Abstract: A platform carries an integrated circuit (IC) (20) for handling and alignment through wire bonding operations, provides interconnections, and supports the shielded IC with uniform, controlled adhesive thickness. The platform base (10) has a flat portion which may have a slot (30) extending the length of a chip with wire-bond pads (140). The IC is mounted to the platform base with cast or contained adhesive, epoxy, or tape (50), which provides at least one adhesive surface. For several rows of wire-bond pads, there may be several slots. If the platform carries more than one chip, the platform base may have one or more slots (30, 40) per chip. A platform may carry other components (110, 120). Circuitry (90) may be printed on one or both sides of the platform base, with moderate resistivity to damp ringing of noise signals. Wire bonds are made through the slot (30), connecting IC pads with circuitry.

Abstract: An apparatus is provided for dispensing postage stamps that are coated with a pressure-sensitive adhesive onto envelopes located therebeneath. Such postage stamps are wound in rolls and have a uniform width. In some postage stamp rolls the stamps are supported upon a carrier strip coated with a release agent, while in other arrangements the roll of stamps includes no separate carrier strip. The stamp application device of the invention is applicable to both types of postage stamp rolls. The stamp application apparatus employs a body that defines a stamp roll cavity and a postage stamp dispensing position. An advancement roller is located beneath the stamp roll cavity and above the postage stamp dispensing position and serves to advance the exposed end of the postage stamp roll toward the postage stamp dispensing position in incremental steps in response to operation of an advancement actuator mechanism.

Abstract: The present invention relates to a compound of the formula ##STR1## and the pharmaceutically acceptable salts thereof wherein W is a bicyclic heterocyclic ring system. The compounds are .alpha.-1 adrenergic antagonists and are useful in the treatment of BPH; also disclosed are .alpha.-1 antagonist compositions and a method for antagonizing .alpha.

Abstract: A platform carries an integrated circuit (IC) (20) for handling and alignment through wire bonding or TAB operations, provides interconnections, and supports the shielded IC with uniform, controlled adhesive thickness. The platform base (10) has a flat portion which may have a slot (30) extending the length of a chip with wire-bond pads (140). The IC is mounted to the platform base with cast or contained adhesive, epoxy, or tape (50), which provides at least one adhesive surface. For several rows of wire-bond pads, there may be several slots. If the platform carries more than one chip, the platform base may have one or more slots (30, 40) per chip. A platform may carry other components (110, 120). Circuitry (90) may be printed on one or both sides of the platform base, with moderate resistivity to damp ringing of noise signals. Wire bonds are made through the slot (30), connecting IC pads with circuitry.

Abstract: The present invention relates to a compound of the formula ##STR1## and the pharmaceutically acceptable salts thereof wherein W is a bicyclic heterocyclic ring system. The compounds are .alpha.-1 adrenergic antagonists and are useful in the treatment of BPH; also disclosed are .alpha.-1 antagonist compositions and a method for antagonizing .alpha.-1 receptors and treating BPH.

Abstract: An integrated-circuit manufacturing process uses a platform to carry an integrated circuit (IC) (20) for handling and alignment through wire bonding or TAB operations, to provide interconnections, and to support the shielded IC with uniform, controlled adhesive thickness. The platform base (10) has a flat portion which may have a slot (30) extending the length of a chip with wire-bond pads (140). The IC is mounted to the platform base with cast or contained adhesive, epoxy, or tape (50), which provides at least one adhesive surface. For several rows of wire-bond pads, there may be several slots. If the platform carries more than one chip, the platform base may have one or more slots (30, 40) per chip. A platform may carry other components (110, 120). Circuitry (90) may be printed on one or both sides of the platform base, with moderate resistivity to damp ringing of noise signals. Wire bonds are made through the slot (30), connecting IC pads with circuitry.

Abstract: A platform serves to carry an integrated circuit chip (20) for handling and alignment through wire bonding or TAB operations, provides interconnections, and supports the IC chip in its use environment. The platform base (10) has a flat portion which may have a slot (30) passing through it and extending approximately the length of an IC chip (which has wire-bond pads (140), some of which may be near a chip axis). The IC chip is mounted to the platform base with tape (50), which provides at least one adhesive surface. The tape may be a cast or contained adhesive or epoxy with or without a backing layer, or it may be a thermoplastic or thermo-setting plastic. TAB or wire-bond pads are aligned with respect to the platform slot. If the chip has more than one row of wire-bond pads, the platform may have more than one slot. If more than one chip is mounted to the platform, the platform's base may have one or more slots (30, 40) per chip. Circuitry (90) may be printed on one or both sides of the platform base.

Abstract: A combined hole puncher and reinforcer is provided with a punch control mechanism for detecting the presence of a flat sheet of material in registration with the punching device so as to provide a mechanical interlock for disabling the punching device in the absence of such a flat sheet in registration therewith, unless the adhesive tape feed mechanism is disabled. Also, a tape retainer or cover is hinged for rotation relative a mounting base and carries with it a depression finger and an idler roller. This not only provides clear access to the tape cavity, and enhances tractional engagement of the tape upon closure of the cover, but also avoids the necessity for threading the tape beneath an idler roller. The tape feed mechanism employs no gears, but utilizes a single ratchet wheel and pawl to advance the tape along its longitudinal path into registration with the punch and press assembly.

Abstract: The present invention relates to a compound of the formula ##STR1## and the pharmaceutically acceptable salts thereof wherein W is a tricyclic heterocyclic ring system; which is an .alpha.-1 adrenergic antagonist and is useful in the treatment of BPH; also disclosed are .alpha.-1 antagonist compositions and a method for antagonizing .alpha.-1 receptors and treating BPH.

Abstract: The present invention relates to a compound of the formula ##STR1## and the pharmaceutically acceptable salts thereof wherein W is a bicyclic heterocyclic ring system. The compounds are .alpha.-1 adrenergic antagonists and are useful in the treatment of BPH; also disclosed are .alpha.-1 antagonist compositions and a method for antagonizing .alpha.-1 receptors and treating BPH.

Abstract: A device is provided for regulating the tension on shoelaces of the type worn in conventional footwear. The shoelace tension regulating device is mounted on the top of the shoe with which it is used, preferably by lacing the shoelace ends through a pair of apertures in the housing of the device. The shoelace ends which emanate from the uppermost eyelets of the shoe adjacent the wearers ankle are not tied, as in conventional practice, but are captured by a hook mechanism that is wound onto a drum within the device by means of a crank in the form of a rotatable cap. The drum is carried in rotation as the cap is turned until the desired level of tension on the shoelace ends has been achieved. A pawl and ratchet wheel in the device prevent counter-rotation until the user desires to release tension on the shoelace ends, at which time the pawl can be disengaged from the ratchet wheel by an actuating mechanism operable externally of the device.

Abstract: A hole puncher and reinforcer for locating a length of adhesive tape in overlying relation to a sheet of paper, for punching a hole in the tape and paper, and for shearing and pressing the tape in position as a reinforcement for the punched holes. The device includes a plurality of spaced apart first disks operative to engage the adhesive side of the tape and pull it off a supply roll. A similar set of disks rotatable at a peripheral speed faster than that of the first disks engages the tape and directs it through a tape feed passage defined in part by thin fingers. The placement and rotation of the two sets of disks, and the presence of the fingers, enables advancement of the tape to the punch, shear and pressure mechanism without sticking or gumming.

Abstract: In a material transfer system, a substantially airtight hopper is rotatably supported at the top of an upright column which is in turn supported by a base. The hopper may be divided into a plurality of compartment sections, and inlet and outlet ports are provided for each hopper compartment. A vacuum pump is connected to the interior of the hopper through the column. A hose is adapted for connection to one of the inlet ports to direct material into the hopper, and sealing apparatus is provided for closing the remainder of the inlet ports. Each discharge port is provided with a chute for receiving and transferring material under the action of gravity. Drain apparatus is provided for receiving liquid from each discharge port. Each discharge port is further provided with structure for sealing the discharge port in response to the presence of vacuum within the hopper.