Abstract: A method and device for testing and burning-in semiconductor circuits. The method and device permit the entire wafer to be tested by temporarily attaching the wafer to a test substrate using electrically conductive adhesive (ECA). The ECA conforms to deviations from co-planarity of the contact points of both the wafer and test substrate while providing a quality electrical connection at each point. ECA material can be deposited on either the wafer contacts or the substrate pads. In addition, the ECA may be deposited on C4 bumps or tin-capped lead bases. Variations in the method and device include filling vias of a non-conductive interposer with ECA. The electrical connection may be enhanced by forming conductive dendrites on test pads while the ECA is deposited on the wafer contacts. To further enhance the electrical connection, the ECA material can be plasma etched to remove some of its polymer matrix and to expose the electrically conductive particles on one side and then plating with palladium.

Abstract: A method and device for testing and burning-in semiconductor circuits. The method and device permit the entire wafer to be tested by temporarily attaching the wafer to a test substrate using electrically conductive adhesive (ECA). The ECA conforms to deviations from co-planarity of the contact points of both the wafer and test substrate while providing a quality electrical connection at each point. ECA material can be deposited on either the wafer contacts or the substrate pads. In addition, the ECA may be deposited on C4 bumps or tin-capped lead bases. Variations in the method and device include filling vias of a non-conductive interposer with ECA. The electrical connection may be enhanced by forming conductive dendrites on test pads while the ECA is deposited on the wafer contacts. To further enhance the electrical connection, the ECA material can be plasma etched to remove some of its polymer matrix and to expose the electrically conductive particles on one side and then plating with palladium.

Abstract: A method of controlling the pH of a print reaction zone in an electrolytic matrix printer is described. Appropriate amounts of a buffering agent are included in the treated surface layer of the recording medium used in the printer to hold the pH of the print reaction zone in the range of 5.0 to 7.0 and, preferably, between 6.0 and 6.5. The pH of the electrolytic reaction zone can also be held in the desired range by adding appropriate amounts of a buffering agent to a supply of recording medium moistening fluid, either before and/or during actual printing, the latter step enabling dynamic buffering control if needed. The described method halts or reduces the degradation of print electrodes by effecting a balance between excess quantities of acid or base material generated in the print reaction zone during printing.

Abstract: An electrochromic printable medium which includes a substrate coated with certain organic compounds and with the reduced form of an oxidizing agent; and use thereof for electrochromic printing.

Abstract: An electrochromic printable media which includes a substrate coated with certain leuco dyes and with a bromide compound; and use thereof for electrochromic printing.