Abstract: A carrier and the clip are used to produce a packaging having a lead frame by connection to the chip using sintering of the solidified sintering pastes in one work step. The carrier may be a lead frame and a clip for at least one semiconductor element has at least one functional surface for connecting to the semiconductor element and a plurality of connections. The material of the earlier or of the clip includes a metal and a layer made of a solidified sintering paste. The sintering paste may contain silver and/or a silver compound. The sintering paste is arranged on the functional surface. The carrier or clip and the layer made of sintering paste form an intermediate product that can be connected to the semiconductor element.

Abstract: An axial shaft seal for sealing a shaft against a housing of a combustion engine comprises a stiffening section and a sealing element connected to the stiffening section, having a sealing lip which is established for sealing interaction with a counter-running element which is connected to the shaft and runs radially. In the assembled state, a sealing contact exists exclusively between an end section of the sealing lip and the radial counter-running element. A plurality of channels is arranged on the side facing towards the counter-running element and over the periphery of the sealing lip, or on the counter-running surface and over the periphery of the counter-running element, in which a pressure build-up is caused when the shaft is rotating.

Abstract: A mixture contains metal oxide particles that are coated with an organic compound. The organic compound is represented by Formula I: R1—COR2??(I), wherein R1 is an aliphatic residue having 8 to 32 carbon atoms, wherein R2 is either —OM or comprises the moiety —X—R3, wherein X is selected from the group consisting of O, S, N—R4, wherein R4 is a hydrogen atom or an aliphatic residue, wherein R3 is a hydrogen atom or an aliphatic residue, and wherein M is a cation. The mixture may be used to connect components and/or to produce a module. A method for producing the mixture is also provided.

Abstract: A mixture contains metal oxide particles that are coated with an organic compound. The organic compound is represented by Formula I: R1—COR2??(I), wherein R1 is an aliphatic residue having 8 to 32 carbon atoms, wherein R2 is either —OM or comprises the moiety —X—R3, wherein X is selected from the group consisting of O, S, N—R4, wherein R4 is a hydrogen atom or an aliphatic residue, wherein R3 is a hydrogen atom or an aliphatic residue, and wherein M is a cation. The mixture may be used to connect components and/or to produce a module. A method for producing the mixture is also provided.

Abstract: A semiconductor module (10) contains a ceramic interconnect device (50) having at least one semiconductor component (20). The at least one semiconductor component (20) is covered by an encapsulating compound (30) which contains a cured inorganic cement and has a thermal expansion coefficient in the range of 2 to 10 ppm/K. The ceramic of the ceramic interconnect device (50) is selected from ceramics based on aluminum oxide, aluminum nitride or silicon nitride.

Abstract: The invention relates to a metal paste, containing (A) 75 to 90% by weight of copper and/or silver particles that are provided with a coating containing at least one organic compound, (B) 5 to 20% by weight of an organic solvent, and (C) 2 to 20% by weight of at least one type of metal particles different from the particles of (A) and having an average particle size (d50) in the range of 0.2 to 10 ?m. The metal particles of component (C) are selected from the group consisting of molybdenum particles and nickel core-silver shell particles with a silver content of 10 to 90% by weight.

Abstract: A metal sintering preparation containing (A) 50 to 90% by weight of at least one metal that is present in the form of particles having a coating that contains at least one organic compound, and (B) 6 to 50% by weight organic solvent. The mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 40,000 to 80,000 cm?1.

Abstract: A method for connecting components involves providing an arrangement of at least two components each containing at least one metallic contact surface and a metallic sintering agent in the form of a metallic solid body having metal oxide surfaces arranged between the components and pressuring sintering the arrangement whereby metal oxide surfaces of the metallic sintering agent and the metallic contact surfaces of the components each form a joint contact surface. The pressure sintering is carried out in an atmosphere containing at least one oxidizable compound and/or the metal oxide surfaces are provided with at least one oxidizable organic compound before formation of the corresponding joint contact surface.

Abstract: A method for the production of a silver sintering agent in the form of a layer-shaped silver sintering body having silver oxide surfaces and the use thereof are provided.

Abstract: A metal preparation is provided which contains (A) 40 to <80% by weight of at least one metal in the form of particles having a coating that contains at least one organic compound, and (B) >20 to 50 by weight organic solvent.

Abstract: A semiconductor module (10) contains a ceramic interconnect device (50) having at least one semiconductor component (20). The at least one semiconductor component (20) is covered by an encapsulating compound (30) which contains a cured inorganic cement and has a thermal expansion coefficient in the range of 2 to 10 ppm/K. The ceramic of the ceramic interconnect device (50) is selected from ceramics based on aluminum oxide, aluminum nitride or silicon nitride.

Abstract: A carrier and the clip are used to produce a packaging having a lead frame by connection to the chip using sintering of the solidified sintering pastes in one work step. The carrier may be a lead frame and a clip for at least one semiconductor element has at least one functional surface for connecting to the semiconductor element and a plurality of connections. The material of the carrier or of the clip includes a metal and a layer made of a solidified sintering paste. The sintering paste may contain silver and/or a silver compound. The sintering paste is arranged on the functional surface. The carrier or clip and the layer made of sintering paste form an intermediate product that can be connected to the semiconductor element.

Abstract: A method for reversible capture and release of carbon dioxide comprises the steps of providing a solution of a defined tetranuclear complex or mixture thereof, in which adsorption sites are provided by coordinated solvent molecules such as water molecules. The solution is exposed to the atmosphere or to a gas stream containing carbon dioxide to sequester carbon dioxide, and the pH of the resultant reaction mixture is adjusted to facilitate the release of carbon dioxide. The solution which is used to sequester carbon dioxide is a solution of a polynuclear transition metal compound having the formula: (I) and the tetranuclear transition metal compound that has sequestered carbon dioxide is of the formula: (II).

Abstract: A radial shaft sealing ring for sealing of a casing part of a motor vehicle engine or gearbox, with a supporting body and a sleeve-type sealing lip connected to the supporting body and bent towards the side to be sealed, which sealing lip lies on an axial length L on the shaft and has a conveying groove in the area of contact with the shaft for conveying of medium back into the volume to be sealed, and which sealing lip has a sufficient bending elasticity to achieve a sufficient contact pressure without the use of additional means, wherein the material of the sealing lip essentially consists of a high temperature cross-linked LSR liquid silicone material.

Abstract: In general, the invention relates to electro-conductive pastes comprising silver particles which comprise silver oxide and organic additives and their use in the preparation of photovoltaic solar cells, preferably n-type photovoltaic solar cells. More specifically, the invention relates to electro-conductive pastes, solar cell precursors, processes for preparation of solar cells, solar cells and solar modules. The invention relates to an electro-conductive paste comprising as paste constituents: a. Silver particles; wherein the silver particles comprise the following silver particle constituents: i. Silver metal; ii. Silver oxide; b. An inorganic reaction system; c. An organic vehicle; d. An organic additive comprising one or more oxygen atoms doubly bonded to a carbon atom, or singly bonded to two carbon atoms, or a combination of both types of oxygen atom.

Abstract: An axial shaft seal for sealing a shaft against a housing of a combustion engine comprises a stiffening section and a sealing element connected to the stiffening section, having a sealing lip which is established for sealing interaction with a counter-running element which is connected to the shaft and runs radially. In the assembled state, a sealing contact exists exclusively between an end section of the sealing lip and the radial counter-running element. A plurality of channels is arranged on the side facing towards the counter-running element and over the periphery of the sealing lip, or on the counter-running surface and over the periphery of the counter-running element, in which a pressure build-up is caused when the shaft is rotating.

Abstract: A sinterable mixture and method of producing the mixture are provided containing: (a) metal particles and (b) an organic compound represented by Formula I: R1—COR2 (I), wherein R1 is an aliphatic residue having 8 to 32 carbon atoms, and R2 comprises either an —OM moiety or an —X—R3 moiety, wherein M is a cation, wherein X is selected from the group consisting of O, S, N—R4, and wherein R3 is a hydrogen atom or an aliphatic residue and R4 is a hydrogen atom or an aliphatic residue, wherein a molar ratio of carbon present in the organic compound (b) to oxygen present in the metal particles (a) is in a range of 3 to 50. The mixture is used for connecting components in a sandwich arrangement with the mixture in between and sintering the sandwich arrangement.

Abstract: A mixture contains metal oxide particles that are coated with an organic compound. The mixture may be used to connect components and/or to produce a module. A method for producing the mixture is also provided.

Abstract: A sintering method is provided which allows components to be joined to each other in a stable way, wherein the processing temperature is less than 200° C. and stable contact points are produced, which have low porosity and also high electrical and thermal conductivity. The method for joining components includes (a) providing a sandwich arrangement having at least (a1) one component 1, (a2) one component 2, and (a3) a metal paste located between component 1 and component 2, and (b) sintering the sandwich arrangement. The metal paste contains (A) 75-90 weight percent of at least one metal present in the form of particles having a coating containing at least one organic compound, (B) 0-12 weight percent of at least one metal precursor, (C) 6-20 weight percent of at least one solvent, and (D) 0.1-15 weight percent of at least one sintering agent selected from the group comprising (i) organic peroxides, (ii) inorganic peroxides, and (iii) inorganic acids.

Abstract: A sintering method allows components to be joined to each other in a stable way at a processing temperature of less than 200° C., producing stable contact points having low porosity and high electrical and thermal conductivity. The method includes (a) providing a sandwich arrangement having at least a first component, a second component, and a metal paste located between the first and second components, and (b) sintering the sandwich arrangement. The metal paste includes (A) 75-90 wt. % of at least one metal present in the form of particles having an organic compound-containing coating, (B) 0-12wt % of at least one metal precursor, (C) 6-20wt % of at least one solvent, and (D) 0.1-15 wt % of at least one sintering agent selected from (i) salts of C1-C4 organic acids, (ii) esters of C1-C4 organic acids, and (iii) carbonyl complexes.