Abstract: A solid-state light source contains light emitting diodes. The elements are an inorganic light emitting diode chip and at least one wavelength conversion chip or the elements are a plurality of light emitting diode chips and one or more optional wavelength conversion chips. Both substantially parallel and orthogonal mounting configurations are used for the light emitting diodes. Orthogonal mounting or rib emitter is a preferred embodiment. The wavelength conversion chip may include an electrical interconnection means. The light emitting diode chip may include at least one GaN-based semiconductor layer that is at least ten microns thick and that is fabricated by hydride vapor phase epitaxy. Methods, equipment, and articles can be used to fabricate the solid-state light sources, freestanding foil based light emitting diodes, and wavelength conversion materials.

Abstract: A solid-state light source with LEDs contained in a light recycling cavity emits both light and heat from heat extracting light emitting elements which form the light recycling cavity. Eliminating appended heat sinks makes these light sources ultra lightweight. The light sources can be attached and supported by suspended ceilings without affecting the seismic properties of the ceiling. The heat extracting light emitting elements are combined with a reflector to make directional light sources, which can be attached to ceilings with small magnets. Because the heat extracting light emitting elements transfer the heat from the light source to the illuminated area there is no requirement for disturbing or penetrating the ceiling barrier to a heat sink on the plenum side of the ceiling. This enables a contiguous acoustic ceiling. Further, the light sources are made from non flammable materials and therefore do not affect the fire rating of the ceiling.

Abstract: An integrated barrier or partition (e.g. suspended ceiling, wall, etc.) containing lightweight solid state light sources wherein the light emitting surface of the light sources are the primary heat dissipating surfaces of the light sources. The light sources consisting of light emitting diodes (LED) in thermal contact to light transmitting thermally conductive elements and combined with a reflector element to form a light recycling cavity, provide both convective and radiative cooling from their light emitting surfaces, eliminating the need for external appended heat sinks. Seismically safe suspended ceilings contain integrated lighting where the lighting adds less than one gram per square foot to the structure. The lighting, integrated into but without penetrating the barrier (suspended ceiling, ceiling, wall, floor, etc.), is nonflammable and does not promote flame spread or smoke generation.

Abstract: Lightweight solid state light sources with common light emitting and heat dissipating surfaces consisting of light emitting diodes (LED) in thermal contact to light transmitting thermally conductive elements and combined with a reflector element to form a light recycling cavity, provide both convective and radiative cooling from their light emitting surfaces, eliminating the need for appended heatsinks. The lightweight self-cooling solid state light sources integrate the electrical interconnect of the LEDs and other semiconductor devices to a single substrate that is both the heatsink and the light emitting element. The elimination of heavy appended heatsinks enables these sources to be easily moved, attached and mounted on suspended ceilings without requiring separate supporting means. The low profile and nonflammable properties of the light sources allow their use on fire barrier surfaces or partitions. The light sources can easily be integrated into ceilings, ceiling grids or ceiling tiles.

Abstract: Thin freestanding nitride veneers can be used for the fabrication of semiconductor devices. These veneers are typically less than 100 microns thick. The use of thin veneers also eliminates the need for subsequent wafer thinning for improved thermal performance and 3D packaging.

Abstract: An integrated barrier or partition (e.g. suspended ceiling, wall, etc.) containing lightweight solid state light sources wherein the light emitting surface of the light sources are the primary heat dissipating surfaces of the light sources. The light sources comprising of light emitting diodes (LED) in thermal contact to light transmitting thermally conductive elements and combined with a reflector element to form a light recycling cavity, provide both convective and radiative cooling from their light emitting surfaces, eliminating the need for external appended heat sinks. Seismically safe suspended ceilings contain integrated lighting where the lighting adds less than one gram per square foot to the structure. The lighting, integrated into but without penetrating the barrier (suspended ceiling, ceiling, wall, floor, etc.), is nonflammable and does not promote flame spread or smoke generation.

Abstract: A solid-state light source has a wavelength conversion chip affixed to a light emitting diode. Optical coatings, vias, light extraction elements, electrical connections or electrical bond pads can be fabricated on the wavelength conversion chips.

Abstract: Reflector designs for a large area panel light source create induced draft cooling means adjacent to the panel light source. The panel light source has a wavelength conversion element on a solid state light source for emitting light of a first and second wavelength to form a broader emission spectrum of light from the panel light source.

Abstract: Reflector designs for a large area panel light source create induced draft cooling means adjacent to the panel light source. The panel light source has a wavelength conversion element on a solid state light source for emitting light of a first and second wavelength to form a broader emission spectrum of light from the panel light source.

Abstract: Solid state light sources based on LEDs mounted on or within thermally conductive luminescent elements provide both convective and radiative cooling. Low cost self-cooling solid state light sources can integrate the electrical interconnect of the LEDs and other semiconductor devices. The thermally conductive luminescent element can completely or partially eliminate the need for any additional heatsinking means by efficiently transferring and spreading out the heat generated in LED and luminescent element itself over an area sufficiently large enough such that convective and radiative means can be used to cool the device.

Abstract: Thin freestanding nitride veneers can be used for the fabrication of semiconductor devices. These veneers are typically less than 100 microns thick. The use of thin veneers also eliminates the need for subsequent wafer thinning for improved thermal performance and 3D packaging.

Abstract: Flexible semiconductor devices based on flexible freestanding epitaxial elements are disclosed. The flexible freestanding epitaxial elements provide a virgin as grown epitaxy ready surface for additional growth layers. These flexible semiconductor devices have reduced stress due to the ability to flex with a radius of curvature less than 100 meters. Low radius of curvature flexing enables higher quality epitaxial growth and enables 3D device structures. Uniformity of layer formation is maintained by direct absorption of actinic radiation by the flexible freestanding epitaxial element within a reactor. In addition, standard post processing steps like lithography are enabled by the ability of the devices and elements to be flattened using a secondary support element or vacuum. Finished flexible semiconductor devices can be flexed to a radius of curvature of less than 100 meters. Nitrides, Zinc Oxides, and their alloys are preferred materials for the flexible freestanding epitaxial elements.

Abstract: The invention is a thermal recycling system for converting lower quality thermal sources into higher quality thermal sources. In one embodiment, at least one photonic crystal radiator is combined with at least one substantially different radiator within a low loss thermal recycling cavity. Thermal recycling is based on the use of spectrum, polarization and temporal restrictions. These systems can be used in cooling, heating, and energy production.

Abstract: Lighting systems with heat extracting light emitting elements are disclosed based on the light emitting surface also functioning as the heat cooling surface. Lighting systems which have only their light emitting surfaces exposed to ambient are disclosed. A thermally conductive mostly reflective light transmitting element provides light diffusion, interconnect, and forms a light recycling cavity providing very low profile and lightweight solid state light sources. These properties make these light sources very useful in applications such as aircraft, rescue, temporary illumination, and automotive where weight directly impacts cost and utility. The integration of drivers and other electrical functions onto the heat extracting light emitting elements is also disclosed.

Abstract: A solid-state light source with LEDs contained in a light recycling cavity emits both light and heat from heat extracting light emitting elements which form the light recycling cavity. Eliminating appended heat sinks makes these light sources ultra lightweight. The light sources can be attached and supported by suspended ceilings without affecting the seismic properties of the ceiling. The heat extracting light emitting elements are combined with a reflector to make directional light sources, which can be attached to ceilings with small magnets. Because the heat extracting light emitting elements transfer the heat from the light source to the illuminated area there is no requirement for disturbing or penetrating the ceiling barrier to a heat sink on the plenum side of the ceiling. This enables a contiguous acoustic ceiling. Further, the light sources are made from non flammable materials and therefore do not affect the fire rating of the ceiling.

Abstract: Thin flat crack-free freestanding nitride layers are fabricated by laser patterning of the interface and/or opposing surface of the nitride layer. The nitride layer is substantially flat once removed from the non-native substrate. The thin flat crack free nitride layers are between 3 and 250 microns thick and can have areas greater than 1 cm2.

Abstract: A concealable lightweight low-profile solid-state light source which can be attached to or embedded in a mounting surface so as to blend with that mounting surface. The light weight concealable low-profile solid-state light source comprises at least one LED at least one reflector, at least one diffuser wherein the reflector and the diffuser form a light recycling cavity that recycles the light emitted by the LED until it is transmitted through and from the diffuser. The heatsink or heat dissipating surface does not extend or protrude more than a millimeter beyond the light emitting surface of the concealable low-profile solid-state light source.

Abstract: Lighting systems with heat extracting light emitting elements are disclosed based on the light emitting surface also functioning as the heat cooling surface. Lighting systems which have only their light emitting surfaces exposed to ambient are disclosed. A thermally conductive mostly reflective light transmitting element provides light diffusion, interconnect, and forms a light recycling cavity providing very low profile and lightweight solid state light sources. These properties make these light sources very useful in applications such as aircraft, rescue, temporary illumination, and automotive where weight directly impacts cost and utility. The integration of drivers and other electrical functions onto the heat extracting light emitting elements is also disclosed.

Abstract: A solid-state light source with LEDs contained in a light recycling cavity emits both light and heat from heat extracting light emitting elements which form the light recycling cavity. Eliminating appended heat sinks makes these light sources ultra lightweight. The light sources can be attached and supported by suspended ceilings without affecting the seismic properties of the ceiling. The heat extracting light emitting elements are combined with a reflector to make directional light sources, which can be attached to ceilings with small magnets. Because the heat extracting light emitting elements transfer the heat from the light source to the illuminated area there is no requirement for disturbing or penetrating the ceiling barrier to a heat sink on the plenum side of the ceiling. This enables a contiguous acoustic ceiling. Further, the light sources are made from non flammable materials and therefore do not affect the fire rating of the ceiling.