Abstract: An ankle/foot orthosis with a foot part, which has a sole for receiving a foot, and with a shin part which, when fitted in place, bears on the frontal aspect of a shin and is connected to the foot part via a medially extending spring, wherein the spring, behind an ankle area, forms a hinge area that allows a movement of the shin part relative to the foot part in the anterior-posterior direction.

Abstract: The invention relates to a sintering paste consisting of: (A) 30 to 40 wt. % of silver flakes with an average particle size ranging from 1 to 20 ?m, (B) 8 to 20 wt. % of silver particles with an average particle size ranging from 20 to 100 nm, (C) 30 to 45 wt. % of silver(I) oxide particles, (D) 12 to 20 wt. % of at least one organic solvent, (E) 0 to 1 wt. % of at least one polymer binder, and (F) 0 to 0.5 wt. % of at least one additive differing from constituents (A) to (E).

Abstract: A metal sintering preparation containing (A) 50 to 90% by weight of at least one metal that is present in the form of particles having a coating that contains at least one organic compound, and (B) 6 to 50% by weight organic solvent. The mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 40,000 to 80,000 cm?1.

Abstract: A metal paste, comprising (A) 65 to 85 wt % of metal particles and (B) 10 to 35 wt % of organic solvent, wherein the metal particles (A) consist 70 to 100 wt % of organically coated copper flakes having a specific surface area in the range of 1.9 to 3.7 m2/g, a total oxygen content in the range of 2 to 4 wt % and a weight ratio of total carbon to total oxygen in the range of 0.25 to 0.9.

Abstract: One aspect relates to a method for producing a substrate adapter for the connecting to an electronic component, including arranging at least one contacting material layer between at least one side of a carrier and a surface of a substrate such that the contacting material layer has at least one predetermined breaking point, and joining the carrier and the substrate to the contacting material layer. One aspect also relates to a substrate adapter for connecting to an electronic component.

Abstract: A method is disclosed for separating compressed dry air to provide carbon dioxide and reduced-carbon dioxide compressed dry air. The method comprises providing a source of compressed dry air and admitting compressed dry air into a first chamber containing a carbon dioxide-adsorbent material at a first temperature. The carbon dioxide-adsorbent material adsorbs carbon dioxide from the compressed dry air to form reduced-carbon dioxide compressed dry air, which is allowed to pass out of the first chamber. The first chamber is closed to the source of compressed dry air. Then the carbon dioxide-adsorbent material is heated to a second temperature. This releases carbon dioxide from the carbon dioxide-adsorbent material, which carbon dioxide is removed from the first chamber. The method may be low cost and low energy, and may be easily integrated into existing compressed dry air systems.

Abstract: A filling device for a metering of a given weight and/or volume of a filling material (14) that is to be metered, including a collecting container (20) which is configured for the filling material (14) that is to be metered to be collected therein, and further including a metering element which is configured, for a metering of the filling material (14), to remove a defined volume of the filling material (14) out of the collecting container (20), and including a support module (26) movably supporting the metering element (24, 28).

Abstract: A filling device for a metering of a given weight and/or volume of a filling material (14) that is to be metered, including a collecting container (20) which is configured for the filling material (14) that is to be metered to be collected therein, and further including a metering element which is configured, for a metering of the filling material (14), to remove a defined volume of the filling material (14) out of the collecting container (20), and including a support module (26) movably supporting the metering element (24, 28).

Abstract: A metal sintering preparation containing (A) 50 to 90% by weight of at least one metal that is present in the form of particles having a coating that contains at least one organic compound, and (B) 6 to 50% by weight organic solvent. The mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 40,000 to 80,000 cm?1.

Abstract: A method for producing a stable sandwich arrangement of two components with solder situated therebetween, comprising the steps: (1) providing two components, each having at least one contact surface, and a free solder preform, (2) producing a sandwich arrangement of the components and a solder preform arranged between them and thus not yet connected to them by bringing into contact (i) each one of the contact surfaces, (ii) each of the single contact surface of the components or (iii) one of the contact surfaces of one component and a single contact surface of the other component, with the contact surfaces of the free solder preform, and (3) hot-pressing the sandwich arrangement produced in step (2) so as to form the stable sandwich arrangement at a temperature being at 10 to 40% below the melting temperature of the solder metal of the solder preform, expressed in ° C.

Abstract: The invention relates to a metal paste, containing (A) 75 to 90% by weight of copper and/or silver particles that are provided with a coating containing at least one organic compound, (B) 5 to 20% by weight of an organic solvent, and (C) 2 to 20% by weight of at least one type of metal particles different from the particles of (A) and having an average particle size (d50) in the range of 0.2 to 10 ?m. The metal particles of component (C) are selected from the group consisting of molybdenum particles and nickel core-silver shell particles with a silver content of 10 to 90% by weight.

Abstract: A method for producing a component bonded to a solder preform, comprising the following steps: (1) providing a component having at least one contact surface, and a free solder preform, (2) producing an assembly of the component and the solder preform, which is not yet bonded to said component, by bringing a contact surface, or the sole contact surface, of the component into contact with a contact surface of the free solder preform, and (3) forming the component bonded to the solder preform by hot pressing the assembly produced in step (2) at a temperature that is 10 to 40% lower than the melting temperature of the soldering metal of the solder preform, expressed in ° C., and with a combination of pressing force and pressing duration that will effect a reduction of 10% in the original thickness of the originally free solder preform.

Abstract: A metal paste, comprising (A) 65 to 85 wt % of metal particles and (B) 10 to 35 wt % of organic solvent, wherein the metal particles (A) consist 70 to 100 wt % of organically coated copper flakes having a specific surface area in the range of 1.9 to 3.7 m2/g, a total oxygen content in the range of 2 to 4 wt % and a weight ratio of total carbon to total oxygen in the range of 0.25 to 0.9.

Abstract: A method for producing a stable sandwich arrangement of two components with solder situated therebetween, comprising the steps: (1) providing two components, each having at least one contact surface, and a free solder preform, (2) producing a sandwich arrangement of the components and a solder preform arranged between them and thus not yet connected to them by bringing into contact (i) each one of the contact surfaces, (ii) each of the single contact surface of the components or (iii) one of the contact surfaces of one component and a single contact surface of the other component, with the contact surfaces of the free solder preform, and (3) hot-pressing the sandwich arrangement produced in step (2) so as to form the stable sandwich arrangement at a temperature being at 10 to 40% below the melting temperature of the solder metal of the solder preform, expressed in ° C.

Abstract: A silver sintering preparation comprising: (A) 30 to 88 wt.-% of silver flake particles having a mean particle diameter (d50) in the range of >1 to 20 ?m, (B) 5 to 30 wt.-% of at least one silver precursor, (C) 1 to 10 wt.-% of an organic polymer system, and (D) 6 to 30 wt.-% of organic solvent, wherein the organic polymer system (C) is chemically essentially stable at temperatures <300° C. and forms a continuous phase together with the organic solvent (D).

Abstract: A method for the production of a silver sintering agent in the form of a layer-shaped silver sintering body having silver oxide surfaces and the use thereof are provided.

Abstract: One aspect relates to a method for producing a substrate adapter for the connecting to an electronic component, including arranging at least one contacting material layer between at least one side of a carrier and a surface of a substrate such that the contacting material layer has at least one predetermined breaking point, and joining the carrier and the substrate to the contacting material layer. One aspect also relates to a substrate adapter for connecting to an electronic component.

Abstract: The invention relates to a method for connecting components, comprising the following steps: (I) applying a metal paste containing an organic solvent to the contact surface of a first component; (2) optionally applying the metal paste to the contact surface of a second component to be connected to the first component; (3) drying the metal paste applied to the contact surface of the first and optionally also to the contact surface of the second component; (4) producing a sandwich arrangement with the two components and the dried metal paste in-between; and (5) pressure sintering the sandwich arrangement comprising the layer of dried metal paste. The invention is characterised in that the drying is performed by irradiating with IR radiation with a peak wavelength in the wavelength range of between 750 and 1500 nm.

Abstract: The invention relates to a method for connecting components, comprising the following steps: (1) applying a metal paste containing an organic solvent to the contact surface of a first component; (2) optionally applying the metal paste to the contact surface of a second component to be connected to the first component; (3) producing a sandwich arrangement with the two components and a layer of the metal paste in-between; (4) drying the layer of metal paste between the components; and (5) pressureless sintering of the sandwich arrangement comprising the layer of dried metal paste, the drying and the pressureless sintering being performed by irradiation with IR radiation with a peak wavelength in the wavelength range of between 750 and 1500 nm. The components can be selected from the group consisting of substrates, active components and passive components. One or both of the components can be permeable to IR radiation.

Abstract: A semiconductor module (10) contains a ceramic interconnect device (50) having at least one semiconductor component (20). The at least one semiconductor component (20) is covered by an encapsulating compound (30) which contains a cured inorganic cement and has a thermal expansion coefficient in the range of 2 to 10 ppm/K. The ceramic of the ceramic interconnect device (50) is selected from ceramics based on aluminum oxide, aluminum nitride or silicon nitride.