Abstract: New photosensitive polyamic acid precursors are disclosed which have the formula: ##STR1## where Z is a tetravalent organic radical which contains at least one aromatic ring, Z' is a divalent organic radical which contains at least one aromatic ring, and R* is a photosensitive group. Particularly preferred compounds include BPDA-PDA and BPDA-ODA polyamic acid precursors. The precursor compositions within the practice of this invention are i-line, g-line, and i-/g-line active and show good photoresolution. The films formed exhibit excellent self-adhesion and adhesion to glass ceramic and silicon wafer substrates have low internal stress, a very low degree of solvent swelling, high thermal stability, and excellent mechanical properties such as high modulus/tensile strength and high elongation at break.

Abstract: The present invention relates to an improved process for forming negative tone images of photosensitive polyimides on a substrate having improved wall angles.

Abstract: The present invention relates to a circuit assembly comprising the polyimide poly(3,4'-oxydiphenylene pyromellitimide).

Abstract: The present invention relates to photosensitive negative and positive tone compositions for imagewise deposition of polyimide on a substrate.

Abstract: Block copolymers of polyimide and poly (phenylquinoxaline) have been synthesized. They are useful, particularly as dielectric layers in thin film multilayer structures. The most preferred embodiments are formed from polyimides which are those from pyromellitic dianhydride and oxydianiline. The most preferred poly (phenylquinoxaline) is a monofunctional oligomer, which yields the best microstructure.

Abstract: Thin films of polyimide having electrical insulation, low thermal expansion, high glass transition temperature, and good adhesion are made by dispersing fine domains of relatively flexible polyimide which is fluorinated in a matrix of relatively rigid polyimide.

Abstract: A composition for the application of a planar polyimide coating having a glass transition temperature above 300.degree. C. comprises a solution in an anhydrous, aprotic solvent of an aromatic diamine and a dialkyldihydrogen pyromellitate which is more than 90% meta isomer.

Abstract: Integrated circuit module wherein the cap is sealed to the substrate with a liquid crystalline polyester melt containing about 25 to about 100 mole percent of recurring Units I and O to about 75 mole percent of recurring Units II wherein ##STR1## wherein each R and R.sub.2 is arylene or cycloalkylene or alkylene or alkylidene.

Abstract: A surface coating of high glass temperature and superior mechanical properties along with excellent planarization and gap filling is used to coat substrates. The coating comprises a polyamide alkyl ester from a pyromellitic alkyl diester and a para-linked aromatic diamine dissolved in a solvent containing at least 10% of a co-solvent boiling above 220.degree. C.

Abstract: A process for coating a substrate to provide good planarization and good mechanical and thermal stability, the process comprising applying to the substrate an amino-terminated oligomer and an ester, with the oligomer being formed from an aromatic diamine and from an aromatic dianhydride, and the ester being formed from an aromatic tetracarboxylic acid and an alcohol, and by reacting said oligomer and said ester in situ, with the process being characterized in that the ester reacts with an amine group of the oligomer to form a high molecular weight polyamide at a temperature between 40.degree. C. and 140.degree. C., and continues to react to form a cyclic imide.

Abstract: Microspheres are produced by cobalt gamma radiation initiated polymerization of a dilute aqueous vinyl pyridine solution. Addition of cross-linking agent provides higher surface area beads. Addition of monomers such as hydroxyethylmethacrylate acrylamide or methacrylamide increases hydrophilic properties and surface area of the beads. High surface area catalytic supports are formed in the presence of controlled pore glass substrate.

Abstract: Microspheres are produced by cobalt gamma radiation initiated polymerization of a dilute aqueous vinyl pyridine solution. Addition of cross-linking agent provides higher surface area beads. Addition of monomers such as hydroxyethylmethacrylate acrylamide or methacrylamide increases hydrophilic properties and surface area of the beads. High surface area catalytic supports are formed in the presence of controlled pore glass substrate.

Abstract: Amine containing polymeric microspheres such as polyvinyl pyridine are complexed with metal salts or acids containing metals such as gold, platinum or iron. After reduction with sodium borohydride, the salt is reduced to finely divided free metal or metal oxides, useful as catalysts. Microspheres containing covalent bonding sites can be used for labeling or separating proteins.

Abstract: Microspheres are produced by cobalt gamma radiation initiated polymerization of a dilute aqueous vinyl pyridine solution. Addition of cross-linking agent provides higher surface area beads. Addition of monomers such as hydroxyethylmethacrylate acrylamide or methacrylamide increases hydrophilic properties and surface area of the beads. High surface area catalytic supports are formed in the presence of controlled pore glass substrate.

Abstract: Amine containing polymeric microspheres such as polyvinyl pyridine are complexed with metal salts or acids containing metals such as gold, platinum or iron. After reduction with sodium borohydride, the salt is reduced to finely divided free metal or metal oxides, useful as catalysts. Microspheres containing covalent bonding sites can be used for labeling or separating proteins.

Abstract: A composition for the application of a planar polymide coating having a glass transition temperature above 300.degree. C. comprises a solution in an anhydrous, aprotic solvent of .Iadd.the reaction product .Iaddend.of an aromatic diamine and a .[.dialkyldihydrogen.]. .Iadd.dialkyl .Iaddend.pyromellitate .Iadd.diacyl chloride .Iaddend.which .[.is more than.]. .Iadd.comprises about .Iaddend.90% .Iadd.or more .Iaddend.meta isomer.