Abstract: An integrated circuit comprises a plurality of layers including a first substrate with an on chip capacitor and a second substrate. In one embodiment, the second substrate has an on chip capacitor. The first and/or second substrate can include a sensor element, such as a magnetic sensor element.

Abstract: In an exemplary embodiment, a method for a magnetic sensor includes forming a first conductive layer over a substrate containing circuitry, forming a dielectric layer over the first conductive layer, forming a second conductive layer over the dielectric layer such that the first conductive layer, the dielectric layer, and the second conductive layer form a first capacitor, and providing first and second terminals, wherein the first terminal is coupled to the first conductive layer and the second terminal is coupled to the second conductive layer.

Abstract: Methods and apparatus for a sensor to provide a sensor output, an integrated circuit module formed at least partially on a substrate to receive the sensor output and provide an IC output signal, an output circuit having a voltage input to receive a voltage supply signal via a switch element and a signal input to receive the IC output signal and an output to provide a voltage output signal, and an integrated power storage element coupled to the voltage input of the output circuit to provide power during an interruption of the voltage supply signal, wherein the power storage element includes at least one layer generally parallel to the substrate.

Abstract: An electronic circuit includes a magnetoresistance element for providing an output signal proportional to a magnetic field. The magnetoresistance element also has a hysteresis characteristic. The electronic circuit also includes at least one of a reset conductor or a bias conductor disposed proximate to the magnetoresistance element. For embodiments having a reset conductor, the electronic circuit is configured to generate a reset current carried by the reset conductor in response to the comparison. In response to the reset current, the reset conductor is configured to generate a reset magnetic field at the magnetoresistance element to temporarily force the magnetoresistance element to a saturation region of the hysteresis characteristic.

Abstract: An electronic circuit includes a primary magnetoresistance element for providing a first output signal proportional to a magnetic field. The primary magnetoresistance element has a primary maximum response axis. The primary magnetoresistance element also has a hysteresis characteristic. The electronic circuit also includes a reset conductor disposed proximate to the magnetoresistance element. The electronic circuit also includes a secondary magnetic field sensing element for providing a second output signal proportional to a magnetic field. The secondary magnetic field sensing element has a secondary maximum response axis, which, in some embodiments, is substantially perpendicular to the primary maximum response axis. In operation, the primary magnetoresistance is reset in accordance with an excessive magnetic field sensed by the secondary magnetic field sensing element.

Abstract: Methods and apparatus for providing an integrated circuit including a substrate having a magnetic field sensor, first and second conductive layers generally parallel to the substrate, and a dielectric layer disposed between the first and second conductive layers such that the first and second conductive layers and the dielectric layer form a capacitor, wherein a slot is formed in at least one of the first and second conductive layers proximate the magnetic field sensor for reducing eddy currents in the first and second conductive layers.

Abstract: The invention provides a current sensor that may be folded over a conductor without the need to sever the conductor or thread the conductor through the current sensor. In one embodiment, the current sensor includes an outer body having a first folding portion and a second folding portion coupled to the first folding portion. The current sensor also includes a soft ferromagnetic body disposed within the outer body comprising a first core element and a second core element. The first and second core elements form a lumen when the first and second folding portions are folded. The lumen is configured to receive a conductor. The current sensor also includes a magnetic field detector to sense a current in the conductor. The magnetic field detector is disposed at least partially between the first and second core elements when the first and second folding portions are folded.

Abstract: An electronic circuit for sensing a current includes a circuit board having first and second major opposing surfaces and a current conductor for carrying the current. The current conductor includes a circuit trace disposed upon the circuit board. The electronic circuit also includes an integrated circuit disposed upon and electrically coupled to the circuit board at a position so as to straddle the current conductor.

Abstract: An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor position. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chap arrangement. The current sensor can also include an electromagnetic shield disposed between the current conductor portion and the magnetic field sensing elements.

Abstract: Magnetic field sensors have a magnetic field sensing element and also a feedback circuit to provide a gain-adjustment signal to affect a sensitivity associated with the magnetic field sensing element. In some arrangements, the feedback circuit can include piezoresistors to sense a strain of a substrate over which the magnetic field sensor is disposed. With these arrangements, the feedback circuit can generate the gain-adjustment signal in accordance with the sensed strain. In other arrangements, the feedback circuit can generate pulsed magnetic fields proximate to the magnetic field sensing element in order to directly measure the sensitivity of the magnetic field sensing element. With these arrangements, the feedback circuit can generate the gain-adjustment signal in accordance with the sensed sensitivity.

Abstract: Presented is a sensor that includes a magnetoresistive (MR) sensing device to sense a magnetic field and to produce an AC signal voltage proportional to the sensed magnetic field. The sensor also includes circuitry, coupled to the MR sensing device, to remove DC offset from the AC signal voltage. The DC offset may be related to the hysteresis characteristics of the MR sensing device. To remove DC offset, the circuitry may obtain an averaged DC offset and subtract the averaged DC offset from the AC signal voltage to produce a sensor output signal.

Abstract: A magnetic sensor comprises a plurality of layers including a substrate having circuitry, at least one conductive layer to interconnect the circuitry, and an insulator layer to electrically insulate the at least one conductive layer. First and second conductive layers are disposed above the substrate with a dielectric layer disposed between the first and second conductive layers such that the first and second conductive layers and the dielectric layer form a capacitor. A first terminal is electrically connected to the first conductive layer and a second terminal is electrically connected to the second conductive layer.

Abstract: A magnetoresistive (MR) sensing device includes MR elements electrically connected to form a bridge circuit and one or more non-functional (or “dummy”) MR elements for improved matching of the bridge circuit MR elements.

Abstract: An integrated current sensor includes a current conductor, a magnetic field transducer, and an electromagnetic shield. The magnetic field transducer includes a sensor die. The electromagnetic shield is disposed proximate to the sensor die.

Abstract: An integrated sensor has a magnetic field sensing element and first and second relatively high magnetically permeable members forming a gap, wherein the magnetic field element is disposed within the gap. The magnetically permeable members provide an increase in the flux experienced by the magnetic field sensing element in response to a magnetic field. The integrated sensor can be used as a current sensor, a proximity detector, or a magnetic field sensor.

Abstract: An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chap arrangement. The lead frame also includes a shunt conductor portion formed as a coupling of the at least two leads.

Abstract: An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor position. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chap arrangement. The current sensor can also include an electromagnetic shield disposed between the current conductor portion and the magnetic field sensing elements.

Abstract: The present invention relates to inhibiting the activity of non-genotype 1 hepatitis C virus (HCV) NS3-NS4A protease activity. More particularly, the invention relates to inhibiting the activity of the protease from HCV genotype-2 or HCV genotype-3. The methods of the invention emply inhibitors that act by interfering with the life cycle of the HCV and are also useful as antiviral agents. The invention further relates to compositions comprising such compounds either for ex vivo use or for administration to a patient suffering from genotype-2 or genotype-3 HCV infection. The invention also relates to methods of treating an HCV infection in a patient by administering a composition comprising a compound of this invention.

Abstract: Methods and apparatus for providing an integrated circuit using a multi-stage molding process to protect wirebonds. In one embodiment, a method includes attaching a die to a leadframe having a lead finger, attaching a wirebond between the die and the leadfinger, applying a first mold material over at least a portion of the wirebond and the die and the leadfinger to form an assembly, waiting for the first mold material to at least partially cure, and applying a second mold material over the assembly.

Abstract: A highly water resistant coating is described for use as a temporary protective or tinting finish for a wide variety of personal items, including one's vehicle and tires. The film forming polymer of the coating is desirable as it can be applied with polar solvents but then upon evaporation of a solubilizing additive becomes water resistant or water proof. Thereafter if a similar solubilizing additive is used in a polar solvent, the coating can be removed without damaging the surface of the substrate.