Abstract: An apparatus and method are disclosed for an improved semiconductor interconnect scheme using a simplified process. In an embodiment of the apparatus, a polysilicon shape is formed on a silicon area. The polysilicon shape is created having a bridging vertex. When a spacer is created on the polysilicon shape, the spacer width is formed to be small enough near the bridging vertex to allow a silicide bridge to form that creates an electrical coupling between the silicon area and the bridging vertex. Semiconductor devices and circuits are created using the improved semiconductor interconnect scheme using the simplified process.

Abstract: An apparatus and method are disclosed for an improved semiconductor interconnect scheme using a simplified process. In an embodiment of the apparatus, a polysilicon shape is formed on a silicon area. The polysilicon shape is created having a bridging vertex. When a spacer is created on the polysilicon shape, the spacer width is formed to be small enough near the bridging vertex to allow a silicide bridge to form that creates an electrical coupling between the silicon area and the bridging vertex. Semiconductor devices and circuits are created using the improved semiconductor interconnect scheme using the simplified process.

Abstract: A finFET, a method of fabricating the finFET and a design structure of the finFET. The method includes: forming a silicon fin on a top surface of a silicon substrate; forming a gate dielectric on opposite sidewalls of the fin; forming a gate electrode over a channel region of the fin, the gate electrode in direct physical contact with the gate dielectric layer on the opposite sidewalls of the fin; forming a first source/drain in the fin on a first side of the channel region and forming a second source/drain in the fin on a second side of the channel region; removing a portion of the substrate from under at least a portion of the first and second source/drains to create a void; and filling the void with a dielectric material. The finFET includes a body contact between the silicon body of the finFET and the substrate.

Abstract: An E-fuse and a method for fabricating an E-fuse integrating polysilicon resistor masks, and a design structure on which the subject E-fuse circuit resides are provided. The E-fuse includes a polysilicon layer defining a fuse shape including a cathode, an anode, and a fuse neck connected between the cathode and the anode silicide formation. A silicide formation is formed on the polysilicon layer with an unsilicided portion extending over a portion of the cathode adjacent the fuse neck. The unsilicided portion substantially prevents current flow in the silicide formation region of the cathode, with electromigration occurring in the fuse neck during fuse programming. The unsilicided portion has a substantially lower series resistance than the series resistance of the fuse neck.

Abstract: A memory controller optimizes execution of a read/modify/write command by breaking the RMW command into separate and unique read and write commands that do not need to be executed together, but just need to be executed in the proper sequence. The most preferred embodiments use a separate RMW queue in the controller in conjunction with the read queue and write queue. In other embodiments, the controller places the read and write portions of the RMW into the read and write queue, but where the write queue has a dependency indicator associated with the RMW write command in the write queue to insure the controller maintains the proper execution sequence. The embodiments allow the memory controller to translate RMW commands into read and write commands with the proper sequence of execution to preserve data coherency.

Abstract: An E-fuse and a method for fabricating an E-fuse are provided integrating polysilicon resistor masks. The E-fuse includes a polysilicon layer defining a fuse shape including a cathode, an anode, and a fuse neck connected between the cathode and the anode silicide formation. A silicide formation is formed on the polysilicon layer with an unsilicided portion extending over a portion of the cathode adjacent the fuse neck. The unsilicided portion substantially prevents current flow in the silicide formation region of the cathode, with electromigration occurring in the fuse neck during fuse programming. The unsilicided portion has a substantially lower series resistance than the series resistance of the fuse neck.

Abstract: Electrically programmable fuse structures for an integrated circuit and methods of fabrication thereof are presented, wherein the electrically programmable fuse has a first terminal portion and a second terminal portion interconnected by a fuse element. The first terminal portion and the second terminal portion reside at different heights relative to a supporting surface of the fuse structure, and the interconnecting fuse element transitions between the different heights of the first terminal portion and the second terminal portion. The first and second terminal portions are oriented parallel to the supporting surface, while the fuse element includes a portion oriented orthogonal to the supporting surface, and includes at least one right angle bend where transitioning from at least one of the first and second terminal portions to the orthogonal oriented portion of the fuse element.

Abstract: A FinFET body contact structure and a method for creating the FinFET body contact structure are disclosed. The body contact structure comprises a wide fin portion of a semiconductor fin, the wide fin portion having a polysilicon polygon shape formed on a top surface of the wide fin portion. The polysilicon polygon shape has a center area having no polysilicon. FinFETs are formed on two vertical surfaces of the wide fin portion and gates of the FinFETs are coupled to the polysilicon polygon shape. Top surfaces of the wide fin portion and the polysilicon polygon shape are silicided. Silicide bridging is prevented by sidewall spacers. All convex angles on the polysilicon polygon shape are obtuse enough to prevent creation of bridging vertices. The center area is doped of an opposite type from a source and a drain of an associated FinFET.

Abstract: A method, and apparatus are provided for implementing a directory organization to selectively optimize performance or reliability in a computer system. A directory includes a user selected operational modes including a performance mode and a reliability mode. In the reliability mode, more directory bits are used for error correction and detection. In the performance mode, reclaimed directory bits not used for error correction and detection are used for more associativity.

Abstract: An eFuse reference cell on a chip provides a reference voltage that is greater than a maximum voltage produced by an eFuse cell having an unblown eFuse on the chip but less than a minimum voltage produced by an eFuse cell having a blown eFuse on the chip. A reference current flows through a resistor and an unblown eFuse in the eFuse reference cell, producing the reference voltage. The reference voltage is used to create a mirrored copy of the reference current in the eFuse cell. The mirrored copy of the reference current flows through an eFuse in the eFuse cell. A comparator receives the reference voltage and the voltage produced by the eFuse cell. The comparator produces an output logic level responsive to the voltage produced by the eFuse cell compared to the reference voltage.

Abstract: An apparatus and method is disclosed for determining polysilicon conductor width for 3-dimensional field effect transistors (FinFETs). Two or more resistors are constructed using a topology in which polysilicon conductors are formed over a plurality of silicon “fins”. A first resistor has a first line width. A second resistor has a second line width. The second line width is slightly different than the first line width. Advantageously, the first line width is equal to the nominal design width used to make FET gates in the particular semiconductor technology. Resistance measurements of the resistors and subsequent calculations using the resistance measurements are used to determine the actual polysilicon conductor width produced by the semiconductor process. A composite test structure not only allows calculation of the polysilicon conductor width, but provides proof that differences in the widths used in the calculations do not introduce objectionable etching characteristics of the polysilicon conductors.

Abstract: An apparatus and method are disclosed for measuring alignment of polysilicon shapes relative to a silicon area wherein the presence of an electrical coupling is used to determine the presence of bias or misalignment. Bridging vertices on the polysilicon shapes are formed. Bridging vertices over the silicon area create low resistance connections between those bridging vertices and the silicon area; other bridging vertices over ROX (recessed oxide) areas do not create low resistance connections between those other bridging vertices and the silicon area. Determining which bridging vertices have low resistance connections to the silicon area and how many bridging vertices have low resistance connections to the silicon area are used to determine the bias and misalignment of the polysilicon shapes relative to the silicon area.

Abstract: A memory controller provides page copy logic that assures data coherency when a DMA operation to a page occurs during the copying of the page by the memory controller. The page copy logic compares the page index of the DMA operation to a copy address pointer that indicates the location currently being copied. If the page index of the DMA operation is less than the copy address pointer, the portion of the page that would be written to by the DMA operation has already been copied, so the DMA operation is performed to the physical address of the new page. If the page index of the DMA operation is greater than the copy address pointer, the portion of the page that would be written to by the DMA operation has not yet been copied, so the DMA operation is performed to the physical address of the old page.

Abstract: An apparatus includes a virtual memory manager that moves data from a first block to second block in memory. When the virtual memory manager is ready to transfer data from the first block to the second block, a third, temporary block of memory is defined. The translation table in a DMA controller is changed to point DMA transfers that target the first block to instead target the temporary block. The virtual memory manager then transfers data from the first block to the second block. When the transfer is complete, a check is made to see if the DMA transferred data to the temporary block while the data from the first block was being written to the second block. If so, the data written to the temporary block is written to the second block. A hardware register is preferably used to efficiently detect changes to the temporary block.

Abstract: An apparatus and method are disclosed for measuring alignment of polysilicon shapes relative to a silicon area wherein the presence of an electrical coupling is used to determine the presence of bias or misalignment. Bridging vertices on the polysilicon shapes are formed. Bridging vertices over the silicon area create low resistance connections between those bridging vertices and the silicon area; other bridging vertices over ROX (recessed oxide) areas do not create low resistance connections between those other bridging vertices and the silicon area. Determining which bridging vertices have low resistance connections to the silicon area and how many bridging vertices have low resistance connections to the silicon area are used to determine the bias and misalignment of the polysilicon shapes relative to the silicon area.

Abstract: An apparatus and method are disclosed for measuring alignment of polysilicon shapes relative to a silicon area wherein the presence of an electrical coupling is used to determine the presence of bias or misalignment. Bridging vertices on the polysilicon shapes are formed. Bridging vertices over the silicon area create low resistance connections between those bridging vertices and the silicon area; other bridging vertices over ROX (recessed oxide) areas do not create low resistance connections between those other bridging vertices and the silicon area. Determining which bridging vertices have low resistance connections to the silicon area and how many bridging vertices have low resistance connections to the silicon area are used to determine the bias and misalignment of the polysilicon shapes relative to the silicon area.

Abstract: In a first aspect, a first method is provided for semiconductor device manufacturing. The first method includes the steps of (1) forming a first side of a fin of a fin field effect transistor (FinFET); (2) processing the first side of the fin; and (3) forming a second side of the fin while supporting the first side of the fin. Numerous other aspects are provided.

Abstract: A method and structure are provided for implementing enhanced cooling of a plurality of memory devices. The memory structure includes a stack of platters. A sub-plurality of memory devices is mounted on each platter. At least one connector is provided with each platter for connecting to the sub-plurality of memory devices. A heat sink is associated with the stack of platters for cooling the plurality of memory devices.

Abstract: In a first aspect, a first method is provided for semiconductor device manufacturing. The first method includes the steps of (1) forming a first side of a fin of a fin field effect transistor (FinFET); (2) processing the first side of the fin; and (3) forming a second side of the fin while supporting the first side of the fin. Numerous other aspects are provided.

Abstract: A method and apparatus are provided for protecting electronic fuse (eFuse) information. A current balancing circuit is provided that maintains a constant current demand on the eFuse voltage supply that is sufficient to blow an eFuse. Normally the constant current is applied to a semiconductor core. When an eFuse is being blown, the constant current is diverted away from the core to the eFuse and as the eFuse blows, the constant current is again dumped to the semiconductor core. Thus, a change in current due to the transient of the eFuse being blown is not detectable and the information that an eFuse has been blown is kept secure.