Abstract: Techniques and systems for enhanced adjustment of quantities and placement of decoupling capacitance on circuit boards for integrated circuits is provided herein. An example method includes iterating application of a load profile across different populations of decoupling capacitors on a circuit board for supply voltage domains of an integrated circuit device until a target transient performance is reached for the supply voltage domains. The load profile is applied onto electrical connections corresponding to the supply voltage domains for the integrated circuit device. The method also includes generating a capacitor population configuration for the circuit board based on a population of the decoupling capacitors that achieves the target transient performance.

Abstract: Techniques and systems for enhanced adjustment of quantities and placement of decoupling capacitance on circuit boards for integrated circuits is provided herein. An example method includes iterating application of a load profile across different populations of decoupling capacitors on a circuit board for supply voltage domains of an integrated circuit device until a target transient performance is reached for the supply voltage domains. The load profile is applied onto electrical connections corresponding to the supply voltage domains for the integrated circuit device. The method also includes generating a capacitor population configuration for the circuit board based on a population of the decoupling capacitors that achieves the target transient performance.

Abstract: Power control and decoupling capacitance arrangements for integrated circuit devices are discussed herein. In one example, an assembly includes a first circuit assembly comprising a first circuit board coupled to an integrated circuit device, wherein the first circuit board is coupled to first surface of a system circuit board. The assembly also includes a second circuit assembly comprising a second circuit board having one or more voltage adjustment units configured to supply at least one input voltage to the integrated circuit device, wherein the second circuit board is coupled to a second surface of the system circuit board and positioned at least partially under a footprint of the integrated circuit device with respect to the system circuit board.

Abstract: Techniques and systems for enhanced adjustment of quantities and placement of decoupling capacitance on circuit boards for integrated circuits is provided herein. An example method includes iterating application of a load profile across different populations of decoupling capacitors on a circuit board for supply voltage domains of an integrated circuit device until a target transient performance is reached for the supply voltage domains. The load profile is applied onto electrical connections corresponding to the supply voltage domains for the integrated circuit device. The method also includes generating a capacitor population configuration for the circuit board based on a population of the decoupling capacitors that achieves the target transient performance.

Abstract: Clock control arrangements for integrated circuit devices are discussed herein. In one example, a method of operating an integrated circuit device includes monitoring indications of pending operations for a processing core of an integrated circuit, and determining a predicted change in workload for the processing core based at least on a portion of the indications of the pending operations. The method also includes altering a clock frequency of a clock signal provided to the processing core based at least on the predicted change in the workload.

Abstract: Power control arrangements for integrated circuit devices are discussed herein. In one example, an assembly includes an integrated circuit device comprising one or more processing cores and a power domain configured to distribute a supply voltage to the one or more processing cores. The assembly also includes a charge injection circuit coupled to the power domain of the integrated circuit device, and configured to selectively couple electric charge into the power domain to predictively offset at least portions of voltage transients in the power domain.

Abstract: Power supply architectures and enhanced power control techniques are presented herein. In one example, a system includes a plurality of power supply phases and a system processor. The system processor comprises a processing unit comprising a plurality of processing cores, a plurality of power domains configured to segregate power distribution for the processing unit into sets of the plurality of processing cores, and external connections configured to couple individual ones the plurality of power domains to individual ones of the plurality of power supply phases.

Abstract: Power supply circuitry and enhanced associated techniques are presented herein. In one example, a method includes powering a circuit with a plurality of power supply phases, and monitoring thermal properties of the plurality of power supply phases. Responsive to the thermal properties indicating at least one of the plurality of power supply phases exceeds a thermal threshold, the method includes selecting a dormant power supply phase to supplant the at least one of the plurality of power supply phases.

Abstract: An example method for adjusting operation of an integrated circuit includes testing a plurality of electronic elements of the integrated circuit including one or more redundant electronic elements designated as inactive according to a manufacturer's default configuration of the integrated circuit to determine one or more operating parameters of the integrated circuit. The method further includes selecting a subset of electronic elements from the plurality of electronic elements based on the one or more operating parameters, wherein the subset of electronic elements is designated as active according to an updated configuration of the integrated circuit, and controlling operation of the integrated circuit using the updated configuration instead of the manufacturer's default configuration.

Abstract: Computing assemblies, such as blade servers, can be housed in rackmount systems of data centers for execution of applications for remote users. These applications can include games and other various user software. In one example, a method of operating a data processing system includes receiving requests for execution of a plurality of applications, and identifying estimated power demands for execution of each of the plurality of applications. The method also includes determining power limit properties for a plurality of computing modules capable of executing the plurality of applications, and selecting among the plurality of computing modules to execute ones of the plurality of applications based at least on the power limit properties and the estimated power demands.

Abstract: Clock control arrangements for integrated circuit devices are discussed herein. In one example, a method of operating an integrated circuit device includes monitoring indications of pending operations for a processing core of an integrated circuit, and determining a predicted change in workload for the processing core based at least on a portion of the indications of the pending operations. The method also includes altering a clock frequency of a clock signal provided to the processing core based at least on the predicted change in the workload.

Abstract: Power reduction and voltage adjustment techniques for computing systems and processing devices are presented herein. In one example, a method includes executing a voltage characterization service for a processing device of a computing apparatus to determine at least one supply voltage for the processing device, the voltage characterization service comprising a functional test that exercises the processing device at iteratively adjusted voltages in context with associated system elements of the computing apparatus. During execution of the voltage characterization service, the method includes monitoring for operational failures of at least the processing device, and responsive to the operational failures, determining at least one resultant supply voltage.

Abstract: Power supply architectures and enhanced power control techniques are presented herein. In one example, a system includes a plurality of power supply phases and a system processor. The system processor comprises a processing unit comprising a plurality of processing cores, a plurality of power domains configured to segregate power distribution for the processing unit into sets of the plurality of processing cores, and external connections configured to couple individual ones the plurality of power domains to individual ones of the plurality of power supply phases.

Abstract: Decoupling capacitance arrangements for integrated circuit devices are discussed herein. In one example, an assembly includes a first circuit assembly comprising a first circuit board coupled to an integrated circuit device, where the first circuit board is coupled to first surface of a system circuit board. The assembly includes a second circuit assembly comprising a second circuit board having decoupling capacitance for the integrated circuit device, where the second circuit board is coupled to a second surface of the system circuit board and positioned at least partially under a footprint of the integrated circuit device with respect to the system circuit board.

Abstract: Voltage control arrangements for integrated circuit devices are discussed herein. In one example, a method includes receiving an indication of one or more software elements selected for execution by an integrated circuit device, and determining a target level of a supply voltage for the integrated circuit device based on the indication. The method also includes controlling voltage regulation circuitry to adjust a present level of the supply voltage for the integrated circuit device in accordance with the target level.

Abstract: Power control and decoupling capacitance arrangements for integrated circuit devices are discussed herein. In one example, an assembly includes a first circuit assembly comprising a first circuit board coupled to an integrated circuit device, wherein the first circuit board is coupled to first surface of a system circuit board. The assembly also includes a second circuit assembly comprising a second circuit board having one or more voltage adjustment units configured to supply at least one input voltage to the integrated circuit device, wherein the second circuit board is coupled to a second surface of the system circuit board and positioned at least partially under a footprint of the integrated circuit device with respect to the system circuit board.

Abstract: Power control arrangements for integrated circuit devices are discussed herein. In one example, an assembly includes an integrated circuit device comprising one or more processing cores and a power domain configured to distribute a supply voltage to the one or more processing cores. The assembly also includes a charge injection circuit coupled to the power domain of the integrated circuit device, and configured to selectively couple electric charge into the power domain to predictively offset at least portions of voltage transients in the power domain.

Abstract: Integrated circuit device carriers and packaging assemblies which have attached decoupling capacitance are discussed herein. In one example, an assembly includes a package assembly comprising a carrier circuit board and an integrated circuit device coupled to a first side of the carrier circuit board. The assembly includes decoupling capacitors for the integrated circuit device are coupled to a second side of the carrier circuit board opposite from at least a portion of a footprint of the integrated circuit device on the carrier circuit board. A motherboard can be coupled to the package assembly and have at least one motherboard substrate layer facing the decoupling capacitors.

Abstract: Integrated circuit decoupling capacitance systems, arrangements, and assemblies are discussed herein. In one example, an assembly includes an integrated circuit device comprising a plurality of through silicon vias (TSVs) coupled to corresponding voltage domains of the integrated circuit device. The assembly includes one or more capacitive elements external to the integrated circuit device and conductively coupled to selected ones of the TSVs.

Abstract: Integrated circuit device carriers and packaging assemblies which have attached decoupling capacitance are discussed herein. In one example, an assembly includes a package assembly coupled to a motherboard and comprising a carrier circuit board and an integrated circuit device coupled to a first side of the carrier circuit board. The assembly also includes decoupling capacitors for the integrated circuit device conductively coupled between the motherboard and a second side of the carrier circuit board opposite from at least a portion of a footprint of the integrated circuit device on the carrier circuit board.