Abstract: In an embodiment a sensor arrangement includes a pressure sensor realized as a capacitive pressure sensor, a capacitance-to-digital converter coupled to the pressure sensor and implemented as a delta-sigma analog-to-digital converter and a reference voltage generator having a control input configured to receive a control signal and an output configured to provide a reference voltage, wherein the output of the reference voltage generator is connected to an input of the capacitance-to-digital converter, wherein the reference voltage generator is configured to set a value of the reference voltage as a function of the control signal, and wherein at least two different values of the reference voltage have the same sign and different amounts.

Abstract: In an embodiment a system includes a sensor including a base having a base electrode and a first membrane suspended above the base, wherein the first membrane has a first membrane electrode, wherein the first membrane is configured to deflect with respect to the base electrode in response to an environmental condition, and wherein the sensor is configured to measure a capacitance between the base electrode and the first membrane electrode. The system further includes a first device of the system configured to generate electrical interference signals, a first electrically conductive shield layer positioned between the sensor and the first device of the system, wherein the first electrically conductive shield layer defines a plurality of first apertures extending through the first electrically conductive shield layer and a dielectric material disposed in the plurality of first apertures.

Abstract: The sensor package comprises a carrier (1) including electric conductors (13), an ASIC device (6) and a sensor element (7), which is integrated in the ASIC device (6). A dummy die or interposer (4) is arranged between the carrier (1) and the ASIC device (6). The dummy die or interposer (4) is fastened to the carrier (1), and the ASIC device (6) is fastened to the dummy die or interposer (4).

Abstract: A die attachment to a support is disclosed. In an embodiment, a semiconductor package includes a support and a die attached to the support by an adhesive on a backside of the die, wherein the die includes a capacitive pressure sensor integrated on a CMOS read-out circuit, and wherein the adhesive covers only a part of the backside of the die.

Abstract: Capacitive pressure sensors and other devices are disclosed. In an embodiment a semiconductor device includes a first electrode, a cavity over the first electrode and a second electrode including a suspended membrane over the cavity and electrically conductive anchor trenches laterally surrounding the cavity, wherein the anchor trenches include an inner anchor trench and an outer anchor trench, the outer anchor trench having rounded corners.

Abstract: A capacitive sensor is disclosed. In an embodiment a semiconductor device includes a die including a capacitive pressure sensor integrated on a CMOS circuit, wherein the capacitive pressure sensor includes a first electrode and a second electrode separated from one another by a cavity, the second electrode including a suspended tensile membrane, and wherein the first electrode is composed of one or more aluminum-free layers containing Ti.

Abstract: The microphone and pressure sensor package comprises a carrier (1) with an opening (16), a microphone device (20) including a diaphragm (21) and a perforated back plate (22) arranged above the opening (16), an ASIC device (6), and a cover (9) forming a cavity (17) between the carrier (1) and the cover (9). The ASIC device (6) and the microphone device (20) are arranged in the cavity (17). A sensor element (7) provided for a pressure sensor is integrated in the ASIC device (6). The pressure outside the cavity (17) is transferred to the sensor element (7) through the opening (16), the diaphragm (21), and the back plate (22).

Abstract: The sensor package comprises a carrier (1) including electric conductors (13), an ASIC device (6) and a sensor element (7), which is integrated in the ASIC device (6). A dummy die or interposer (4) is arranged between the carrier (1) and the ASIC device (6). The dummy die or interposer (4) is fastened to the carrier (1), and the ASIC device (6) is fastened to the dummy die or interposer (4).

Abstract: In an embodiment, a method for calibrating a pressure sensor device is disclosed. The method involves determining the resonant frequency of a membrane of the pressure sensor device after the pressure sensor device has been attached to a circuit board, calculating a change in the resonant frequency from a resonant frequency stored in memory, calculating strain of the membrane of the pressure sensor device from the change in resonant frequency, and calibrating the pressure sensor device based on a capacitance-to-pressure curve calculated using the strain of the membrane of the pressure sensor device.

Abstract: A pressure sensor device comprises a substrate body, a pressure sensor comprising a membrane, and a cap body comprising at least one opening. The pressure sensor is arranged between the substrate body and the cap body in a vertical direction which is perpendicular to the main plane of extension of the substrate body, and the mass of the substrate body equals approximately the mass of the cap body. Furthermore, a method for forming a pressure sensor device is provided.

Abstract: A semiconductor device comprises a substrate body, an environmental sensor, a cap body and a volume of gas. The environmental sensor and the volume of gas are arranged between the substrate body and the cap body in a vertical direction which is perpendicular to the main plane of extension of the substrate body, and at least one channel between the substrate body and the cap body connects the volume of gas with the environment of the semiconductor device such that the channel is permeable for gases.

Abstract: An integrated temperature sensor comprises a chip package enclosing an integrated circuit and an ultrasonic transceiver which is integrated on top of the integrated circuit. The ultrasonic transceiver comprises a transmitting element which is arranged for emitting ultrasound waves, and a receiving element which is arranged for receiving ultrasound waves. The chip package comprises at least one barrier arranged at a defined position in the chip package. The barrier is designed to at least partly reflect ultrasound waves emitted by the transmitting element towards the receiving element. The integrated circuit comprises an actuator element to actuate the transmitting element to emit ultrasound waves according to a first signal s(t), and a converter element to convert an ultrasound wave, received by the receiving element, into a second signal y(t).

Abstract: The microphone and pressure sensor package comprises a carrier (1) with an opening (16), a microphone device (20) including a diaphragm (21) and a perforated back plate (22) arranged above the opening (16), an ASIC device (6), and a cover (9) forming a cavity (17) between the carrier (1) and the cover (9). The ASIC device (6) and the microphone device (20) are arranged in the cavity (17). A sensor element (7) provided for a pressure sensor is integrated in the ASIC device (6). The pressure outside the cavity (17) is transferred to the sensor element (7) through the opening (16), the diaphragm (21), and the back plate (22).

Abstract: Disclosed is an integrated circuit, comprising a semiconductor substrate carrying a plurality of circuit elements; and a pressure sensor including a cavity on said semiconductor substrate, said cavity comprising a pair of electrodes laterally separated from each other; and a flexible membrane over and spatially separated from said electrodes such that said membrane interferes with a fringe field between said electrodes, said membrane comprising at least one aperture. A method of manufacturing such an IC is also disclosed.

Abstract: A pressure sensor measures pressure by measuring the deflection of a MEMS membrane using a capacitive read-out method. There are two ways to implement the invention. One involves the use of an integrated Pirani sensor and the other involves the use of an integrated resonator, to function as a reference pressure sensor, for measuring an internal cavity pressure.

Abstract: Disclosed is a flexible insert (100) for placement on the human eye, comprising a light source (110) in said insert such that light emitted from the light source is shielded from the human eye upon correct placement of the insert on the human eye, a light-responsive material (120) placed in the light path of the light source, said light-responsive material emitting light upon stimulation by the light from said light source, the intensity of said stimulated emission being sensitive to a chemical interaction of the light-sensitive material with an analyte of interest, a photodetector (130) for detecting the light emitted by the light-responsive material; and a transmitter (140) coupled to the photodetector for transmitting a photodetector reading. The insert may be used in conjunction with a reader for automated monitoring of an analyte of interest such as glucose in the tear fluid of its wearer.

Abstract: A differential pressure sensor comprises a cavity having a base including a base electrode and a membrane suspended above the base which includes a membrane electrode, wherein the first membrane is sealed with the cavity defined beneath the first membrane. A first pressure input port is coupled to the space above the sealed first membrane. A capacitive read out system is used to measure the capacitance between the base electrode and membrane electrode. An interconnecting channel is between the cavity and a second pressure input port, so that the sensor is responsive to the differential pressure applied to opposite sides of the membrane by the two input ports.

Abstract: Various embodiments relate to an in-cell battery management device including: an integrated circuit (IC) including a controller, a resistive balancer, a voltage sensor, and a pressure sensor; and an IC package that encloses the IC having a hole over the pressure sensor wherein the hole allows the pressure sensor to measure pressure in a battery cell; wherein the IC package is contact with the battery cell.

Abstract: A gaming system has a pressure measurement in the remote control (which may be the complete gaming apparatus) and this is used to derive a height of the remote control. In this way, barometric pressure measurement allows precise determination of the altitude of the game controller. The altitude information is then used to control the game.

Abstract: A pressure sensor measures pressure by measuring the deflection of a MEMS membrane using a capacitive read-out method. There are two ways to implement the invention. One involves the use of an integrated Pirani sensor and the other involves the use of an integrated resonator, to function as a reference pressure sensor, for measuring an internal cavity pressure.