Patents by Inventor Wenyue Zhang
Wenyue Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12111242Abstract: Disclosed is a seepage and internal erosion test apparatus for geotechnical centrifuges. The apparatus includes a mounting base, a four-motorized-jack synchronized lifting table fixed onto the mounting base, a downstream water sink, a plurality of permeameters, a centrifugal pump, and an upstream water sink fixedly mounted on the four-motorized-jack synchronized lifting table; the downstream water sink, the plurality of permeameters, the centrifugal pump, and the upstream water sink are connected by means of pipes; electric ball valves are separately disposed on each branch on which the permeameter is mounted; a temperature control module and flow meters are disposed of in the pipe for connecting the upstream outlet to the permeameter water inlet.Type: GrantFiled: May 7, 2022Date of Patent: October 8, 2024Assignee: ZHEJIANG UNIVERSITYInventors: Bo Huang, Chang Guo, Wenyue Zhang, Linfeng Cao, Yao Tang, Yu Zhao, Daosheng Ling
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Patent number: 12106025Abstract: A method includes: designing an orthogonal design table of four factors and three levels, and obtaining nine groups of structural parameters; performing a numerical simulation calculation through a finite element software to obtain nine groups of simulation results, and recording in the orthogonal design table; determining a first design parameter based on the vertical bearing performance according to the nine groups of simulation results; determining a second design parameter based on economic efficiency; and determining a design parameter according to the first design parameter and the second design parameter, and designing the squeezed branch pile according to the design parameter.Type: GrantFiled: April 12, 2024Date of Patent: October 1, 2024Assignee: Shijiazhuang Tiedao UniversityInventors: Cunbao Zhao, Ziqi Wang, Wenyue Zhang
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Publication number: 20240265172Abstract: A method includes: designing an orthogonal design table of four factors and three levels, and obtaining nine groups of structural parameters; performing a numerical simulation calculation through a finite element software to obtain nine groups of simulation results, and recording in the orthogonal design table; determining a first design parameter based on the vertical bearing performance according to the nine groups of simulation results; determining a second design parameter based on economic efficiency; and determining a design parameter according to the first design parameter and the second design parameter, and designing the squeezed branch pile according to the design parameter.Type: ApplicationFiled: April 12, 2024Publication date: August 8, 2024Inventors: Cunbao ZHAO, Ziqi WANG, Wenyue ZHANG
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Publication number: 20220333226Abstract: Disclosed is a non-oriented electrical steel sheet with low magnetic anisotropy, which comprises the following chemical elements in mass percentage: 0<C?0.005%; Si: 2.0-3.5%; Mn: 0.1-2.0%; at least one of Sn and Sb: 0.003-0.2%; Al: 0.2-1.8%; the balance being Fe and inevitable impurities. Further disclosed is a manufacturing method for the above non-oriented electrical steel sheet with low magnetic anisotropy, which includes the following steps: (1) smelting and casting; (2) hot rolling; (3) normalizing; (4) cold rolling; (5) continuous annealing: rapidly heating a cold-rolled steel sheet from an initial temperature of 350° C.-750° C. to a soaking temperature at a heating rate of 50-800° C./s, and performing soaking and heat preservation; and (6) applying an insulating coating to obtain a finished non-oriented electrical steel sheet. The non-oriented electrical steel sheet is characterized by low iron loss and low magnetic anisotropy at high frequency.Type: ApplicationFiled: August 26, 2020Publication date: October 20, 2022Applicant: BAOSHAN IRON & STEEL CO., LTDInventors: Feng ZHANG, Shuangjie CHU, Bo WANG, Wenyue ZHANG, Kanyi SHEN, Guobao LI
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Publication number: 20220260475Abstract: Disclosed is a seepage and internal erosion test apparatus for geotechnical centrifuges. The apparatus includes a mounting base, a four-motorized-jack synchronized lifting table fixed onto the mounting base, a downstream water sink, a plurality of permeameters, a centrifugal pump, and an upstream water sink fixedly mounted on the four-motorized-jack synchronized lifting table; the downstream water sink, the plurality of permeameters, the centrifugal pump, and the upstream water sink are connected by means of pipes; electric ball valves are separately disposed on each branch on which the permeameter is mounted; a temperature control module and flow meters are disposed of in the pipe for connecting the upstream outlet to the permeameter water inlet.Type: ApplicationFiled: May 7, 2022Publication date: August 18, 2022Inventors: Bo HUANG, Chang GUO, Wenyue ZHANG, Linfeng CAO, Yao TANG, Yu ZHAO, Daosheng LING
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Patent number: 9922956Abstract: A microelectromechanical system (MEMS) bond release structure is provided for manufacturing of three-dimensional integrated circuit (3D IC) devices with two or more tiers. The MEMS bond release structure includes a MEMS sacrificial release layer which may have a pillar or post structure, or alternatively, a continuous sacrificial layer for bonding and release.Type: GrantFiled: September 26, 2014Date of Patent: March 20, 2018Assignee: QUALCOMM IncorporatedInventors: Je-Hsiung Jeffrey Lan, Wenyue Zhang, Yang Du, Yong Ju Lee, Shiqun Gu, Jing Xie
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Publication number: 20160093591Abstract: A microelectromechanical system (MEMS) bond release structure is provided for manufacturing of three-dimensional integrated circuit (3D IC) devices with two or more tiers. The MEMS bond release structure includes a MEMS sacrificial release layer which may have a pillar or post structure, or alternatively, a continuous sacrificial layer for bonding and release.Type: ApplicationFiled: September 26, 2014Publication date: March 31, 2016Inventors: Je-Hsiung Jeffrey LAN, Wenyue ZHANG, Yang DU, Yong Ju LEE, Shiqun GU, Jing XIE
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Patent number: 8922974Abstract: Tunable MEMS resonators having adjustable resonance frequency and capable of handling large signals are described. In one exemplary design, a tunable MEMS resonator includes (i) a first part having a cavity and a post and (ii) a second part mated to the first part and including a movable layer located under the post. Each part may be covered with a metal layer on the surface facing the other part. The movable plate may be mechanically moved by a DC voltage to vary the resonance frequency of the MEMS resonator. The cavity may have a rectangular or circular shape and may be empty or filled with a dielectric material. The post may be positioned in the middle of the cavity. The movable plate may be attached to the second part (i) via an anchor and operated as a cantilever or (ii) via two anchors and operated as a bridge.Type: GrantFiled: January 28, 2013Date of Patent: December 30, 2014Assignee: QUALCOMM IncorporatedInventors: Je-Hsiung Lan, Evgeni P Gousev, Wenyue Zhang, Manish Kothari, Sang-June Park
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Publication number: 20130176657Abstract: This disclosure provides systems, methods and apparatus for a variable capacitance apparatus. In one aspect, an apparatus includes a plurality of electromechanical systems varactors connected in parallel. Each of the plurality of electromechanical systems varactors includes a first, a second, and a third metal layer. The first metal layer includes a first bias electrode. The second metal layer is spaced apart from the first metal layer to define a first air gap, and includes a first radio frequency electrode. A third metal layer is spaced apart from the second metal layer to define a second air gap, and includes a second radio frequency electrode and a second bias electrode. The second bias electrode of each of the plurality of electromechanical systems varactors has a different projected area perpendicular to a surface of the second metal layer and onto the surface of the second metal layer.Type: ApplicationFiled: January 11, 2012Publication date: July 11, 2013Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.Inventors: Je-Hsiung LAN, Evgeni Petrovich GOUSEV, Sang-June PARK, Wenyue ZHANG
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Publication number: 20130100090Abstract: This disclosure provides systems, methods and apparatus for electromechanical systems variable capacitance devices. In one aspect, an electromechanical systems variable capacitance device includes a substrate with a first metal layer including a first bias electrode overlying the substrate. A member suspended above the first metal layer includes a dielectric beam and a second metal layer including a first radio frequency electrode and a ground electrode. The member and the first metal layer define a first air gap. A third metal layer over the member includes a second bias electrode, and the third metal layer and the member define a second air gap. The member includes a plane of symmetry substantially parallel a plane containing the first bias electrode.Type: ApplicationFiled: October 21, 2011Publication date: April 25, 2013Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.Inventors: Daniel FELNHOFER, Wenyue ZHANG, Je-Hsuing LAN
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Publication number: 20130100065Abstract: This disclosure provides systems, methods and apparatus for electromechanical systems variable capacitance devices. In one aspect, an electromechanical systems variable capacitance device includes a substrate with a bottom bias electrode on the substrate. A first radio frequency electrode above the bottom bias electrode defines a first air gap. A non-planarized first dielectric layer is between the bottom bias electrode and the first radio frequency electrode. A metal layer above the first radio frequency electrode defines a second air gap. The metal layer includes a top bias electrode and a second radio frequency electrode.Type: ApplicationFiled: October 21, 2011Publication date: April 25, 2013Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.Inventors: Daniel FELNHOFER, Wenyue ZHANG, Je-Hsuing LAN
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Publication number: 20130057558Abstract: This disclosure provides systems, methods and apparatus for controlling a mechanical layer. In one aspect, an electromechanical systems device includes a substrate and a mechanical layer positioned over the substrate to define a gap. The mechanical layer is movable in the gap between an actuated position and a relaxed position, and includes a mirror layer, a cap layer, and a dielectric layer disposed between the mirror layer and the cap layer. The mechanical layer is configured to have a curvature in a direction away from the substrate when the mechanical layer is in the relaxed position. In some implementations, the mechanical layer can be formed to have a positive stress gradient directed toward the substrate that can direct the curvature of the mechanical layer upward when the sacrificial layer is removed.Type: ApplicationFiled: September 7, 2011Publication date: March 7, 2013Applicant: QUALCOMM MEMS Technologies, Inc.Inventors: Chuan Pu, Yi Tao, Chandra S. Tupelly, Kostadin D. Djordjev, Fan Zhong, Rihui He, Wenyue Zhang
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Patent number: 8363380Abstract: MEMS varactors capable of handling large signals and/or achieving a high capacitance tuning range are described. In an exemplary design, a MEMS varactor includes (i) a first bottom plate electrically coupled to a first terminal receiving an input signal, (ii) a second bottom plate electrically coupled to a second terminal receiving a DC voltage, and (iii) a top plate formed over the first and second bottom plates and electrically coupled to a third terminal. The DC voltage causes the top plate to mechanically move and vary the capacitance observed by the input signal. In another exemplary design, a MEMS varactor includes first, second and third plates formed on over one another and electrically coupled to first, second and third terminals, respectively. First and second DC voltages may be applied to the first and third terminals, respectively. An input signal may be passed between the first and second terminals.Type: GrantFiled: May 28, 2009Date of Patent: January 29, 2013Assignee: Qualcomm IncorporatedInventors: Je-Hsiung Lan, Evgeni P. Gousev, Wenyue Zhang, Manish Kothari, Sang-June Park
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Publication number: 20120056855Abstract: This disclosure provides systems, methods, and apparatus including one or more capacitance control layers to decrease the magnitude of an electric field between a movable layer and an electrode. In one aspect, a display device includes an electrode, a movable layer, and a capacitance control layer. At least a portion of the movable layer can be configured to move toward the electrode when a voltage is applied across the electrode and the movable layer and an interferometric cavity can be disposed between the movable layer and the first electrode. The capacitance control layer can be configured to decrease the magnitude of an electric field between the movable layer and the electrode when the voltage is applied across the movable layer and the electrode.Type: ApplicationFiled: January 21, 2011Publication date: March 8, 2012Applicant: QUALCOMM MEMS Technologies, Inc.Inventors: Wenyue Zhang, Alok Govil, Ming-Hau Tung, Yi Tao
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Publication number: 20110109383Abstract: MEMS varactors capable of handling large signals and/or achieving a high capacitance tuning range are described. In an exemplary design, a MEMS varactor includes (i) a first bottom plate electrically coupled to a first terminal receiving an input signal, (ii) a second bottom plate electrically coupled to a second terminal receiving a DC voltage, and (iii) a top plate formed over the first and second bottom plates and electrically coupled to a third terminal. The DC voltage causes the top plate to mechanically move and vary the capacitance observed by the input signal. In another exemplary design, a MEMS varactor includes first, second and third plates formed on over one another and electrically coupled to first, second and third terminals, respectively. First and second DC voltages may be applied to the first and third terminals, respectively. An input signal may be passed between the first and second terminals.Type: ApplicationFiled: May 28, 2009Publication date: May 12, 2011Applicant: QUALCOMM INCORPORATEDInventors: Je-Hsiung Lan, Evgeni P. Gousev, Wenyue Zhang, Manish Kothari, Sang-June Park