Patents by Inventor Wenbin Zhou

Wenbin Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240132152
    Abstract: The present disclosure provides a self-learning collaborative control method for active steering and yaw moment for a motor vehicle, including a first step of constructing fundamental formulas which are stored in a vehicle ECU, and a second step of calculating an active steering angle ?C and a yaw moment Mc on line by the vehicle ECU according to following sub-steps during a driving process of the motor vehicle, and controlling a driving state of the motor vehicle according to ?C and Mc. The second step includes a first sub-step of collecting raw real-time parameter values, a second sub-step of performing calculation by the identifier and the control target reference model, a third sub-step of calculating ?C and Mc. The present disclosure can realize the self-learning collaborative control of active steering and yaw moment without requiring a system control model and correct a driver's steering operation.
    Type: Application
    Filed: December 25, 2023
    Publication date: April 25, 2024
    Inventors: Zhijun Fu, Yaohua Guo, Dengfeng Zhao, Jinquan Ding, Chaohui Liu, Wenbin He, Wenchao Yang, Lei Yao, Fang Zhou, Hui Wang, Wuyi Ming
  • Publication number: 20240126047
    Abstract: The present invention provides an optical imaging lens. The optical imaging lens comprises seven lens elements positioned in an order from an object side to an image side. Through controlling the convex or concave shape of the surfaces of the lens elements, the optical imaging lens may shorten system length and enlarge field of view and aperture size.
    Type: Application
    Filed: July 10, 2023
    Publication date: April 18, 2024
    Applicant: Genius Electronic Optical (Xiamen) Co., Ltd.
    Inventors: Huabin Liao, Wenbin Lin, Jiali Lian, Ou Zhou
  • Patent number: 11963356
    Abstract: Embodiments of structure and methods for forming a three-dimensional (3D) memory device are provided. In an example, a 3D memory device includes a stack structure including a memory block including a plurality of memory cells. The 3D memory device also includes a first top select structure and a bottom select structure in the memory block and aligned with each other vertically; and a second top select structure in the memory block is separated from the first top select structure by at least one of the plurality of memory cells. The first top select structure, the bottom select structure, and the second top select structure each includes an insulating material.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: April 16, 2024
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Zongliang Huo, Haohao Yang, Wei Xu, Ping Yan, Pan Huang, Wenbin Zhou
  • Publication number: 20240118855
    Abstract: The present disclosure provides a video generation method, an apparatus, a system, a device and a storage medium. The method is applied to a video generation system, and the video generation system includes a first client and at least one second client. Specifically, the method includes: firstly, the first client creates a first virtual room and sets a target capturing effect for the first virtual room; then, the second client acquires a first video added with the target capturing effect after receiving a notification message that a current user has successfully joined the first virtual room, and uploads the first video to the first virtual room. Further, the first client acquires a target video from the first virtual room and generates a target result video based on the target video, and the target video includes the first video.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 11, 2024
    Inventors: Zipei PENG, Jiawei Wang, Bo Qiu, Jianren Zhou, Jianfeng Zhang, Wenbin Wu, Leihe Zhao, Wei Wang
  • Publication number: 20240098989
    Abstract: A semiconductor device includes a plurality of memory blocks. Each memory block includes a memory deck including interleaved first conductor layers and first dielectric layers, and a separation structure extending to separate two adjacent memory blocks. Each separation structure includes a dielectric stack including interleaved third dielectric layers and fourth dielectric layers. The third dielectric layers are in contact with the first dielectric layers, and the fourth dielectric layers are in contact with the first conductor layers.
    Type: Application
    Filed: September 20, 2022
    Publication date: March 21, 2024
    Inventors: Zhengliang Xia, Wenbin Zhou, Zongliang Huo, Zhaohui Tang
  • Patent number: 11915962
    Abstract: The present invention provides a display panel and manufacturing method thereof, the method including following steps: providing a driving backplane and a light-emitting substrate, and bonding the driving backplane and the light-emitting substrate; patterning the light-emitting substrate to form a pixel array; forming a thin film packaging layer on an outside of the pixel array, the thin film packaging layer completely covering the pixel array; forming quantum dots on top of the thin film packaging layer to form a multi-color display; forming a reflective array between two adjacent quantum dots to avoid optical crosstalk between the pixel arrays. The display panel and the method of the present invention break through the physical limit of the high PPI, high-precision metal mask, which can realize the display of 2000 and higher PPI, and can prevent the optical crosstalk between the pixel arrays.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: February 27, 2024
    Assignee: KUNSHAN FANTAVIEW ELECTRONIC TECHNOLOGY CO., LTD.
    Inventors: Xiaosong Du, Xiaolong Yang, Wenbin Zhou, Feng Zhang, Jian Sun, Yudi Gao
  • Publication number: 20230365985
    Abstract: The invention discloses proteins and biological materials related to rice (Oryza sativa L.) yield, and use thereof in increasing rice yield. The protein related to rice yield disclosed by the invention is OsDREB1C having SEQ ID NO: 1 in the Sequence Listing as its sequence, and having SEQ ID NO: 2 in the Sequence Listing as its coding gene sequence. Experiments have demonstrated that OsDREB1C and the associated biological materials thereof of the invention can enhance the photosynthetic efficiency of a plant, promote nitrogen uptake and transport and increase the nitrogen content in the plant and in its grains, promote earlier heading, and improve yield. The OsDREB1C and the associated biological materials thereof of the invention are of great biological significance and industrial value, and find bright prospects for application.
    Type: Application
    Filed: June 17, 2021
    Publication date: November 16, 2023
    Inventors: Wenbin ZHOU, Xia LI, Shaobo WEI
  • Publication number: 20230349907
    Abstract: The present invention relates to novel bioprobes which are capable of binding to certain amine oxidase enzymes. These bioprobes are useful in methods of detecting and determining the concentration of certain amine oxidase enzymes in a sample as well as in methods for the quantitative assessment of inhibition of certain amine oxidases.
    Type: Application
    Filed: February 5, 2021
    Publication date: November 2, 2023
    Applicant: Pharmaxis Ltd.
    Inventors: Alison Dorothy Findlay, Craig Ivan Turner, Mandar Deodhar, Jonathan Stuart Foot, Wolfgang Jarolimek, Heidi Schilter Sambade, Wenbin Zhou, Lara Anne Perryman
  • Patent number: 11785772
    Abstract: Embodiments of structure and methods for forming a three-dimensional (3D) memory device are provided. In an example, a 3D memory device includes a memory stack having interleaved a plurality of conductor layers and a plurality of insulating layers, a plurality of channel structures extending in the memory stack, and a source structure extending in the memory stack. The source structure includes a plurality of source contacts each in a respective insulating structure. Two adjacent source contacts are conductively connected to one another by a connection layer, the connection layer includes a pair of first portions being over the two adjacent ones of the plurality of source contacts and a second portion between the pair of first portions. A support structure is between the two adjacent source contacts. The support structure includes a cut structure over interleaved a plurality of conductor portions and a plurality of insulating portions.
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: October 10, 2023
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Wenxiang Xu, Wei Xu, Pan Huang, Ping Yan, Zongliang Huo, Wenbin Zhou, Ji Xia
  • Patent number: 11765897
    Abstract: Embodiments of structure and methods for forming a three-dimensional (3D) memory device are provided. In an example, a method for forming a 3D memory device includes forming a bottom select structure extending along a vertical direction through a bottom conductor layer over a substrate and along a horizontal direction to divide the bottom conductor layer into a pair of bottom select conductor layers, forming a plurality of conductor layers and a plurality of insulating layers interleaved on the pair of bottom select conductor layers and the bottom select structure, and forming a plurality of channel structures extending along the vertical direction through the pair of bottom select conductor layers, the plurality of conductor layers, and the plurality of insulating layers and into the substrate.
    Type: Grant
    Filed: November 21, 2020
    Date of Patent: September 19, 2023
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Zongliang Huo, Haohao Yang, Wei Xu, Ping Yan, Pan Huang, Wenbin Zhou
  • Publication number: 20230292511
    Abstract: A three-dimensional (3D) memory device includes a memory stack including interleaved a plurality of conductor layers and a plurality of insulating layers extending laterally in the memory stack, a memory block including a plurality of channel structures extending vertically through the memory stack, a plurality of source structures extending vertically and laterally in the memory stack and being in contact with the memory block, and a plurality of conductor portions and a plurality of insulating portions being interleaved and locating between two adjacent source structures along a direction which the source structure extends. The interleaved plurality of conductor portions and plurality of insulating portions are each in contact with corresponding conductor layers and corresponding insulating layers of the same level from adjacent memory blocks.
    Type: Application
    Filed: May 18, 2023
    Publication date: September 14, 2023
    Inventors: Zongliang Huo, Haohao Yang, Wei Xu, Ping Yan, Pan Huang, Wenbin Zhou
  • Patent number: 11758723
    Abstract: A method for forming a three-dimensional (3D) memory device includes forming a cut structure in a stack structure. The stack structure includes interleaved a plurality of initial sacrificial layers and a plurality of initial insulating layers. The method also includes removing portions of the stack structure adjacent to the cut structure to form a slit structure and an initial support structure. The initial support structure divides the slit structure into a plurality of slit openings. The method further includes forming a plurality of conductor portions in the initial support structure through the plurality of slit openings. The method also includes forming a source contact in each of the plurality of slit openings. The method also includes removing portions of the initial support structure to form a support structure. The support structure includes an adhesion portion extending through the support structure.
    Type: Grant
    Filed: January 13, 2021
    Date of Patent: September 12, 2023
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Qingqing Wang, Wei Xu, Pan Huang, Ping Yan, Zongliang Huo, Wenbin Zhou
  • Patent number: 11716850
    Abstract: A method for forming a 3D memory device is provided. The method includes forming a dielectric stack including interleaved initial insulating layers and initial sacrificial layers over a substrate, and forming at least one slit structure extending vertically and laterally in the dielectric stack and dividing the dielectric stack into block regions. The at least one slit structure each includes slit openings exposing the substrate and an initial support structure between adjacent slit openings. Each block region may include interleaved insulating layers and sacrificial layers, and the initial support structure may include interleaved insulating portions and sacrificial portions. Each insulating portion and sacrificial portion may be in contact with respective insulating layers and sacrificial layers of a same level from adjacent block regions.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: August 1, 2023
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Zongliang Huo, Haohao Yang, Wei Xu, Ping Yan, Pan Huang, Wenbin Zhou
  • Patent number: 11653495
    Abstract: Embodiments of structure and methods for forming a three-dimensional (3D) memory device are provided. In an example, a method for forming a 3D memory device includes the following operations. A cut structure is first formed in a stack structure. The stack structure includes interleaved initial sacrificial layers and initial insulating layers. A patterned cap material layer is formed over the stack structure. The patterned cap material layer includes an opening over the cut structure. Portions of the stack structure and the patterned cap material layer adjacent to the opening are removed to form a slit structure and an initial support structure. The initial support structure divides the slit structure into slit openings. Conductor portions are formed through the plurality of slit openings to form a support structure. A source contact is formed in each slit opening. A connection layer is formed over the source contact in each slit opening and over the support structure.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: May 16, 2023
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Wenxiang Xu, Wei Xu, Pan Huang, Ping Yan, Zongliang Huo, Wenbin Zhou, Ji Xia
  • Publication number: 20230120428
    Abstract: The present invention provides a silicon-based micro display screen and method for manufacturing the same. The method includes following steps: providing a silicon substrate, defining a number of sub-pixel regions on the silicon substrate, and sequentially and respectively preparing an anode layer, an OLED layer, a cathode layer and a first protective layer in each sub-pixel region on the silicon substrate; plasma bombarding and removing the exposed OLED layer; forming a second protective layer on sides of the etched cathode layer, the protective layer and the OLED layer; sequentially performing other sub-pixels; and processing and forming a silicon-based micro-display screen based on the results of the above steps. In present invention, the etching and coating processes are carried out in a vacuum environment to prevent the OLED layer from being invaded by water vapor and oxygen, and prolong the service life of the silicon-based micro display screen.
    Type: Application
    Filed: April 30, 2020
    Publication date: April 20, 2023
    Inventors: XIAOSONG DU, XIAOLONG YANG, WENBIN ZHOU, FENG ZHANG, JIAN SUN, YUDI GAO
  • Publication number: 20230109132
    Abstract: The present invention provides a display panel and manufacturing method thereof, the method including following steps: providing a driving backplane and a light-emitting substrate, and bonding the driving backplane and the light-emitting substrate; patterning the light-emitting substrate to form a pixel array; forming a thin film packaging layer on an outside of the pixel array, the thin film packaging layer completely covering the pixel array; forming quantum dots on top of the thin film packaging layer to form a multi-color display; forming a reflective array between two adjacent quantum dots to avoid optical crosstalk between the pixel arrays. The display panel and the method of the present invention break through the physical limit of the high PPI, high-precision metal mask, which can realize the display of 2000 and higher PPI, and can prevent the optical crosstalk between the pixel arrays.
    Type: Application
    Filed: April 30, 2020
    Publication date: April 6, 2023
    Inventors: XIAOSONG DU, XIAOLONG YANG, WENBIN ZHOU, FENG ZHANG, JIAN SUN, YUDI GAO
  • Patent number: 11597729
    Abstract: Disclosed in the present invention are a pyrazolo [1,5-a]pyrimidine derivative having a structure of formula (I), a pharmaceutical composition comprising the compound of formula (I), and use of the compound in the preparation of a medicament for preventing or treating diseases associated with tropomyosin receptor kinases, in particular for preventing or treating cancers associated with tropomyosin receptor kinases. Each substituent in formula (I) has the same definition as that in the description.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: March 7, 2023
    Assignee: JIANGSU VCARE PHARMATECH CO., LTD.
    Inventors: Yong Wu, Wenbin Zhou, Yanchun Gong, Yaoxiang Yue, Jie Deng, Yongqiang Liu
  • Patent number: D976222
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: January 24, 2023
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Wenbin Zhou, Ke Zhang, Michael Zheng, Wei Guo
  • Patent number: D985402
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: May 9, 2023
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Wenbin Zhou, Zhiguo Di, Yidan Zhao, Grant T. Patterson
  • Patent number: D996988
    Type: Grant
    Filed: September 1, 2022
    Date of Patent: August 29, 2023
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Wenbin Zhou, Zhiguo Di, Yidan Zhao, Grant T. Patterson