Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode facing each other with the dielectric layer interposed therebetween, and a first external electrode electrically connected to the first internal electrode, and a second external electrode electrically connected to the second internal electrode, disposed in an outer portion of the ceramic body, the first and second external electrodes comprise a first electrode layer including a conductive metal, a first plating layer disposed on the first electrode layer and including nickel (Ni), and a second plating layer disposed on the first plating layer and including tin (Sn), and a ratio (t1/t2) is within a range from 1.0 to 9.0, where t1 is a thickness of the first plating layer including nickel (Ni), and t2 is a thickness of the second plating layer including tin (Sn).

Abstract: A multilayer ceramic electronic component includes a multilayer ceramic electronic component including a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode facing each other with the dielectric layer interposed therebetween, and first and second external electrodes respectively electrically connected to the first and second internal electrodes, disposed in an outer portion of the ceramic body. The first and second external electrodes include a first electrode layer including a conductive metal, a first plating layer disposed on the first electrode layer and including nickel (Ni), and a second plating layer disposed on the first plating layer and including tin (Sn). A ratio (t1/t2) between a thickness (t1) of the first plating layer including nickel (Ni) and a thickness (t2) of the second plating layer including tin (Sn) is within a range from 1.0 to 9.0.

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween, and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively. The external electrodes include electrode layers electrically connected to the internal electrodes and conductive resin layers disposed on the electrode layers, and the conductive layers are disposed to extend first and second surfaces of the ceramic body. When a distance from an outer edge of one of the first or second external electrodes disposed on a first or second surface to an inner edge thereof is defined as BW and surface roughness of the ceramic body is defined as Ra, a ratio of 100 times the surface roughness Ra to the distance BW (Ra*100/BW) satisfies (Ra*100/BW)?1.0.

Abstract: A composite electronic component includes: a composite body including a multilayer ceramic capacitor coupled to a ceramic chip, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween are stacked and first and second external electrodes disposed on opposite end portions of the first ceramic body in a length direction, respectively, and the ceramic chip including a second ceramic body including ceramic and first and second terminal electrodes, wherein a ratio of a length of the ceramic chip to a length of the multilayer ceramic capacitor is 0.7 to 1.0, and a ratio of a sum of a length of the first terminal electrode and a length of the second terminal electrode to the length of the ceramic chip is 0.3 to 0.6.

Abstract: A ceramic electronic component includes a body including dielectric layers and a plurality of internal electrodes and an external electrode including a connection portion and a band portion. The external electrode includes an electrode layer, a conductive resin layer, a nickel plating layer, and a tin plating layer. When an electrode layer thickness, a conductive resin layer thickness, a nickel plating layer thickness, a tin plating layer thickness of the band portion are defined as t3, t4, and t5, respectively, t5 is greater than or equal to 0.5 micrometer and less than 7 micrometer, and t5/(t3+t4) satisfies 1?t5/(t3+t4)*100<17.5 in the case in which t3+t4 is less than or equal to 100 micrometers and satisfies 0.3?t5/(t3+t4)*100<4.38 in the case in which t3+t4 is more than 100 micrometers.

Abstract: An electronic component includes: a capacitor array including a plurality of multilayer capacitors which are sequentially arranged in a first direction, and first and second metal frames disposed on both side surfaces of the capacitor array and connected to first and second external electrodes of the plurality of multilayer capacitors, respectively; the first and second metal frames include first and second support portions, and first and second mounting portions, respectively; and the first and second mounting portions include first and second portions opposing each other toward the center of the capacitor array, and third and fourth portions positioned outside the first and second portions, respectively, and a length of each of the first and second portions is shorter than a length of each of the third and fourth portions.

Abstract: An electronic component and a mounting board for mounting of the same are provided. The electronic component includes a body including external electrodes disposed on surfaces of the body opposing each other in a first direction, respectively, and metal frames connected to the external electrodes, respectively. The metal frames include supports bonded to the external electrodes and mounting portions extending from lower ends of the supports in the first direction and are spaced apart from the body and the external electrodes. The supports include a lower support portion disposed on a lower side of the body and an upper support portion disposed on an upper side of the body, and the lower support portion has a thickness in a second direction perpendicular to the first direction relatively greater than a thickness of the upper support portion in the first direction.

Abstract: An electronic component includes: a multilayer ceramic capacitor including a capacitor body and a pair of external electrodes, and an interposer including an interposer body having grooves and a pair of external terminals. Each of the external terminals includes a bonding portion, a mounting portion and a connection portion; and ?L=|A?A?|/2 in which A is a distance from one end portion of the interposer in a length direction to one end portion of the multilayer ceramic capacitor in the length direction, A? is a distance from the other end portion of the interposer in the length direction to the other end portion of the multilayer ceramic capacitor in the length direction, and ?L is an offset between the multilayer ceramic capacitor and the interposer in the length direction, and ?L/L?0.100 in which L is a length of the multilayer ceramic capacitor.

Abstract: An electronic component includes a multilayer capacitor, including a capacitor body, and a pair of external electrodes disposed on both ends of the capacitor body, respectively, and an interposer, including an interposer body, and a pair of external terminals disposed on both ends of the interposer body, respectively. The pair of external terminals include bonding portions disposed on a top surface of the interposer body, mounting portions disposed on a bottom surface of the interposer body, and connection portions disposed on end surfaces of the interposer to connect the bonding portions and the mounting portions to each other. The mounting portions have lengths greater than lengths of the bonding portions in a direction of connection of the pair of external terminals.

Abstract: An electronic component includes a multilayer capacitor, including a capacitor body, and a pair of external electrodes disposed on both ends of the capacitor body, respectively, and an interposer, including an interposer body, and a pair of external terminals disposed on both ends of the interposer body, respectively. The external terminals include bonding portions, mounting portions, and connection portions disposed to connect the bonding portions and the mounting portions to each other. Adhesives are provided between the external electrodes and the bonding portion. A height at which the adhesives fall along the connection portions of the external terminals is defined as t and a height of the interposer is defined as T, t/T satisfies 0.04?t/T?0.80.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween; and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, wherein the external electrodes including, respectively, electrode layers electrically connected to the internal electrodes, respectively, and conductive resin layers disposed on the electrode layers, respectively.

Abstract: An electronic component includes a capacitor array including a plurality of multilayer capacitors; and first and second metal frames disposed on a side surface and another side surface of the capacitor array and electrically connected to first and second external electrodes, respectively, wherein the first metal frame includes a first support portion; a first mounting portion; and a first connection portion, the second metal frame includes a second support portion; a second mounting portion; and a second connection portion, and lengths of the first and second mounting portions in the first direction are smaller than a length of the capacitor array in the first direction.

Abstract: An electronic component includes a body in which external electrodes are disposed on opposing surfaces of the body in a first direction thereof, respectively; and a pair of metal frames connected to the external electrodes, respectively, wherein the metal frame includes a support portion bonded to the external electrodes, and a mounting portion extending in the first direction from a lower end of the support portion and spaced apart from the body and the external electrodes, and a length of the mounting portion in a second direction perpendicular to the first direction is smaller than a length of the body in the second direction.

Abstract: An electronic component includes a capacitor array including a plurality of multilayer capacitors; and first and second metal frames disposed on a side surface and another side surface of the capacitor array and electrically connected to first and second external electrodes, respectively, wherein the first metal frame includes a first support portion; a first mounting portion; and a first connection portion, the second metal frame includes a second support portion; a second mounting portion; and a second connection portion, and lengths of the first and second mounting portions in the first direction are smaller than a length of the capacitor array in the first direction.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween; and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, wherein the external electrodes including, respectively, electrode layers electrically connected to the internal electrodes, respectively, and conductive resin layers disposed on the electrode layers, respectively.

Abstract: An electronic component includes a body; external electrodes respectively disposed on opposing surfaces of the body in a first direction thereof; and a pair of metal frames connected to the external electrodes, respectively, in which each of the metal frames includes a support portion bonded to the external electrodes, and a mounting portion extending in the first direction from a lower end of the support portion and spaced apart from the body and the external electrodes, and a length of the mounting portion in a second direction perpendicular to the first direction is greater than a length of the body in the second direction.

Abstract: An electronic component includes a multilayer capacitor, including a capacitor body, and a pair of external electrodes disposed on both ends of the capacitor body, respectively, and an interposer, including an interposer body, and a pair of external terminals disposed on both ends of the interposer body, respectively. The pair of external terminals include bonding portions disposed on a top surface of the interposer body, mounting portions disposed on a bottom surface of the interposer body, and connection portions disposed on end surfaces of the interposer to connect the bonding portions and the mounting portions to each other. The mounting portions have lengths greater than lengths of the bonding portions in a direction of connection of the pair of external terminals.

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes, first and second external electrodes disposed on first and second external surfaces of the ceramic body, and an interposer including an insulating body and first and second terminal electrodes. (B1+B2)/2 is greater than or equal to 10 micrometers (?m) and less than C/2, and C is greater than (B1+B2) and less than or equal to 80 ?m, in which B1 is a thickness of an upper portion, of each of the first and second terminal electrodes, disposed above the insulating body, B2 is a thickness of a lower portion, of each of the first and second terminal electrodes, disposed below the insulating body, and C is a thickness of the interposer.

Abstract: An electronic component includes: a capacitor array including a plurality of multilayer capacitors which are sequentially arranged in a first direction, and first and second metal frames disposed on both side surfaces of the capacitor array and connected to first and second external electrodes of the plurality of multilayer capacitors, respectively; the first and second metal frames include first and second support portions, and first and second mounting portions, respectively; and the first and second mounting portions include first and second portions opposing each other toward the center of the capacitor array, and third and fourth portions positioned outside the first and second portions, respectively, and a length of each of the first and second portions is shorter than a length of each of the third and fourth portions.

Abstract: An electronic component includes: a capacitor array including a plurality of multilayer capacitors which are sequentially arranged in a first direction, and first and second metal frames disposed on both side surfaces of the capacitor array and connected to first and second external electrodes of the plurality of multilayer capacitors, respectively; the first and second metal frames include first and second support portions, and first and second mounting portions, respectively; and the m first and second mounting portions include first and second portions opposing each other toward the center of the capacitor array, and third and fourth portions positioned outside the first and second portions, respectively, and a length of each of the first and second portions is shorter than a length of each of the third and fourth portions.