Patents by Inventor Wolfgang Schmitt

Wolfgang Schmitt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210129245
    Abstract: A method for producing a component bonded to a solder preform, comprising the following steps: (1) providing a component having at least one contact surface, and a free solder preform, (2) producing an assembly of the component and the solder preform, which is not yet bonded to said component, by bringing a contact surface, or the sole contact surface, of the component into contact with a contact surface of the free solder preform, and (3) forming the component bonded to the solder preform by hot pressing the assembly produced in step (2) at a temperature that is 10 to 40% lower than the melting temperature of the soldering metal of the solder preform, expressed in ° C., and with a combination of pressing force and pressing duration that will effect a reduction of 10% in the original thickness of the originally free solder preform.
    Type: Application
    Filed: October 29, 2018
    Publication date: May 6, 2021
    Inventors: Michael Schäfer, Wolfgang Schmitt, Nadja Pelshaw
  • Publication number: 20210123483
    Abstract: A clutch arrangement (3) with a friction clutch (8) and a dog clutch (9), wherein the output side of the friction clutch (8) and the output side of the dog clutch (9) are connectible to a flywheel mass device (4). A powertrain unit having such clutch arrangement is also described.
    Type: Application
    Filed: May 8, 2018
    Publication date: April 29, 2021
    Inventors: Guido SCHMITT, Alexander BARTHA, Wolfgang KUNDERMANN, Axel ROHM, Gerald VIERNEKES, Alessio PAONE, Monika ROSSNER, Michael KUNTH
  • Publication number: 20210114102
    Abstract: A metal paste, comprising (A) 65 to 85 wt % of metal particles and (B) 10 to 35 wt % of organic solvent, wherein the metal particles (A) consist 70 to 100 wt % of organically coated copper flakes having a specific surface area in the range of 1.9 to 3.7 m2/g, a total oxygen content in the range of 2 to 4 wt % and a weight ratio of total carbon to total oxygen in the range of 0.25 to 0.9.
    Type: Application
    Filed: July 19, 2019
    Publication date: April 22, 2021
    Inventors: Christian Schwarzer, Wolfgang Schmitt
  • Publication number: 20210111149
    Abstract: A method for producing a stable sandwich arrangement of two components with solder situated therebetween, comprising the steps: (1) providing two components, each having at least one contact surface, and a free solder preform, (2) producing a sandwich arrangement of the components and a solder preform arranged between them and thus not yet connected to them by bringing into contact (i) each one of the contact surfaces, (ii) each of the single contact surface of the components or (iii) one of the contact surfaces of one component and a single contact surface of the other component, with the contact surfaces of the free solder preform, and (3) hot-pressing the sandwich arrangement produced in step (2) so as to form the stable sandwich arrangement at a temperature being at 10 to 40% below the melting temperature of the solder metal of the solder preform, expressed in ° C.
    Type: Application
    Filed: October 29, 2018
    Publication date: April 15, 2021
    Inventors: Michael Schäfer, Wolfgang Schmitt
  • Patent number: 10910340
    Abstract: A silver sintering preparation comprising: (A) 30 to 88 wt.-% of silver flake particles having a mean particle diameter (d50) in the range of >1 to 20 ?m, (B) 5 to 30 wt.-% of at least one silver precursor, (C) 1 to 10 wt.-% of an organic polymer system, and (D) 6 to 30 wt.-% of organic solvent, wherein the organic polymer system (C) is chemically essentially stable at temperatures <300° C. and forms a continuous phase together with the organic solvent (D).
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: February 2, 2021
    Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Ly May Chew, Seigi Suh, Samson Shahbazi, Wolfgang Schmitt
  • Patent number: 10785877
    Abstract: A method for the production of a silver sintering agent in the form of a layer-shaped silver sintering body having silver oxide surfaces and the use thereof are provided.
    Type: Grant
    Filed: April 17, 2015
    Date of Patent: September 22, 2020
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Michael Schäfer, Wolfgang Schmitt
  • Publication number: 20200180294
    Abstract: One aspect relates to a method for producing a substrate adapter for the connecting to an electronic component, including arranging at least one contacting material layer between at least one side of a carrier and a surface of a substrate such that the contacting material layer has at least one predetermined breaking point, and joining the carrier and the substrate to the contacting material layer. One aspect also relates to a substrate adapter for connecting to an electronic component.
    Type: Application
    Filed: December 5, 2019
    Publication date: June 11, 2020
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Andreas Steffen Klein, Andreas Hinrich, Michael Schaefer, Yvonne Loewer, Wolfgang Schmitt, Michael Lemmer
  • Publication number: 20200156155
    Abstract: The invention relates to a method for connecting components, comprising the following steps: (I) applying a metal paste containing an organic solvent to the contact surface of a first component; (2) optionally applying the metal paste to the contact surface of a second component to be connected to the first component; (3) drying the metal paste applied to the contact surface of the first and optionally also to the contact surface of the second component; (4) producing a sandwich arrangement with the two components and the dried metal paste in-between; and (5) pressure sintering the sandwich arrangement comprising the layer of dried metal paste. The invention is characterised in that the drying is performed by irradiating with IR radiation with a peak wavelength in the wavelength range of between 750 and 1500 nm.
    Type: Application
    Filed: February 7, 2018
    Publication date: May 21, 2020
    Inventors: Wolfgang Schmitt, Michael Schäfer, Susanne Klaudia Duch, Ly May Chew, Jens Nachreiner, Dieter Zech, Jörg Wöll, Jürgen Weber
  • Publication number: 20200147696
    Abstract: The invention relates to a method for connecting components, comprising the following steps: (1) applying a metal paste containing an organic solvent to the contact surface of a first component; (2) optionally applying the metal paste to the contact surface of a second component to be connected to the first component; (3) producing a sandwich arrangement with the two components and a layer of the metal paste in-between; (4) drying the layer of metal paste between the components; and (5) pressureless sintering of the sandwich arrangement comprising the layer of dried metal paste, the drying and the pressureless sintering being performed by irradiation with IR radiation with a peak wavelength in the wavelength range of between 750 and 1500 nm. The components can be selected from the group consisting of substrates, active components and passive components. One or both of the components can be permeable to IR radiation.
    Type: Application
    Filed: April 20, 2018
    Publication date: May 14, 2020
    Inventors: Wolfgang Schmitt, Michael Schäfer, Susanne K. Duch, Jens Nachreiner, Ly May Chew
  • Patent number: 10593608
    Abstract: A semiconductor module (10) contains a ceramic interconnect device (50) having at least one semiconductor component (20). The at least one semiconductor component (20) is covered by an encapsulating compound (30) which contains a cured inorganic cement and has a thermal expansion coefficient in the range of 2 to 10 ppm/K. The ceramic of the ceramic interconnect device (50) is selected from ceramics based on aluminum oxide, aluminum nitride or silicon nitride.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: March 17, 2020
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Ronald Eisele, Anton-Zoran Miric, Frank Krüger, Wolfgang Schmitt
  • Patent number: 10347566
    Abstract: A carrier and the clip are used to produce a packaging having a lead frame by connection to the chip using sintering of the solidified sintering pastes in one work step. The carrier may be a lead frame and a clip for at least one semiconductor element has at least one functional surface for connecting to the semiconductor element and a plurality of connections. The material of the earlier or of the clip includes a metal and a layer made of a solidified sintering paste. The sintering paste may contain silver and/or a silver compound. The sintering paste is arranged on the functional surface. The carrier or clip and the layer made of sintering paste form an intermediate product that can be connected to the semiconductor element.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: July 9, 2019
    Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Michael Benedikt, Thomas Krebs, Michael Schäfer, Wolfgang Schmitt, Andreas Hinrich, Andreas Klein, Alexander Brand, Martin Bleifuss
  • Patent number: 10288175
    Abstract: An axial shaft seal for sealing a shaft against a housing of a combustion engine comprises a stiffening section and a sealing element connected to the stiffening section, having a sealing lip which is established for sealing interaction with a counter-running element which is connected to the shaft and runs radially. In the assembled state, a sealing contact exists exclusively between an end section of the sealing lip and the radial counter-running element. A plurality of channels is arranged on the side facing towards the counter-running element and over the periphery of the sealing lip, or on the counter-running surface and over the periphery of the counter-running element, in which a pressure build-up is caused when the shaft is rotating.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: May 14, 2019
    Assignee: BRUSS SEALING SYSTEMS GMBH
    Inventor: Wolfgang Schmitt
  • Patent number: 10144095
    Abstract: A mixture contains metal oxide particles that are coated with an organic compound. The organic compound is represented by Formula I: R1—COR2??(I), wherein R1 is an aliphatic residue having 8 to 32 carbon atoms, wherein R2 is either —OM or comprises the moiety —X—R3, wherein X is selected from the group consisting of O, S, N—R4, wherein R4 is a hydrogen atom or an aliphatic residue, wherein R3 is a hydrogen atom or an aliphatic residue, and wherein M is a cation. The mixture may be used to connect components and/or to produce a module. A method for producing the mixture is also provided.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: December 4, 2018
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Michael Schäfer, Wolfgang Schmitt, Susanne Klaudia Duch
  • Publication number: 20180311774
    Abstract: A mixture contains metal oxide particles that are coated with an organic compound. The organic compound is represented by Formula I: R1—COR2??(I), wherein R1 is an aliphatic residue having 8 to 32 carbon atoms, wherein R2 is either —OM or comprises the moiety —X—R3, wherein X is selected from the group consisting of O, S, N—R4, wherein R4 is a hydrogen atom or an aliphatic residue, wherein R3 is a hydrogen atom or an aliphatic residue, and wherein M is a cation. The mixture may be used to connect components and/or to produce a module. A method for producing the mixture is also provided.
    Type: Application
    Filed: May 1, 2018
    Publication date: November 1, 2018
    Inventors: Michael SCHÄFER, Wolfgang SCHMITT, Susanne Klaudia DUCH
  • Publication number: 20180261518
    Abstract: A semiconductor module (10) contains a ceramic interconnect device (50) having at least one semiconductor component (20). The at least one semiconductor component (20) is covered by an encapsulating compound (30) which contains a cured inorganic cement and has a thermal expansion coefficient in the range of 2 to 10 ppm/K. The ceramic of the ceramic interconnect device (50) is selected from ceramics based on aluminum oxide, aluminum nitride or silicon nitride.
    Type: Application
    Filed: May 9, 2018
    Publication date: September 13, 2018
    Inventors: Ronald EISELE, Anton-Zoran MIRIC, Frank KRÜGER, Wolfgang SCHMITT
  • Publication number: 20180147673
    Abstract: The invention relates to a metal paste, containing (A) 75 to 90% by weight of copper and/or silver particles that are provided with a coating containing at least one organic compound, (B) 5 to 20% by weight of an organic solvent, and (C) 2 to 20% by weight of at least one type of metal particles different from the particles of (A) and having an average particle size (d50) in the range of 0.2 to 10 ?m. The metal particles of component (C) are selected from the group consisting of molybdenum particles and nickel core-silver shell particles with a silver content of 10 to 90% by weight.
    Type: Application
    Filed: August 2, 2016
    Publication date: May 31, 2018
    Inventors: Wolfgang Schmitt, Thomas Krebs, Michail Schäfer, Susnne K. Duch, Jens Nanchreiner
  • Publication number: 20170326640
    Abstract: A metal sintering preparation containing (A) 50 to 90% by weight of at least one metal that is present in the form of particles having a coating that contains at least one organic compound, and (B) 6 to 50% by weight organic solvent. The mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 40,000 to 80,000 cm?1.
    Type: Application
    Filed: May 8, 2015
    Publication date: November 16, 2017
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Wolfgang SCHMITT, Thomas KREBS, Michael SCHÄFER, Susanne Klaudia DUCH, Jens NACHREINER
  • Publication number: 20170239728
    Abstract: A method for connecting components involves providing an arrangement of at least two components each containing at least one metallic contact surface and a metallic sintering agent in the form of a metallic solid body having metal oxide surfaces arranged between the components and pressuring sintering the arrangement whereby metal oxide surfaces of the metallic sintering agent and the metallic contact surfaces of the components each form a joint contact surface. The pressure sintering is carried out in an atmosphere containing at least one oxidizable compound and/or the metal oxide surfaces are provided with at least one oxidizable organic compound before formation of the corresponding joint contact surface.
    Type: Application
    Filed: March 18, 2015
    Publication date: August 24, 2017
    Inventors: Michael SCHÄFER, Wolfgang SCHMITT
  • Publication number: 20170223840
    Abstract: A method for the production of a silver sintering agent in the form of a layer-shaped silver sintering body having silver oxide surfaces and the use thereof are provided.
    Type: Application
    Filed: April 17, 2015
    Publication date: August 3, 2017
    Inventors: Michael SCHÄFER, Wolfgang SCHMITT
  • Publication number: 20170141074
    Abstract: A metal preparation is provided which contains (A) 40 to <80% by weight of at least one metal in the form of particles having a coating that contains at least one organic compound, and (B) >20 to 50 by weight organic solvent.
    Type: Application
    Filed: May 26, 2015
    Publication date: May 18, 2017
    Inventors: Michael SCHÄFER, Wolfgang SCHMITT