Abstract: The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source. The interposer will also possess a multi-layer, universal multi-functional, common conductive shield structure with conductive pathways for energy and EMI conditioning and protection that also comprise a commonly shared and centrally positioned conductive pathway or electrode of the structure that can simultaneously shield and allow smooth energy interaction between grouped and energized conductive pathway electrodes containing a circuit architecture for energy conditioning as it relates to integrated circuit device packaging.

Abstract: The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source. The interposer will also possess a multi-layer, universal multi-functional, common conductive shield structure with conductive pathways for energy and EMI conditioning and protection that also comprise a commonly shared and centrally positioned conductive pathway or electrode of the structure that can simultaneously shield and allow smooth energy interaction between grouped and energized conductive pathway electrodes containing a circuit architecture for energy conditioning as it relates to integrated circuit device packaging.

Abstract: The present invention relates to a multi-functional energy conditioner having architecture employed in conjunction with various dielectric and combinations of dielectric materials to provide one or more differential and common mode filters for the suppression of electromagnetic emissions and surge protection. The architecture allows single or multiple components to be assembled within a single package such as an integrated circuit or connector. The component's architecture is dielectric independent and provides for integration of various electrical characteristics within a single component to perform the functions of filtering, decoupling, fusing and surge suppression.

Abstract: Disclosed are novel internal structures of energy conditioners having A, B, and G master electrodes, novel circuits including energy conditioners having A, B, and G master electrodes conductive structures, novel assemblies of internal structures and internal structures of energy conditioners having A, B, and G electrodes, and novel arrangements of energy conditioners having A, B, and G master electrodes on connection structures. Certain internal structures have conductive layers of A and B master electrodes in the same plane and conductive layers of the G master electrode extended beyond the periphery of the A and B layers except where the A and B layers have tabs extended to conductive integration structure integrating the A and B layers into respective A and B master electrodes.

Abstract: Circuit arrangement embodiments that use relative groupings of energy pathways that include shielding circuit arrangements that can sustain and condition electrically complementary energy confluences.

Abstract: The system of an energy conditioner comprising: a conductive shield structure comprising a first conductive shield layer, a second conductive shield layer, and a third conductive shield layer; wherein said first conductive shield layer is above said second conductive shield layer, and said second conductive shield layer is above said third conductive shield layer; wherein said first conductive shield layer, said second conductive shield layer, and said third conductive shield layer are conductively connected to one another; a first pair of conductive non-shield layers comprising a first pair first layer and a first pair second layer; and a second pair of conductive non-shield layers comprising a second pair first layer and a second pair second layer

Abstract: Compact and integral arrangements for an energy-conditioning arrangement having various predetermined energy pathways utilized in part for the purpose of conditioning energies of either one or multiple of circuitry that would otherwise detrimentally effect a predetermined application having a single or multiple, circuitry systems. Some energy-conditioning arrangement variants can be operable to provide multiple energy-conditioning operations.

Abstract: Disclosed are novel internal structures of energy conditioners (3a-3k) having A, B, and G master electrodes, novel assemblies of internal structures and internal structures of energy conditioners having A, B, and G electrodes, and novel arrangements of energy conditioners having A, B, and G master electrodes on connection structures.

Abstract: The present invention relates to a multi-functional energy conditioner having architecture employed in conjunction with various dielectric and combinations of dielectric materials to provide one or more differential and common mode filters for the suppression of electromagnetic emissions and surge protection. The architecture allows single or multiple components to be assembled within a single package such as an integrated circuit or connector. The component's architecture is dielectric independent and provides for integration of various electrical characteristics within a single component to perform the functions of filtering, decoupling, fusing and surge suppression.

Abstract: The application discloses novel internal structures of energy conditioners, assemblies of external structures of energy conditioners and mounting structure, and novel circuits including energy conditioners having A, B, and G master electrodes.

Abstract: Circuit arrangement embodiments that use relative groupings of energy pathways that include shielding circuit arrangements that can sustain and condition electrically complementary energy confluences.

Abstract: A predetermined single electrode shielding set (800e) for groupings of complementary electrodes that are operable to shield and that together are selectively formed or amalgamated into a predetermined sequential combination of commonly configured energy pathways operable for shielding various paired complementary electrodes (855) and other predetermined elements that result in an electrode architecture practicable to provide multiple energy conditioning functions.

Abstract: The system of an energy conditioner comprising: a conductive shield structure comprising a first conductive shield layer, a second conductive shield layer, and a third conductive shield layer; wherein said first conductive shield layer is above said second conductive shield layer, and said second conductive shield layer is above said third conductive shield layer; wherein said first conductive shield layer, said second conductive shield layer, and said third conductive shield layer are conductively connected to one another; a first pair of conductive non-shield layers comprising a first pair first layer and a first pair second layer; and a second pair of conductive non-shield layers comprising a second pair first layer and a second pair second layer.

Abstract: The invention provides a structure and method of its use comprising a filtering and interference suppression device (62), particularly of the broad band type, for an electric motor (34) comprising at least a first powering brush (16) for an armature commutator of the electric motor (34), of the type comprising a capacitor (64), one terminal of which is electrically connected to a strip conductor (38) that electrically powers the first brush (16) powering the armature commutator of the electric motor (34), and the other terminal of which is electrically connected to a ground strip conductor (58), connected, in turn, to the electrical ground (60) of the electric motor (34), characterized in that the capacitor (72) of the filtering and interference suppression device (62) is of the non-inductive type, and in that each of the non-inductive capacitors (72) is directly attached to a circuit board (73) comprising strip conductors, of which are at least one powering strip conductor (38, 40) for a brush and one ground

Abstract: The present invention relates to a multi-functional energy conditioner having architecture employed in conjunction with various dielectric and combinations of dielectric materials to provide one or more differential and common mode filters for the suppression of electromagnetic emissions and surge protection. The architecture allows single or multiple components to be assembled within a single package such as an integrated circuit or connector. The component's architecture is dielectric independent and provides for integration of various electrical characteristics within a single component to perform the functions of filtering, decoupling, fusing and surge suppression.

Abstract: The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source. The interposer will also possess a multi-layer, universal multi-functional, common conductive shield structure with conductive pathways for energy and EMI conditioning and protection that also comprise a commonly shared and centrally positioned conductive pathway or electrode of the structure that can simultaneously shield and allow smooth energy interaction between grouped and energized conductive pathway electrodes containing a circuit architecture for energy conditioning as it relates to integrated circuit device packaging.

Abstract: The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source. The interposer will also possess a multi-layer, universal multi-functional, common conductive shield structure with conductive pathways for energy and EMI conditioning and protection that also comprise a commonly shared and centrally positioned conductive pathway or electrode of the structure that can simultaneously shield and allow smooth energy interaction between grouped and energized conductive pathway electrodes containing a circuit architecture for energy conditioning as it relates to integrated circuit device packaging.

Abstract: The application discloses energy conditioners that include A, B, and G master electrodes in which the A and B electrodes include main body electrodes with conductive paths that cross inside the energy conditioner and which has A and B tabs at one end of the main body electrodes conductively tied together and A and B tabs at another end of the main body electrodes conductively tied together, and the application also discloses novel assemblies of mounting, contacting, integrating those energy conditioners with conductive connection structures.

Abstract: Compact and integral arrangements for an energy-conditioning arrangement having various predetermined energy pathways utilized in part for the purpose of conditioning energies of either one or multiple of circuitry that would otherwise detrimentally effect a predetermined application having a single or multiple, circuitry systems. Some energy-conditioning arrangement variants can be operable to provide multiple energy-conditioning operations.

Abstract: Circuit arrangement embodiments that use relative groupings of energy pathways that include shielding circuit arrangements that can sustain and condition electrically complementary energy confluences.