yuan

Wen Yuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package Box Module
    Publication number: 20110215019
    Abstract: A package box module for packaging an object is disclosed, which includes a package box having a sidewall and plural first coupling structures disposed on the sidewall, and a common cushion disposed between the object and the sidewall. The common cushion includes plural second coupling structures and plural flexible structures disposed between the second coupling structures. The common cushion can be enlarged by extending the flexible structures, so that the first coupling structures couple to the second coupling structures, thus a gap between the object and the package box is filled by the common cushion.
    Type: Application
    Filed: June 24, 2010
    Publication date: September 8, 2011
    Applicant: AU OPTRONICS CORPORATION
    Inventors: Chung-Hsing Wu, Kun-Hung Hsieh, Wen-Yuan Chang, Jen-Wei Peng
  • CHIP PACKAGE STRUCTURE AND PACKAGE SUBSTRATE
    Publication number: 20110169147
    Abstract: A chip package structure for being disposed on a carrier includes a package substrate and a chip. The package substrate includes a laminated layer, a patterned conductive layer, a solder-mask layer, at least one outer pad and a padding pattern. The patterned conductive layer is disposed on a first surface of the laminated layer and has at least one inner pad. The solder resist layer is disposed on the first surface and has at least one opening exposed the inner pad. The outer pad is disposed on the solder resist layer, located within the opening, and is connected with the inner pad. The padding pattern is disposed on the solder resist layer. A height of the padding pattern relative to the first surface is greater than that of the outer pad. The chip is located on a second surface of the laminated layer and electrically connected to the package substrate.
    Type: Application
    Filed: November 16, 2010
    Publication date: July 14, 2011
    Applicant: VIA TECHNOLOGIES, INC.
    Inventor: Wen-Yuan Chang
  • CIRCUIT BOARD AND CHIP PACKAGE STRUCTURE
    Publication number: 20110108984
    Abstract: A circuit board includes a substrate that has a top surface and a base surface opposite to each other, at least a top pad disposed on the top surface, a top solder resist layer disposed on the top surface and covering a portion of the top pad, and a pre-bump disposed on the top pad. The top solder resist layer has a first opening exposing a portion of the top pad. The pre-bump is located in the first opening and has a protrusion protruding from the top solder resist layer. A maximum width of the protrusion is less than or equal to a width of the top pad. A chip package structure having the circuit board is also provided.
    Type: Application
    Filed: January 11, 2011
    Publication date: May 12, 2011
    Applicant: VIA TECHNOLOGIES, INC.
    Inventors: Wen-Yuan Chang, Wei-Cheng Chen, Yeh-Chi Hsu
  • Fabrication method of circuit board
    Patent number: 7906377
    Abstract: A fabrication method of a circuit board is provided. A substrate, a top pad, a base pad electrically connecting the top pad, and a top and a base solder resist layers are provided. The top and the base pads are disposed on two opposite surfaces of the substrate, respectively. The top solder resist layer having a first opening partially exposing the top pad and the base solder resist layer having a second opening partially exposing the base pad are disposed on the two surfaces, respectively. A conductive layer covering the base solder resist layer and the base pad is formed. A plating resist layer having a third opening is formed on the conductive layer. A current is applied to the conductive layer through the third opening for electroplating a pre-bump on the top pad. The plating resist layer and the conductive layer are then removed.
    Type: Grant
    Filed: April 29, 2009
    Date of Patent: March 15, 2011
    Assignee: VIA Technologies, Inc.
    Inventors: Wen-Yuan Chang, Wei-Cheng Chen, Yeh-Chi Hsu
  • Communication system and oscillation signal provision method
    Patent number: 7902926
    Abstract: An embodiment of a communication system is provided, in which a high frequency oscillator generates a first high frequency signal upon receipt of no disable signal. The first high frequency signal is commonly shared by at least two modules. Each module coupled to the high frequency oscillator operates in either busy or idle mode, wherein the module operates at the first high frequency signal when in busy mode, and asserts a request signal when in idle mode. A disablement unit, coupled to the first and second modules, asserts the disable signal to the high frequency oscillator when all of the request signals are asserted, thereby forcing the high frequency oscillator to cease the generation of the first high frequency signal.
    Type: Grant
    Filed: April 20, 2009
    Date of Patent: March 8, 2011
    Assignee: Mediatek Inc.
    Inventors: Ti-Wen Yuan, Chung-Shine Huang
  • Chip package and substrate thereof
    Patent number: 7868439
    Abstract: A chip package coupled to a circuit board includes a substrate and at least one chip. The substrate includes a plurality of first pads, a plurality of second pads and at least one first interconnecting structure. The first pads and the chip are located on a first surface of the substrate and the second pads are located on a second surface of the substrate. The first interconnecting structure is coupled with the chip, one of the first pads and one of the second pads for flexible design of various applications. A substrate of the chip package is also disclosed.
    Type: Grant
    Filed: August 23, 2006
    Date of Patent: January 11, 2011
    Assignee: Via Technologies, Inc.
    Inventors: Wen Yuan Chang, Chih-An Yang
  • Backlight module having replaceable light apparatus
    Patent number: 7866874
    Abstract: The present invention discloses a backlight module having replaceable light apparatus. The backlight module includes the replaceable light apparatus, a back plate and a frame body. The replaceable light apparatus includes a light control circuit, a securing device and conducting wires. The light control circuit is adapted to a frame body and a back plate of the backlight module. Additionally, the light control circuit has a plurality of light sources, a first end portion and a second end portion. The securing device has a supporting housing which has a position protrusion and a clamping portion for supporting the first end portion of the light control circuit along a first direction (X) and a third direction (Z). The clamping portion clamps the first end portion of the light control circuit along a second direction (Y) and the third direction (Z).
    Type: Grant
    Filed: July 22, 2008
    Date of Patent: January 11, 2011
    Assignee: AU Optronics Corp.
    Inventors: Keng-ju Liu, Wen-yuan Cheng, Chi-chih Chu
  • Buckling Device for Safety Belt
    Publication number: 20100299885
    Abstract: A bucking device for safety belts comprises a buckle made of metal material and bent to form a projected holder, a wider segment of the holder being used to insert a side of the safety belt to the buckle, on each of two sides of a narrower segment of the holder being mounted a second side plate, between two second side plates being defined a locking unit by using a shank, and on an upper rim of the second side plate being fixed a recess, the locking unit including an engagement member in which a rotary member, a fixing piece, a compression spring, a mounting member, and a torsion spring are received; a fastening member including a bottom sheet and a wider segment thereof being used to insert another side of the safety belt, and including a retaining pore secured on a narrower segment thereof.
    Type: Application
    Filed: May 26, 2009
    Publication date: December 2, 2010
    Inventor: Wen-Yuan Wu
  • Call processing device and method
    Patent number: 7826347
    Abstract: A call processing device communicating with a plurality of line cards includes a mapping table and an address table. The call processing device receives a telephone number, searches the mapping table for one index related to the received telephone number, searches the address table for one address corresponding to the sought index, rejects a call corresponding to the received telephone number if the sought address is a specially preset address, and updates one or more of the addresses of the line cards in the address table if operating modes of one or more of the line cards are changed. A call processing method is also provided.
    Type: Grant
    Filed: March 26, 2009
    Date of Patent: November 2, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Ching-Hao Chen, Wen-Yuan Wang
  • NETWORK DEVICE AND AN IMAGE UPDATE METHOD THEREOF
    Publication number: 20100257347
    Abstract: A network device and an image update method include a control card and a daughterboard embedded in the control card. The control card includes a download module to download an integrated image from a trivial file transfer protocol (TFTP) server, a first retrieving module to retrieve a control card image from the integrated image, and a first storage module to store the control card image. The daughterboard includes a second retrieving module to retrieve a daughterboard image from the integrated image, and a second storage module to store the daughterboard image.
    Type: Application
    Filed: February 26, 2010
    Publication date: October 7, 2010
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: WEN-YUAN WANG
  • THREE-DIMENSIONAL GAN EPITAXIAL STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20100229788
    Abstract: A manufacturing method for three-dimensional GaN epitaxial structure comprises a disposing step, in which a substrate of LiAlO2 and a source metal of Ga are disposed inside an vacuum chamber. An exposing step is importing N ions in plasma state and generated by a nitrogen source into the chamber. A heating step is heating up the source metal to generate Ga vapor. A growing step is forming a three-dimensional GaN epitaxial structure with hexagonal micropyramid or hexagonal rod having a broadened disk-like surface on the substrate by reaction between the Ga vapor and the plasma state of N ions.
    Type: Application
    Filed: September 28, 2009
    Publication date: September 16, 2010
    Applicant: NATIONAL SUN YAT-SEN UNIVERSITY
    Inventors: I-Kai LO, Chia-Ho HSIEH, Yu-Chi HSU, Wen-Yuan PANG, Ming-Chi CHOU
  • LAMP SHADE
    Publication number: 20100226125
    Abstract: A lamp shade includes a frame bar and a plurality of fixing members. The frame bar includes a pair of wall bodies and a base connected between the wall bodies. Each wall body has an inner wall surface, and the inner wall surfaces are disposed facing each other. The fixing members are disposed at the wall bodies, and at least one fixing member is located on each inner wall surface.
    Type: Application
    Filed: March 4, 2009
    Publication date: September 9, 2010
    Applicant: CHUNGHWA PICTURE TUBES, LTD.
    Inventors: Wen-Yuan LIAO, Sheng-Chieh CHAO, Jui-Chuan CHIEN
  • Method and related device of source driver with reduced power consumption
    Patent number: 7773079
    Abstract: A method capable of reducing power consumption of source drivers is disclosed. The method includes a reference voltage source charging or discharging a loading end of a source driver to a reference voltage having a polarity the same as a polarity of a target voltage and a voltage level near a voltage level of the target voltage, and an output stage of the source driver charging or discharging the loading end to the target voltage.
    Type: Grant
    Filed: April 1, 2007
    Date of Patent: August 10, 2010
    Assignee: NOVATEK Microelectronics Corp.
    Inventors: Wen-Yuan Tsao, Chang-San Chen, Che-Li Lin
  • PRINTER WITH PRESSURE REGULATED INK SUPPLY
    Publication number: 20100194799
    Abstract: An inkjet printer that has a printhead, a container for maintaining a quantity of ink at a pressure less than ambient pressure, an ink outlet for sealed fluid connection to the printhead, and, an air inlet with a pressure regulator that allows air into the container at a predetermined pressure difference between the container interior and atmosphere. The pressure regulator is a porous member with a first surface for exposure to atmosphere and a second surface for contacting the ink in the container. During use, air at the first surface moves to the second surface and forms bubbles and, the porous member is a membrane in a side wall of the reservoir. The membrane is positioned closely adjacent an internal wall such that ink is held between the wall and the membrane by capillary action when the ink level drops below the membrane.
    Type: Application
    Filed: April 8, 2010
    Publication date: August 5, 2010
    Inventors: Wen-Yuan Tsai, Akira Nakazawa, Kia Silverbrook
  • Light Guide Plate Having Lateral Optical Structures and Backlight Module Having the Light Guide Plate
    Publication number: 20100165658
    Abstract: The present invention discloses a light guide plate and a backlight module having the same. The light guide plate includes a light emitting surface, a light incident surface, a light reflecting surface, and a plurality of prisms disposed on the light reflecting surface. The disposition direction of the prisms can be parallel or perpendicular to the lengthwise direction of the light reflecting surface. An inclined angle may exist between the disposition direction of the prisms and the lengthwise of the light reflecting surface. The backlight module includes a light guide plate, a light source, and an optical film set, wherein the light source is disposed near the light incident surface. The optical film set partially covers the light emitting surface, wherein a distance exists between a vertex of the prism and an edge of the optical film set.
    Type: Application
    Filed: October 20, 2009
    Publication date: July 1, 2010
    Applicant: AU OPTRONICS CORPORATION
    Inventors: Yen-Chang Huang, Kang-Chung Liu, Wen-Yuan Cheng
  • CIRCUIT BOARD AND FABRICATION METHOD THEREOF AND CHIP PACKAGE STRUCTURE
    Publication number: 20100155939
    Abstract: A fabrication method of a circuit board is provided. A substrate, a top pad, a base pad electrically connecting the top pad, and a top and a base solder resist layers are provided. The top and the base pads are disposed on two opposite surfaces of the substrate, respectively. The top solder resist layer having a first opening partially exposing the top pad and the base solder resist layer having a second opening partially exposing the base pad are disposed on the two surfaces, respectively. A conductive layer covering the base solder resist layer and the base pad is formed. A plating resist layer having a third opening is formed on the conductive layer. A current is applied to the conductive layer through the third opening for electroplating a pre-bump on the top pad. The plating resist layer and the conductive layer are then removed.
    Type: Application
    Filed: April 29, 2009
    Publication date: June 24, 2010
    Applicant: VIA TECHNOLOGIES, INC.
    Inventors: Wen-Yuan Chang, Wei-Cheng Chen, Yeh-Chi Hsu
  • Backlight Module and Liquid Crystal Display Module Using the Backlight Module
    Publication number: 20100135003
    Abstract: This present invention discloses a backlight module and a flat display device using the backlight module. The backlight module has a plastic base having a plastic plate and a plastic frame, wherein a light guide plate is disposed on the plastic plate. The plastic plate is light reflective and has a thickness ranging from 0.2 mm to 0.9 mm. The plastic plate is used to reflect light leaking from the light guide plate. The reflectivity of the plastic plate to the visible light with wavelength ranging from 410 nm to 780 nm ranges from 80% to 95%.
    Type: Application
    Filed: June 29, 2009
    Publication date: June 3, 2010
    Applicant: AU OPTRONICS CORPORATION
    Inventors: Yen-Chang Huang, Kang-Chung Liu, Wen-Yuan Cheng
  • Seatbelt buckle for use in vehicle
    Patent number: 7716794
    Abstract: A seatbelt buckle for use in vehicle comprises a base, an intermediate loop, a fixed disc, an elastic member, an upper cover, a fixed post, four movable posts, an actuation member, a biasing element and a pressing element, wherein the intermediate loop and the fixed disc are screwed onto the base, the elastic member is secured between the intermediate loop and the fixed disc, and a plurality of snap-on recesses form between the intermediate loop and the fixed disc for the insertion of engaging members of the seatbelt, the pressing element is constructed in the form of a sheet, and one end thereof extends outwardly and includes a wave-shaped abutting segment arranged thereon, thereby lowering the production cost and saving force during unbuckling the seatbelt.
    Type: Grant
    Filed: August 7, 2007
    Date of Patent: May 18, 2010
    Inventor: Wen-Yuan Wu
  • Ink reservoir for inkjet printhead
    Patent number: 7703903
    Abstract: An ink reservoir (1) for maintaining ink (10) at a negative pressure by using the suction provided the printhead and then regulating the negative pressure with a pressure regulator (16) that allows air into cartridge at a specified pressure difference. The pressure regulator may be a porous member such as a membrane or mesh filter, or a simple pressure relief valve. The membrane (16), mesh or foam is selected such that its bubble point equates to the specified pressure difference.
    Type: Grant
    Filed: July 10, 2006
    Date of Patent: April 27, 2010
    Assignee: Silverbrook Research Pty Ltd
    Inventors: Wen-Yuan Tsai, Akira Nakazawa, Kia Silverbrook
  • Document fixing apparatus
    Patent number: 7692826
    Abstract: A document fixing apparatus adopted for use on business machines with glass surfaces includes a coupling member and an anchor member. The coupling member is located on one end of the glass surface. The anchor member has one end engaged with the coupling member and corresponds to the glass surface. When the anchor member is lifted from the glass surface, a scanned document may be placed on the glass surface, and the anchor member may be moved to rest on the scanned document.
    Type: Grant
    Filed: October 8, 2004
    Date of Patent: April 6, 2010
    Inventor: Wen-Yuan Peng