Abstract: An optoelectronic coupling element and method for manufacturing the coupling element. The coupling element includes a light wave guide, a microlens, a first carrier chip and a light emitting and/or light detecting semiconductor element. The microlens is preferably spherical in shape and is adapted for optically coupling the light wave guide and the semiconductor element. The semiconductor element can be part of the first carrier chip or, according to another embodiment, can be part of a second carrier chip. The purpose of this coupling element is to facilitate the precise mounting of the microlens in a position between the light wave guide and the semiconductor element and also facilitate the adjustment of the microlens to optimally perform its light coupling function. The method for manufacturing the coupling element provides for the formation of a receptacle having trapezoidal shape sides in the carrier chip. The microlens is mounted within the receptacle with a connecting medium such as glass.

Abstract: In order to manufacture respectively optocouplers or reflex light barriers particularly efficiently, semiconductor light transmitters and semiconductor light receivers are situated on a single substrate. The optic coupling or optic isolation of light transmitter and light receiver takes place in the substrate. Only then are semiconductor elements separated into discrete units.

Abstract: A device for releasably coupling an optical fiber to an optoelectronic component comprises a support (3) having a V-shaped groove (2) cut into it for holding an optical fiber. The fiber terminates with its end face opposite an optoelectronic component (1) fixed on the same support (3). The optical fiber is fixed in the groove (2) by means of spring force (5) which acts on holding elements (16,17) as well as plastic layers (15) that press the fiber into the groove (2).

Abstract: A method and arrangement for the positioning and bonding of a solid body (2), in which one part of the solid body (2) together with the bonding agent (6) is to be attached to a further element (7) and bonded to a base (4) is to be capable of positioning the solid body (2), at the point attained from positioning, with both high precision and high long term stability. The solid body (2) is immersed in the bonding agent (6) and this bonding agent is in turn located in a groove of a further electrically conducting body (7). The further body (7) is heated by current flow to a temperature at which the solid body (2) is movable within the bonding agent. Upon attaining the desired positioning of the solid body (2), the bonding agent is allowed to cool through controlled reduction of the heating current until solidification occurs.

Abstract: In an opto-electronic module housing for positioning an end of an optical fiber in a desired position relative to an active area of an opto-electronic component characterized by the housing including an optical fiber connector having an adjustment plane at one end and an arrangement for holding an end of an optical fiber with the axis of the fiber on an axis extending perpendicular to the adjustment plane with the end being a fixed distance from the plane, an adjustment frame being securable to the adjustment plane and an arrangement for locating an opto-electronic component or transducer relative to the frame including a plate having the component mounted thereon. The arrangement including the plate is securable to the frame and the frame and the arrangement enable adjusting the component in three spatial directions relative to the end of the fiber to obtain an optimum adjustable position.

Abstract: An optoelectronic coupler with a semiconductor transmitter and a semiconductor receiver has a transparent conductive screen formed of semiconductor material overlying the active area of at least one of the transmitter and receiver, in the path of optical radiation passing between the transmitter and receiver, and directly electrically connected to a semiconductor zone of the active area, to protect the coupler from changes in its electrical characteristics due to high intensity electric fields.

Abstract: Optical filters are directly mounted on the surface of photo-detectors. The filters have maximum radiation permeability for the operating range of the photo-detector. For that region of the spectrum which lies outside of the operating range, the filters are of maximum impermeability and considerably decrease interfering currents resulting from the incidence of foreign light. The direct mounting of the filters on the detector surface effects not only technical but also economical advantages.