Abstract: Polymer derived ceramic (PDC) materials, compositions and methods of making high capacity, long cycle, long life battery anodes to improve the performance of batteries of all types, including but not limited to coin cell batteries, electric vehicle (EV) batteries, hybrid electric vehicle (HEV) batteries, plug-in hybrid electric vehicle (PHEV) batteries, battery electric vehicle (BEV) batteries, lithium cobalt (LCO) batteries, lithium iron (LFP) batteries; and lithium-ion (Li) batteries, and lead acid batteries. Silicon is incorporated in the PDC material at a molecular level when reacting a polymer derived ceramic precursor and a silicon hydride constituent or a silicon alkoxide constituent to form a PDC composition useful as a powdered battery anode material. A predetermined amount of divinylbenzene is added as a crosslinker and a modifier to increase free carbon content.

Abstract: Polymer derived ceramic (PDC) materials, compositions and methods of making high capacity, long cycle, long life battery anodes to improve the performance of batteries of all types, including but not limited to coin cell batteries, electric vehicle (EV) batteries, hybrid electric vehicle (HEV) batteries, plug-in hybrid electric vehicle (PHEV) batteries, battery electric vehicle (BEV) batteries, lithium cobalt (LCO) batteries, lithium iron (LFP) batteries; and lithium-ion (Li) batteries, and lead acid batteries. Silicon is incorporated in the PDC material at a molecular level when reacting a polymer derived ceramic precursor and a silicon hydride constituent or a silicon alkoxide constituent to form a PDC composition useful as a battery anode material. The resulting battery anode materials increase the specific capacity of a battery measured in milliampere-hours per gram (mAh/g) and increase the life cycle of a battery while minimizing distortion and stress of the anode structure.

Abstract: The invention provides a unitary retaining ring for use in a CMP apparatus. The retaining ring features a pad engaging surface which is designed to be flat and planar when the retaining ring is mounted to a carrier of the CMP apparatus. The pad engaging surface includes portions which surround the wafer and contact a pad and slurry on the CMP apparatus. A plurality of mounting features are provided along a carrier engaging surface of the ring. The mounting features are installed to cause localized compressive stresses in the material when in a demounted state. Upon mounting to a carrier of the CMP apparatus under specified torque or force conditions, tensile stresses are applied to the material of the ring resulting in a flat and planar mounted front surface.

Abstract: The present invention, in one embodiment, provides a method for eliminating agglomerate particles in a polishing slurry. In this particular embodiment, the method is directed to reducing agglomeration of slurry particles within a waste slurry passing through a slurry system drain. The method comprises conveying the waste slurry to the drain, wherein the waste slurry may form an agglomerate having an agglomerate particle size. The method further comprises subjecting the waste slurry to energy emanating from an energy source. The energy source thereby transfers energy to the waste slurry to substantially reduce the agglomerate particle size. Substantially reduce means that the agglomerate is size is reduced such that the waste slurry is free to flow through the drain.

Abstract: The present invention provides a polishing endpoint detection system, for use with a polishing apparatus, a method of determining a polishing endpoint of a surface located on a semiconductor wafer, and a method of manufacturing an integrated circuit on a semiconductor wafer. In one embodiment, the polishing endpoint detection system includes a carrier head having a polishing platen associated therewith. Also, the detection system includes a signal emitter located adjacent one of the carrier head or polishing platen. The signal emitter is configured to generate an emitted signal capable of traveling through an object to be polished. In addition, the detection system includes a signal receiver located adjacent another of the carrier head or polishing platen. The signal receiver is configured to receive the emitted signal from which a change in a signal intensity of the emitted signal can be determined.

Abstract: The present invention provides a method for manufacturing an integrated circuit using a polishing head in a polishing apparatus. In one advantageous embodiment, the polishing head comprises a wafer carrier having an outer periphery and a wafer holder. The wafer holder is coupled to the wafer carrier and depends from the outer periphery thereof. The wafer holder is configured (i.e., designed) to grip an edge of the semiconductor wafer.

Abstract: The invention provides a unitary retaining ring for use in a CMP apparatus. The retaining ring features a pad engaging surface which is designed to be flat and planar when the retaining ring is mounted to a carrier of the CMP apparatus. The pad engaging surface includes portions which surround the wafer and contact a pad and slurry on the CMP apparatus. A plurality of mounting features are provided along a carrier engaging surface of the ring. The mounting features are installed to cause localized compressive stresses in the material when in a demounted state. Upon mounting to a carrier of the CMP apparatus under specified torque or force conditions, tensile stresses are applied to the material of the ring resulting in a flat and planar mounted front surface.

Abstract: The present invention provides a wafer cleaning apparatus. In an advantageous embodiment, the wafer cleaning apparatus includes cleaning brushes mounted within a brush box and a sensor associated with at least one of the cleaning brushes and configured to detect a degree of wetness of the at least one of the cleaning brushes. In most cases, the cleaning brushes are comprised of an absorbent material, such as polyvinyl alcohol, that becomes more compressible as the cleaning brushes become more wetted with a solution. Thus, a degree of compressibility can be related to a degree of wetness of a cleaning brush, which provides data that allows an operator to determine when the cleaning brushes are wet enough to send a wafer through the cleaning apparatus without incurring unnecessary damage.

Abstract: The present invention provides a method of manufacturing an integrated circuit including planarizing a semiconductor wafer surface. In one embodiment, the method comprises forming a dielectric layer over a first level having an irregular topography, depositing a sacrificial material over the dielectric layer, and then planarizing the semiconductor wafer surface to a planar surface. More specifically, the dielectric layer forms such that it substantially conforms to the irregular topography of the first level. The sacrificial material is formed to a substantially planar surface over the dielectric layer. Thus, the sacrificial material provides a substantially uniform chemical/mechanical planarization (CMP) process removal rate across the semiconductor wafer surface. In the ensuing step, planarizing the semiconductor wafer surface to a planar surface removes the sacrificial material and a portion of the dielectric layer with a CMP process.

Abstract: The present invention provides a method of manufacturing an integrated circuit using a cleaning brush and a cleaning brush conditioning apparatus. In one embodiment, the cleaning brush conditioning apparatus comprises a conditioning bar and a load cell coupled to the conditioning bar. The load cell is configured to force the conditioning bar against the cleaning brush.

Abstract: The present invention provides a polishing slurry reclamation system. In one embodiment, the polishing slurry reclamation system comprises a polishing apparatus having a polishing platen and a fluid delivery system positioned to deliver a slurry or a rinse to the polishing platen, a recovery drain adjacent the polishing platen, and a fluid diverter associated with the platen and configured to deflect a selected one of a slurry or rinse emanating from the polishing platen to the recovery drain.

Abstract: The present invention provides a polishing endpoint detection system, for use with a polishing apparatus, a method of determining a polishing endpoint of a surface located on a semiconductor wafer, and a method of manufacturing an integrated circuit on a semiconductor wafer. In one embodiment, the polishing endpoint detection system includes a carrier head having a polishing platen associated therewith. Also, the detection system includes a signal emitter located adjacent one of the carrier head or polishing platen. The signal emitter is configured to generate an emitted signal capable of traveling through an object to be polished. In addition, the detection system includes a signal receiver located adjacent another of the carrier head or polishing platen. The signal receiver is configured to receive the emitted signal from which a change in a signal intensity of the emitted signal can be determined.

Abstract: A method of cleaning a semiconductor wafer using a cleaning brush assembly having an arbor with: (1) an expandable member configured to have a non-expanded position and an expanded position, and (2) a cleaning brush, located about the expandable member, having an inner diameter greater than an outer diameter of the expandable member in the non-expanded position and less than an outer diameter of the expandable member in the expanded position.

Abstract: The present invention relates to an apparatus and method for polishing substrate surfaces. The method can include the steps of holding a substrate against a polishing surface and depositing slurry on the polishing surface. The method can further include the step of moving the holding device in a substantially curvilinear path relative to the polishing surface, or the step of moving the polishing surface in a substantially curvilinear path relative to the holding device. The apparatus comprises a polishing surface, a holding device for holding a substrate against the polishing surface, and a slurry supply system for depositing slurry on the polishing surface. The apparatus further includes a moving structure for moving the holding device in a substantially curvilinear path along the polishing surface, or a moving structure for moving the polishing surface in a substantially curvilinear path relative to the holding device. The substantially curvilinear path is preferably substantially a figure eight path.

Abstract: The present invention provides a polishing pad alignment device having an alignment member positionable against a side wall of a platen. The height of the alignment member is sufficient to extend above a top surface of the platen when positioned against the wall of the platen. In one embodiment, the alignment member is an arcuate member having an arc substantially equal to an arc of the platen. In another embodiment, the alignment member is removably attachable to the wall of the platen and the polishing pad alignment member further includes an attachment device configured to attach the alignment member to the platen.

Abstract: A slurry container includes an outer surface and a cavity within the outer surface. Slurry is deposited in the cavity of the container and subsequently used for a variety of different purposes. Air pockets occurring within the cavity of the container are reduced in order to regulate particle size of the slurry.

Abstract: The present invention provides a method of manufacturing a polishing pad using a beam, and a system incorporating the method. In one embodiment, the method includes providing a cake that is susceptible to beam ablation, and skiving a polishing pad from the cake using a beam apparatus configured to produce a beam.

Abstract: The present invention provides a method of manufacturing a polishing pad using a beam, and a system incorporating the method. In one embodiment, the method includes providing a cake that is susceptible to beam ablation, and skiving a polishing pad from the cake using a beam apparatus configured to produce a beam.

Abstract: The present invention provides a wafer cleaning apparatus. In an advantageous embodiment, the wafer cleaning apparatus includes cleaning brushes mounted within a brush box and a sensor associated with at least one of the cleaning brushes and configured to detect a degree of wetness of the at least one of the cleaning brushes. In most cases, the cleaning brushes are comprised of an absorbent material, such as polyvinyl alcohol, that becomes more compressible as the cleaning brushes become more wetted with a solution. Thus, a degree of compressibility can be related to a degree of wetness of a cleaning brush, which provides data that allows an operator to determine when the cleaning brushes are wet enough to send a wafer through the cleaning apparatus without incurring unnecessary damage.

Abstract: /The present invention provides in one embodiment a method of manufacturing an integrated circuit including cleaning a semiconductor wafer using a cleaning apparatus, wherein the cleaning apparatus includes a roller brush frame and roller brushes cooperatively supported within the roller brush frame and aligned to form a cleaning gradient that is configured to remove particles of different sizes from an object to be cleaned.