Patents by Inventor William E. Bernier
William E. Bernier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7442878Abstract: Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.Type: GrantFiled: October 5, 2006Date of Patent: October 28, 2008Assignee: International Business Machines CorporationInventors: William E. Bernier, Marie S. Cole, Mukta G. Farooq, John U. Knickerbocker, Tasha E. Lopez, Roger A. Quon, David J. Welsh
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Publication number: 20080250725Abstract: Pulp production techniques are disclosed. In one embodiment, pulpstone segments are provided, that include proppant grits in the place of some or all of the conventional abrasive typically used in pulpstone applications. The proppant or proppant-abrasive mixture can be combined into a three-dimensional matrix supported by a vitrified bond. Alternative embodiments use proppant grits in an organic bond or a metal bond or a cement bond (each of which may also include abrasive grits in addition to proppant grits). The proportion of proppant grits to abrasive grits can be varied to produce pulp of varying fiber length distribution as required by the end-user (e.g., paper mill). The greater the proppant concentration, the less cutting of the fibers by the conventional abrasive will occur, producing a greater percentage content of longer fibers. Such pulp produces higher quality paper.Type: ApplicationFiled: April 9, 2008Publication date: October 16, 2008Applicants: SAINT-GOBAIN ABRASIVES, INC., SAINT-GOBAIN ABRASIFS TECHNOLOGIE ET SERVICES, S.A.S.Inventors: Glen A. Smith, William E. Bernier
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Patent number: 7332821Abstract: Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a carrier (the lead-free connectors electrically connect the device to the carrier), and fills the gaps between the carrier and the device with an insulating underfill.Type: GrantFiled: August 20, 2004Date of Patent: February 19, 2008Assignee: International Business Machines CorporationInventors: William E. Bernier, Tien-Jen Cheng, Marie S. Cole, David E. Eichstadt, Mukta G. Farooq, John A. Fitzsimmons, Lewis S. Goldmann, John U. Knickerbocker, Tasha E. Lopez, David J. Welsh
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Patent number: 7316572Abstract: A method of forming compliant electrical contacts includes patterning a conductive layer into an array of compliant members. The array of compliant members is then positioned to be in contact with electrical connection pads on an integrated circuit wafer and the compliant members are joined to the pads. Then, the supporting layer that supported the compliant members is removed to leave the compliant members connected to the pads.Type: GrantFiled: February 3, 2005Date of Patent: January 8, 2008Assignee: International Business Machines CorporationInventors: William E. Bernier, David E. Eichstadt, Mukta G. Farooq, John U. Knickerbocker
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Patent number: 7170187Abstract: Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.Type: GrantFiled: August 31, 2004Date of Patent: January 30, 2007Assignee: International Business Machines CorporationInventors: William E. Bernier, Marie S. Cole, Mukta G. Farooq, John U. Knickerbocker, Tasha E. Lopez, Roger A. Quon, David J. Welsh
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Patent number: 7119003Abstract: A method and structure for coupling a semiconductor substrate (e.g., a semiconductor chip) to an organic substrate (e.g., a chip carrier). The coupling interfaces a solder member (e.g., a solder ball) to both a conductive pad on the semiconductor substrate and a conductive pad on the organic substrate. Thermal strains on the solder member during thermal cycling may be reduced by having a surface area of the pad on the semiconductor substrate exceed a surface area of the pad on the organic substrate. Thermal strains on the solder member during thermal cycling may also be reduced by having a distance from a centerline of the solder member to a closest lateral edge of the semiconductor substrate exceed about 0.25 mm.Type: GrantFiled: June 8, 2005Date of Patent: October 10, 2006Assignee: International Business Machines CorporationInventors: William E. Bernier, Charles F. Carey, Eberhard B. Gramatzki, Thomas R. Homa, Eric A. Johnson, Pierre Langevin, Irving Memis, Son K. Tran, Robert F. White
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Patent number: 7067916Abstract: A method and structure for coupling a semiconductor substrate (e.g., a semiconductor chip) to an organic substrate (e.g., a chip carrier). The coupling interfaces a solder member (e.g., a solder ball) to both a conductive pad on the semiconductor substrate and a conductive pad on the organic substrate. Thermal strains on the solder member during thermal cycling may be reduced by having a surface area of the pad on the semiconductor substrate exceed a surface area of the pad on the organic substrate. Thermal strains on the solder member during thermal cycling may also be reduced by having a distance from a centerline of the solder member to a closest lateral edge of the semiconductor substrate exceed about 0.25 mm.Type: GrantFiled: June 20, 2001Date of Patent: June 27, 2006Assignee: International Business Machines CorporationInventors: William E. Bernier, Charles F. Carey, Eberhard B. Gramatzki, Thomas R. Homa, Eric A. Johnson, Pierre Langevin, Irving Memis, Son K. Tran, Robert F. White
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Patent number: 6921015Abstract: A method for protecting tin oxide coated solder surfaces against further oxidation and a method for fluxless solder joining of such surfaces is provided.Type: GrantFiled: April 17, 2003Date of Patent: July 26, 2005Assignee: International Business Machines CorporationInventors: William E. Bernier, Donald W. Henderson, James Spalik, Isabelle Paquin
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Publication number: 20030178473Abstract: A method for protecting tin oxide coated solder surfaces against further oxidation and a method for fluxless solder joining of such surfaces is provided.Type: ApplicationFiled: April 17, 2003Publication date: September 25, 2003Applicant: International Business Machines CorporationInventors: William E. Bernier, Donald W. Henderson, James Spalik, Isabelle Paquin
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Patent number: 6585150Abstract: A method for protecting tin oxide coated solder surfaces against further oxidation and a method for fluxless solder joining of such surfaces is provided.Type: GrantFiled: October 12, 2000Date of Patent: July 1, 2003Assignee: International Business Machines CorporationInventors: William E. Bernier, Donald W. Henderson, James Spalik, Isabelle Paquin
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Patent number: 6559666Abstract: A method and device for testing and burning-in semiconductor circuits. The method and device permit the entire wafer to be tested by temporarily attaching the wafer to a test substrate using electrically conductive adhesive (ECA). The ECA conforms to deviations from co-planarity of the contact points of both the wafer and test substrate while providing a quality electrical connection at each point. ECA material can be deposited on either the wafer contacts or the substrate pads. In addition, the ECA may be deposited on C4 bumps or tin-capped lead bases. Variations in the method and device include filling vias of a non-conductive interposer with ECA. The electrical connection may be enhanced by forming conductive dendrites on test pads while the ECA is deposited on the wafer contacts. To further enhance the electrical connection, the ECA material can be plasma etched to remove some of its polymer matrix and to expose the electrically conductive particles on one side and then plating with palladium.Type: GrantFiled: June 6, 2001Date of Patent: May 6, 2003Assignee: International Business Machines CorporationInventors: William E. Bernier, Michael A. Gaynes, Wayne J. Howell, Mark V. Pierson, Ajit K. Trivedi, Charles G. Woychik
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Patent number: 6550667Abstract: A single phase flux composition suitable for use with high density arrays, that comprises dicarboxylic acid in an amount sufficient to react with the oxidized surface area in a high-density array, a first organic solvent, and a second organic solvent having a higher evaporation temperature than that of said first organic solvent. Preferred dicarboxylic acids are adipic, pimelic, suberic, azelaic and sebacic acids. Preferably, the composition comprises greater than 6% dicarboxylic acid, more preferably greater that 6% to about 15%, and even more preferably from about 8% to about 10% of the dicarboxylic acid. Preferred amounts of the first organic solvent are in the range of from about 25% to about 75% by weight and preferred amounts of the second organic solvent are from about 10% to about 35% by weight. Preferably, the ratio of the first organic solvent to the second organic solvent is about 3:1.Type: GrantFiled: November 29, 2000Date of Patent: April 22, 2003Assignee: International Business Machines CorporationInventors: William E. Bernier, Donald W. Henderson, James Spalik
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Publication number: 20020195707Abstract: A method and structure for coupling a semiconductor substrate (e.g., a semiconductor chip) to an organic substrate (e.g., a chip carrier). The coupling interfaces a solder member (e.g., a solder ball) to both a conductive pad on the semiconductor substrate and a conductive pad on the organic substrate. Thermal strains on the solder member during thermal cycling may be reduced by having a surface area of the pad on the semiconductor substrate exceed a surface area of the pad on the organic substrate. Thermal strains on the solder member during thermal cycling may also be reduced by having a distance from a centerline of the solder member to a closest lateral edge of the semiconductor substrate exceed about 0.25 mm.Type: ApplicationFiled: June 20, 2001Publication date: December 26, 2002Applicant: International Business machines CorporationInventors: William E. Bernier, Charles F. Carey, Eberhard B. Gramatzki, Thomas R. Homa, Eric A. Johnson, Pierre Langevin, Irving Memis, Son K. Tran, Robert F. White
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Patent number: 6492071Abstract: A device and process for applying mixtures of adhesive formulations combined with solder flux such that flip chips may be rapidly encapsulated with such combinations without interfering with subsequent wafer processing steps are provided. Also provided is a wafer stencil designed in such a manner that the saw kerf lines separating individual chip dies are protected from coming into contact with the formulation. Extrusion screening using such wafer stencil is also provided.Type: GrantFiled: September 26, 2000Date of Patent: December 10, 2002Assignee: International Business Machines CorporationInventors: William E. Bernier, Mark V. Pierson, Ajit K. Trivedi
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Patent number: 6425772Abstract: Forming an isotropic electrical connection and a mechanical bond between two articles having metal surfaces. The resulting bond is preferably between metal contact pads on a dielectric substrate and on an electronic device. The connection is provided by utilizing a conductive adhesive wherein the conduction is provided by metal particles which have exposed palladium thereon. The particles may be the metal palladium itself or it may be some other metal, such as silver, having palladium coated thereon. The particles typically are flakes with the palladium having an incipient dendritic form on the surface, i.e.; the palladium has a multi-pointed surface configuration that can grow into fully formed needle-like dendritic structures. The polymer preferably is conventional polyimide/siloxane which is a thermoplastic, i.e. upon heating softens and upon cooling sets, and upon reheating will soften and reflow.Type: GrantFiled: July 23, 2001Date of Patent: July 30, 2002Assignee: International Business Machines CorporationInventors: William E. Bernier, Edward G. Bundga
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Publication number: 20020063146Abstract: The invention is a single phase flux composition suitable for use with high density arrays, that comprises dicarboxylic acid in an amount sufficient to react with the oxidized surface area in a high-density array, a first organic solvent, and a second organic solvent having a higher evaporation temperature than that of said first organic solvent. Preferred dicarboxylic acids are adipic, pimelic, suberic, azelaic and sebacic acids. Preferably, the composition comprises greater than 6% dicarboxylic acid, more preferably greater that 6% to about 15%, and even more preferably from about 8% to about 10% of the dicarboxylic acid. Preferred amounts of the first organic solvent are in the range of from about 25% to about 75% by weight and preferred amounts of the second organic solvent are from about 10% to about 35% by weight. Preferably, the ratio of the first organic solvent to the second organic solvent is about 3:1.Type: ApplicationFiled: November 29, 2000Publication date: May 30, 2002Inventors: William E. Bernier, Donald W. Henderson, James Spalik
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Publication number: 20020022384Abstract: A method of forming an isotropic electrical connection and a mechanical bond between two articles having metal surfaces thereon and the resulting bond, preferably metal contact pads on a dielectric substrate and on an electronic device. The connection is provided by utilizing a conductive adhesive wherein the conduction is provided by metal particles which have exposed palladium thereon. The particles may be the metal palladium itself or it may be some other metal, such as silver, having palladium coated thereon. The particles typically are flakes with the palladium having an incipient dendritic form on the surface, i.e.; the palladium has a multi-pointed surface configuration that can grow into fully formed needle-like dendritic structures. The polymer preferably is conventional polyimide/siloxane which is a thermoplastic, i.e. upon heating softens and upon cooling sets, and upon reheating will soften and reflow.Type: ApplicationFiled: July 23, 2001Publication date: February 21, 2002Applicant: International Business Machines CorporationInventors: William E. Bernier, Edward G. Bundga
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Patent number: 6331119Abstract: A method of forming an isotropic electrical connection and a mechanical bond between two articles having metal surfaces thereon and the resulting bond is provided. Preferably, the metal surfaces are the surfaces of metal contact pads on a dielectric substrate and on an electronic device such as an I/C chip or chip carrier. The mechanical bond and electrical connection is provided by utilizing a conductive adhesive, in which adhesive the conduction is provided by metal particles which have exposed palladium thereon. The particles may be the metal palladium itself or it may be some other metal, such as silver, having palladium coated thereon, preferably by electrodeposition. The particles typically are flakes with the palladium having an incipient dendritic form on the surface, i.e.; the palladium has a multi-pointed surface configuration that can grow into fully formed needle-like dendritic structures. However, the shape of the particle is not significant.Type: GrantFiled: December 28, 1999Date of Patent: December 18, 2001Assignee: International Business Machines CorporationInventors: William E. Bernier, Edward G. Bundga
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Publication number: 20010035759Abstract: A method and device for testing and burning-in semiconductor circuits. The method and device permit the entire wafer to be tested by temporarily attaching the wafer to a test substrate using electrically conductive adhesive (ECA). The ECA conforms to deviations from co-planarity of the contact points of both the wafer and test substrate while providing a quality electrical connection at each point. ECA material can be deposited on either the wafer contacts or the substrate pads. In addition, the ECA may be deposited on C4 bumps or tin-capped lead bases. Variations in the method and device include filling vias of a non-conductive interposer with ECA. The electrical connection may be enhanced by forming conductive dendrites on test pads while the ECA is deposited on the wafer contacts. To further enhance the electrical connection, the ECA material can be plasma etched to remove some of its polymer matrix and to expose the electrically conductive particles on one side and then plating with palladium.Type: ApplicationFiled: June 6, 2001Publication date: November 1, 2001Inventors: William E. Bernier, Michael A. Gaynes, Wayne J. Howell, Mark V. Pierson, Ajit K. Trivedi, Charles G. Woychik
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Publication number: 20010024127Abstract: A method and device for testing and burning-in semiconductor circuits. The method and device permit the entire wafer to be tested by temporarily attaching the wafer to a test substrate using electrically conductive adhesive (ECA). The ECA conforms to deviations from co-planarity of the contact points of both the wafer and test substrate while providing a quality electrical connection at each point. ECA material can be deposited on either the wafer contacts or the substrate pads. In addition, the ECA may be deposited on C4 bumps or tin-capped lead bases. Variations in the method and device include filling vias of a non-conductive interposer with ECA. The electrical connection may be enhanced by forming conductive dendrites on test pads while the ECA is deposited on the wafer contacts. To further enhance the electrical connection, the ECA material can be plasma etched to remove some of its polymer matrix and to expose the electrically conductive particles on one side and then plating with palladium.Type: ApplicationFiled: March 30, 1998Publication date: September 27, 2001Inventors: WILLIAM E. BERNIER, MICHAEL A. GAYNES, WAYNE J. HOWELL, MARK V. PIERSON, AJIT K. TRIVEDI, CHARLES G. WOYCHIK