Abstract: Solid state light sources based on LEDs mounted on or within thermally conductive luminescent elements provide both convective and radiative cooling. Low cost self-cooling solid state light sources can integrate the electrical interconnect of the LEDs and other semiconductor devices. The thermally conductive luminescent element can completely or partially eliminate the need for any additional heatsinking means by efficiently transferring and spreading out the heat generated in LED and luminescent element itself over an area sufficiently large enough such that convective and radiative means can be used to cool the device.

Abstract: A solid-state light source with LEDs contained in a light recycling cavity emits both light and heat from heat extracting light emitting elements which form the light recycling cavity. Eliminating appended heat sinks makes these light sources ultra lightweight. The light sources can be attached and supported by suspended ceilings without affecting the seismic properties of the ceiling. The heat extracting light emitting elements are combined with a reflector to make directional light sources, which can be attached to ceilings with small magnets. Because the heat extracting light emitting elements transfer the heat from the light source to the illuminated area there is no requirement for disturbing or penetrating the ceiling barrier to a heat sink on the plenum side of the ceiling. This enables a contiguous acoustic ceiling. Further, the light sources are made from non flammable materials and therefore do not affect the fire rating of the ceiling.

Abstract: Reflector designs for a large area panel light source create induced draft cooling means adjacent to the panel light source. The panel light source has a wavelength conversion element on a solid state light source for emitting light of a first and second wavelength to form a broader emission spectrum of light from the panel light source.

Abstract: A wavelength conversion chip is formed by depositing a wavelength conversion material on a substrate to form a layer, removing the resulting wavelength conversion layer from the substrate and then segmenting the wavelength conversion layer into a plurality of wavelength conversion chips. The wavelength conversion material can be annealed by thermal annealing or radiation annealing to increase the wavelength conversion efficiency of the chips or to sinter the wavelength conversion material to form a ceramic material. Optical coatings, vias, light extraction elements, electrical connections or electrical bond pads can be fabricated on the wavelength conversion chips.

Abstract: A solid-state light source has light emitting diodes embedded in a thermally conductive translucent luminescent element. The thermally conductive translucent luminescent element has optically translucent thermal filler and at least one luminescent element in a matrix material. A leadframe is electrically connected to the light emitting diodes. The leadframe distributes heat from the light emitting diodes to the thermally conductive translucent luminescent element. The thermally conductive translucent luminescent element distributes heat from light emitting diodes and the thermally conductive translucent luminescent element.

Abstract: Flexible semiconductor devices based on flexible freestanding epitaxial elements are disclosed. The flexible freestanding epitaxial elements provide a virgin as grown epitaxy ready surface for additional growth layers. These flexible semiconductor devices have reduced stress due to the ability to flex with a radius of curvature less than 100 meters. Low radius of curvature flexing enables higher quality epitaxial growth and enables 3D device structures. Uniformity of layer formation is maintained by direct absorption of actinic radiation by the flexible freestanding epitaxial element within a reactor. In addition, standard post processing steps like lithography are enabled by the ability of the devices and elements to be flattened using a secondary support element or vacuum. Finished flexible semiconductor devices can be flexed to a radius of curvature of less than 100 meters. Nitrides, Zinc Oxides, and their alloys are preferred materials for the flexible freestanding epitaxial elements.

Abstract: Rapid manufacturing processes and designs based on solid luminescent elements form solid state light sources. Direct attach, as well as other LED types, are embedded or affixed to the solid luminescent elements to form low cost solid state light sources.

Abstract: A solid-state light source has light emitting diodes embedded in a thermally conductive translucent luminescent element. The thermally conductive translucent luminescent element has optically translucent thermal filler and at least one luminescent element in a matrix material. A leadframe is electrically connected to the light emitting diodes. The leadframe distributes heat from the light emitting diodes to the thermally conductive translucent luminescent element. The thermally conductive translucent luminescent element distributes heat from light emitting diodes and the thermally conductive translucent luminescent element.

Abstract: Reflector designs for a large area panel light source create induced draft cooling means adjacent to the panel light source. The panel light source has a wavelength conversion element on a solid-state light source for emitting light of a first and second wavelength to form a broader emission spectrum of light from the panel light source. Magnetic elements make electrical connection between the fixture contacts and the light source contacts on the panel light source for a light fixture.

Abstract: A solid-state light source with light emitting diodes embedded in thermally conductive luminescent elements is cooled by immersion cooling via a phase change material (liquid or pool boiling). The thermally conductive translucent luminescent elements are arranged to confine the boiling to an inner tube with the condensed liquid on the output faces so as to provide a flicker free 360 degree output light source. At least one face of each LED is exposed directly to the fluid and the LED is unconstrained so as to provide optical emission with little to no wavelength shift as a function of drive current.

Abstract: Solid state light sources based on LEDs mounted on or within thermally conductive luminescent elements provide both convective and radiative cooling. Low cost self-cooling solid state light sources can integrate the electrical interconnect of the LEDs and other semiconductor devices. The thermally conductive luminescent element can completely or partially eliminate the need for any additional heatsinking means by efficiently transferring and spreading out the heat generated in LED and luminescent element itself over an area sufficiently large enough such that convective and radiative means can be used to cool the device.

Abstract: An integrated barrier or partition (e.g. suspended ceiling, wall, etc.) containing lightweight solid state light sources wherein the light emitting surface of the light sources are the primary heat dissipating surfaces of the light sources. The light sources consisting of light emitting diodes (LED) in thermal contact to light transmitting thermally conductive elements and combined with a reflector element to form a light recycling cavity, provide both convective and radiative cooling from their light emitting surfaces, eliminating the need for external appended heat sinks. Seismically safe suspended ceilings contain integrated lighting where the lighting adds less than one gram per square foot to the structure. The lighting, integrated into but without penetrating the barrier (suspended ceiling, ceiling, wall, floor, etc.), is nonflammable and does not promote flame spread or smoke generation.

Abstract: Lightweight solid state light sources with common light emitting and heat dissipating surfaces consisting of light emitting diodes (LED) in thermal contact to light transmitting thermally conductive elements and combined with a reflector element to form a light recycling cavity, provide both convective and radiative cooling from their light emitting surfaces, eliminating the need for appended heatsinks. The lightweight self-cooling solid state light sources integrate the electrical interconnect of the LEDs and other semiconductor devices to a single substrate that is both the heatsink and the light emitting element. The elimination of heavy appended heatsinks enables these sources to be easily moved, attached and mounted on suspended ceilings without requiring separate supporting means. The low profile and nonflammable properties of the light sources allow their use on fire barrier surfaces or partitions. The light sources can easily be integrated into ceilings, ceiling grids or ceiling tiles.

Abstract: Reflector designs for a large area panel light source create induced draft cooling means adjacent to the panel light source. The panel light source has a wavelength conversion element on a solid state light source for emitting light of a first and second wavelength to form a broader emission spectrum of light from the panel light source.

Abstract: Thin flat crack-free freestanding nitride layers are fabricated by laser patterning of the interface and/or opposing surface of the nitride layer. The nitride layer is substantially flat once removed from the non-native substrate. The thin flat crack free nitride layers are between 3 and 250 microns thick and can have areas greater than 1 cm2.

Abstract: Reflector designs for a large area panel light source create induced draft cooling means adjacent to the panel light source. The panel light source has a wavelength conversion element on a solid state light source for emitting light of a first and second wavelength to form a broader emission spectrum of light from the panel light source.

Abstract: A substrate-free semiconducting sheet has an array of semiconducting elements dispersed in a matrix material. The matrix material is bonded to the edge surfaces of the semiconducting elements and the substrate-free semiconducting sheet is substantially the same thickness as the semiconducting elements.

Abstract: A solid state light source with LEDs in thermal contact to thermally conductive translucent elements where light emitted from the LEDs is directed to emerge from the heat dissipating surfaces of the elements. The thermally conductive translucent elements are arranged or combined with a reflector to form a light recycling cavity. The outside surfaces of the thermally conductive translucent elements forming the cavity become luminescent as the light emitted by the LEDs on the inside of the cavity is continually reflected and recycled until a very high percentage of the light emitted by the LEDs is eventually transmitted through and emitted uniformly and omnidirectionally. Simultaneously, the heat from the LEDs conducts through and to the luminescent outside surfaces of the elements of the cavity, which radiatively and convectively cool the light source thereby eliminating the need for bulky appended heat sinks.

Abstract: Solid state light sources based on LEDs mounted on or within thermally conductive luminescent elements provide both convective and radiative cooling. Low cost self-cooling solid state light sources can integrate the electrical interconnect of the LEDs and other semiconductor devices. The thermally conductive luminescent element can completely or partially eliminate the need for any additional heatsinking means by efficiently transferring and spreading out the heat generated in LED and luminescent element itself over an area sufficiently large enough such that convective and radiative means can be used to cool the device.

Abstract: Reflector designs for a large area panel light source create induced draft cooling means adjacent to the panel light source. The panel light source has a wavelength conversion element on a solid state light source for emitting light of a first and second wavelength to form a broader emission spectrum of light from the panel light source.