Abstract: Compact and integral arrangements for an energy-conditioning arrangement (800q) having various predetermined pathways (813a, 813b) utilized in part for the purpose of conditioning energies of either one or multiple of circuitry that would otherwise detrimentally effect a predetermined application having a single or multiple, circuitry systems. Some energy-conditioning variants can be operable to provide multiple-conditioning operations.

Abstract: The present invention is a component carrier (132) consisting of a plate of insulating material having a plurality of apertures (140) for accepting the leads of a thru-hole differential and common mode filter (130). Another embodiment consists of a surface mount component carrier (10) comprising a disk (16) of insulating material having a plurality of apertures (24). The same concept for the above described carrier is also incorporated into several alternate embodiments, either independently, embedded within electronic connectors. The overall configuration and electrical characteristics of the concepts underlying the present inventions are also described as an energy conditioning circuit assembly which encompasses the combination of differential and common mode filters and component carriers optimized for such filters.

Abstract: The present invention relates to a universal multi-functional common conductive shield structure plus two electrically opposing differential energy pathways which in part uses a electrode shielding architecture with stacked conductive hierarchy progression comprising circuitry for energies propagating simultaneous along paired and electrically differential pathways that utilize bypass or feed-thru energy propagation modes. The invention, when energized, will allow both the outer partially shielded paired differential conductive energy pathway electrodes, as well as the contained and oppositely paired differential conductive energy pathway electrodes to function with respect to one another, in complementary, yet in an electrically opposite manner, respectively.

Abstract: The present invention relates to a multi-functional energy conditioner having architecture employed in conjunction with various dielectric and combinations of dielectric materials to provide one or more differential and common mode filters for the suppression of electromagnetic emissions and surge protection. The architecture allows single or multiple components to be assembled within a single package such as an integrated circuit or connector. The component's architecture is dielectric independent and provides for integration of various electrical characteristics within a single component to perform the functions of filtering, decoupling, fusing and surge suppression.

Abstract: A predetermined electrode arrangement (1/1, 1/2, 1/3A, 1/6) comprising a plurality of shielded electrodes (213, 215) and a plurality of shielding electrodes (204, 214, 269A, 269B,) that together with other conductive (799, 206, 208, 207, 203, 218, 216, 217, 218) semi-conductive (not shown) and/or non-conductive material elements (212) are formed into a multi-functional energy condition assembly (1-1, 1-2, 1-3A, 1-6) or variant to be selectively coupled into circuitry (4-1, 5-1, 1-2).

Abstract: The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source. The interposer will also possess a multi-layer, universal multi-functional, common conductive shield structure with conductive pathways for energy and EMI conditioning and protection that also comprise a commonly shared and centrally positioned conductive pathway or electrode of the structure that can simultaneously shield and allow smooth energy interaction between grouped and energized conductive pathway electrodes containing a circuit architecture for energy conditioning as it relates to integrated circuit device packaging.

Abstract: A predetermined amalgamation of electrodes formed or manufactured at least in part, by predetermined, sequential manufacturing operations into a balanced and shielding electrode structure. The balanced total electrode structure also uses a grouping of identically configured, and balanced positioned, shielding electrodes that are amalgamated in sequential combination with predetermined, complimentary balanced shielded electrodes groupings and other predetermined elements that are together, practicable to provide predetermined multiple energy conditioning functions operable upon portions of propagating energy as well simultaneously being operable to provide a common, voltage reference function operable for at least dynamic circuit operations.

Abstract: The present invention is a component carrier (132) consisting of a plate of insulating material having a plurality of apertures (140) for accepting the leads of a thru-hole differential and common mode filter (130). Another embodiment consists of a surface mount component carrier (10) comprising a disk (16) of insulating material having a plurality of apertures (24). The same concept for the above described carrier is also incorporated into several alternate embodiments, either independently, embedded within electronic connectors. The overall configuration and electrical characteristics of the concepts underlying the present inventions are also described as an energy conditioning circuit assembly which encompasses the combination of differential and common mode filters and component carriers optimized for such filters.

Abstract: The present invention relates to a multi-functional energy conditioner having architecture employed in conjunction with various dielectric and combinations of dielectric materials to provide one or more differential and common mode filters for the suppression of electromagnetic emissions and surge protection. The architecture allows single or multiple components to be assembled within a single package such as an integrated circuit or connector.

Abstract: A predetermined amalgamation of electrodes formed or manufactured at least in part, by predetermined, sequential manufacturing operations into a balanced and shielding electrode structure. The balanced total electrode structure also uses a grouping of identically configured, and balanced positioned, shielding electrodes that are amalgamated in sequential combination with predetermined, complimentary balanced shielded electrodes groupings and other predetermined elements that are together, practicable to provide predetermined multiple energy conditioning functions operable upon portions of propagating energy as well simultaneously being operable to provide a common, voltage reference function operable for at least dynamic circuit operations.

Abstract: A singular or multiple paired, filter capacitor assembly that is comprised of either multilayer or monolithic capacitors and includes selective and arranged attachment to at least a conductive substrate, with operable conductors. This assembly can also include coupled to sets of interleaved-type or monolithic-type ground and active electrodes all arranged in a pre-selected manner for electrical connection into various types of electrical devices.

Abstract: A differential mode and common mode filtering arrangement (1—1, 1-2, 1-3A, 1-6) having a plurality of shielded electrodes (213, 215) and a plurality of shielding electrodes (204, 214, 269A, 269B).

Abstract: The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source. The interposer will also possess a multi-layer, universal multi-functional, common conductive shield structure with conductive pathways for energy and EMI conditioning and protection that also comprise a commonly shared and centrally positioned conductive pathway or electrode of the structure that can simultaneously shield and allow smooth energy interaction between grouped and energized conductive pathway electrodes containing a circuit architecture for energy conditioning as it relates to integrated circuit device packaging.

Abstract: Components embodiments that can sustain and condition complementary energy propagations and confluences of multiple circuitry.

Abstract: Circuit arrangement embodiments that use relative groupings of energy pathways that include shielding circuit arrangements that can sustain and condition electrically complementary energy confluences.

Abstract: The present invention is a component carrier consisting of a plate of insulating material having a plurality of apertures for accepting the leads of a thru-hole differential and common mode filter. Another embodiment consists of a surface mount component carrier comprised of a disk of insulating material having a plurality of apertures. The same concept for the above described carrier is also incorporated into several alternate embodiments, either independently, embedded within electronic connectors. The overall configuration and electrical characteristics of the concepts underlying the present inventions are also described as an energy conditioning circuit assembly which encompasses the combination of differential and common mode filters and component carriers optimized for such filters.

Abstract: A singular or multiple paired, filter capacitor assembly that is comprised of either multilayer or monolithic capacitors and includes selective and arranged attachment to at least a conductive substrate, with operable conductors. This assembly can also include coupled to sets of interleaved-type or monolithic-type ground and active electrodes all arranged in a pre-selected manner for electrical connection into various types of electrical devices.

Abstract: An amalgamation of selected energy pathways and other elements formed at least in-part by sequential manufacturing operations and made operable to be coupled and/or formed as part of a predetermined assembly and/or assemblies and/or assembly variations practicable and/or operable for sustaining electrically opposing and/or complementary energy portion confluences that can be themselves made operable by the arrangement amalgam to undergo portions of energy conditioning as a portion of an energized circuit.

Abstract: A singular or multiple paired, filter capacitor assembly that is comprised of either multilayer or monolithic capacitors and includes selective and arranged attachment to at least a conductive substrate, with operable conductors. This assembly can also include coupled to sets of interleaved-type or monolithic-type ground and active electrodes all arranged in a pre-selected manner for electrical connection into various types of electrical devices.

Abstract: Compact and integral arrangements for an energy-conditioning arrangement having various predetermined energy pathways utilized in part for the purpose of conditioning energies of either one or multiple of circuitry. Some energy-conditioning arrangement variants can be operable to provide multiple, energy-conditioning operations.