Abstract: An optoelectronic module for bidirectional optical data transmission includes a molded part acting as a beam-splitter device, formed substantially of a material transparent to emitted radiation and received radiation and having a beam-splitter layer embedded therein. A transmit component, a receive component and a radiation-focusing device are directly connected to the molded part and are provided with a sealing jacket.

Abstract: An optical switch includes an optical transmission path having an optical transmission medium, an input-side end and an output-side end. A radiation source is associated with the input-side end for emitting a primary optoelectronic signal being coupled into the transmission path. A reflection device is associated with the output-side end for receiving the primary optoelectronic signal and converting the primary optoelectronic signal into a secondary, modulated optoelectronic signal being reflected and coupled back into the transmission path. A receiver is associated with the input-side end of the transmission path for responding to the secondary, modulated optoelectronic signal to perform an electronic switching operation.

Abstract: A radiation emitter component, in particular an infrared emitter component with a conventional light-emitting diode housing, includes two electrode connections, one of which has a well-shaped reflector. The housing has an optically transparent, electrically non-conducting encapsulation material. A semiconductor laser chip is fastened in a well-shaped reflector of the light-emitting diode housing. The semiconductor laser chip has a quantum well structure, in particular with a strained layer structure, for example MOVPE epitaxial layers with a layer sequence GaAlAs-InGaAs-GaAlAs. A diffusor material can be inserted into the optically transparent, electrically non-conducting material of the light-emitting diode housing.

Abstract: An optoelectronic transducer includes a base plate, a radiation-emitting or transmitting semiconductor component disposed on the base plate, an optical lens system aimed at the semiconductor component and a spacer joined to the base plate for the lens system. The base plate, the spacer and the lens system are formed of materials with at least similar coefficients of thermal expansion. A method for producing an optoelectronic transducer includes forming indentations in a base plate for receiving semiconductor components, while leaving a land remaining on at least one side of each of the indentations. A first plate of the size of the base plate is placed on the lands and joined to the lands by material locking. The first plate is removed between the lands producing spacers joined to the base plate. A number of the semiconductor components are inserted into the indentations in accordance with a predetermined grid pattern and are joined to the base plate to form substrates.

Abstract: A method for manufacturing a semiconductor component having a semiconductor body secured to a support plate comprises securing the support plate on a surface of the semiconductor body before applying the cover layers which form mirrors on the end surfaces of the semiconductor body. The support plate is preferably made of an electrically and thermally conducting material which has a coefficient of thermal expansion similar to the coefficient of thermal expansion of the semiconductor body.

Abstract: In an optoelectronic component having a laser chip as a light transmitter and a lens coupling optics for defined emission of radiation generated in the laser chip, the lens coupling optics is arranged immediately in front of the laser chip and is adjusted and fixed in stable fashion in a simple way. The component is rationally manufactured in a wafer union. The laser chip is arranged on a common carrier between two carrier parts whose lateral surfaces neighboring the resonator faces of the laser chip are provided with mirror layers, and that are inclined at an angle of 45.degree. relative to the resonator faces. Thus the radiation generated in the laser chip is directed nearly perpendicularly upward to the surface of the common carrier and the lens coupling optics is arranged on at least the one carrier part such that the radiation generated in the laser chip impinges this lens optics nearly perpendicularly.

Abstract: A semiconductor component has at least one semiconductor chip mounted on a carrier part of its housing. The semiconductor chip is electrically connected to at least two electrode connectors which are provided with contacts. The component housing has an upper housing portion and at least one housing side part which surround the semiconductor chip at least partially. The carrier part on which the semiconductor chip is mounted forms the upper housing portion of the component housing and the at least two electrode connectors at least partially form the housing side parts of the component housing.

Abstract: A laser diode component includes a semiconductor body secured on a heat sink which includes a dissipator and an electrically and thermally conductive connection plate. The semiconductor body is secured to the connection plate, which in turn is applied to the dissipator. The connection plate is formed of a material having a coefficient of thermal expansion that is similar to the coefficient of thermal expansion of the semiconductor material of the semiconductor body. A connecting layer between the semiconductor body and the connection plate is preferably formed of hard solder. The dissipator is secured to the connection plate, for example through the use of a thermally conductive adhesive. A method for producing a plurality of laser diode components includes making many such laser diode components as a unit, and then subsequently cutting them apart.

Abstract: The microoptical device has beam-parallelizing optics and a deflecting mirror configuration. The device converts a laser beam bundle, which is emitted by a laser diode strip structure or individual diode chips and which is comprised of a plurality of strip-shaped individual laser beams, into a rectangular or parallelogram-shaped laser beam bundle composed of parallelized strip-shaped individual laser beams arranged parallel next to one another. The beam-parallelizing optics may be a cylindrical lens, and the deflecting mirror configuration may be two rows of mirrors. The cylindrical lens and the rows of mirrors are preferably produced from a semiconductor material and they can therefore be produced cost effectively by means of methods used in semiconductor process engineering.

Abstract: An optical coupling device and method for manufacturing the same is disclosed wherein a light-emitting semiconductor transmitter chip is secured to a light-detecting semiconductor receiver chip via a transparent insulating layer, a structured spacer layer and a transparent connecting layer. The resultant optocoupler has a high coupling factor and may be reliably manufactured into SMT compatible packages.

Abstract: A light emitting diode includes a doped semiconductor substrate wafer with a layer sequence suitable for light emission in the green spectral range epitaxially applied thereon. A zinc-doped contact is applied to the p-conductive side of the wafer for efficient generation of pure green light emissions. An electrically conductive layer is provided between the zinc-doped contact and the p-conductive wafer side to suppress diffusion of oxygen into the p-conductive wafer side during diode manufacture.

Abstract: A bidirectional transceiver module for message and signal transmission via a light waveguide is formed of a lens coupling optics, a laser chip as a light transmitter, a light receiver, and a beam splitter intervening in the beam path. These parts are at least partially surrounded by a housing. They are designed such that, given reduced manufacturing expense, a lens coupling optics arranged immediately in front of the laser chip can be adjusted in a simple way and can be fixed in stable fashion. The laser chip is arranged on a common carrier between two carrier parts whose lateral surfaces neighboring the resonator faces of the laser chip are provided with mirror layers and are inclined at an angle of approximately 45.degree. relative to the resonator faces for beam deflection onto the lens coupling optics secured above the laser chip on at least one carrier part. The mirror layer neighboring the front side of the laser chip is provided with the beam splitter.

Abstract: A signal transmission protected against undesired quering is made possible with a photon-driven component and the energy supply is independent of external electrical connection. A photon-driven device has a light-receiving, monolithic semiconductor component for receiving optical energy and an optical signal for conversion into electrical energy and an electrical signal and has a light-transmitting semiconductor component for converting the electrical signal into an optical signal and for transmitting the optical signal. A radiation source for producing the optical energy and the optical signal and an optical receiver for the output optical signal from the photon-driven component are provided in a device for reading the information carried by the optical signal and produced in an electrical circuit connected to, powered by and operated by the photon-driven semiconductor component.

Abstract: An opto-electronic transducer having a lens-type optical coupling wherein a lens within a lens carrier is arranged in the beam path immediately in front of the transducer. The lens carrier, together with the lens, are fixed to a fastening part by a fastening layer that is adjusted relative to the beam axis of the transducer. The fastening part is part of a common carrier for the transducer. The opto-electronic transducer and the lens carrier together with the lens are secured on the common carrier in such a spacial relationship relative to one another that the beam axis of the transducer is perpendicular to the surface formed by the fastening layer. The opto-electronic transducer of the invention is particularly suited for use as a light waveguide transmission or reception component or, alternatively, as an individual light source.

Abstract: An opto-electronic semiconductor component having a light transmission or receiving property including a light emitting or detecting active zone lying parallel to the principle surface of the semiconductor crystal is formed so that it detects or emits light directed parallel to the active zone with high efficiency. This enables the component to be hybridize with other electrical, electro-optical or optical elements in a single plane. At least one lateral surface of the semiconductor crystal is inclined at an angle to the principle surface of the component such that light directed into or from the crystal in a direction parallel to the active zone experiences deflection by refraction or reflection toward or away from the active zone.

Abstract: Within a common housing are mounted an autonomous light transmitter having its own transmitter optical coupling element, an autonomous light receiver, a part for connecting a common optical fiber to the common housing, and a beam splitter arranged in the beam path within the common housing. The autonomous light transmitter and the autonomous light receiver are each within their own hermetically sealed encapsulations and it is these hermetically sealed autonomous components which are mounted within the common housing.

Abstract: An optical coupling element having a convex, refractive microlens is characterized by a ball having a flat, planar surface being mounted in a through-hole of a carrier lamina with the flat, planar surface extending parallel to a planar surface of the lamina. The coupling element is preferably made by a method which involves forming a through-hole in a lamina, mounting a ball in the through-hole, processing a surface of the ball to form the planar surface that extends parallel to a surface of the lamina. Preferably, a plurality of coupling elements are formed by providing a plurality of through-holes in an enlarged carrier and after processing, each individual coupling element is then separated from this enlarged carrier.

Abstract: A semiconductor chip (1) is bonded to a substrate (2) serving as a component housing, a contact part, an insulative part or a connecting part without the use of a high-temperature process or any additional bonding medium such as solder or flux. The backside of the semiconductor chip (1) or substrate (2) is structured to include specially formed bumps (3) for the necessary connections. A ductile metal is used for these bumps (3). The bond to the substrate (2) is formed by using pressure and/or ultrasonic energy. The process according to this invention is particularly suitable for bonding components in data link receivers, optoelectronic couplers, transmitters (LEDs, IREDs) and ISDN modules.

Abstract: A method and arrangement for the positioning and bonding of a solid body (2) in which one part of the solid body (2) together with the bonding agent (6) is to be attached to a further element (7) and bonded to a base (4) is to be capable of positioning the solid body (2), at the point attained after positioning, with both high precision and high long term stability. The solid body (2) is immersed in the bonding agent (6) and this bonding agent is in turn located in a groove of a further electrically conducting body (7). The further body (7) is heated by current flow to a temperature at which the solid body (2) is movable within the bonding agent. Upon attaining the desired positioning of the solid body (2), the bonding agent is allowed to cool through controlled reduction of the heating current until solidification occurs.

Abstract: A method and arrangement for the positioning and bonding of a solid body (2), in which one part of the solid body (2) together with the bonding agent (6) is to be attached to a further element (7) and bonded to a base (4) is to be capable of positioning the solid body (2), at the point attained after positioning, with both high precision and high long term stability. The solid body (2) is immersed in the bonding agent (6) and this bonding agent is in turn located in a groove of a further electrically conducting body (7). The further body (7) is heated by current flow to a temperature at which the solid body (2) is movable within the bonding agent. Upon attaining the desired positioning of the solid body (2), the bonding agent is allowed to cool through controlled reduction of the heating current until solidification occurs.