Abstract: An electronic component includes a multilayer capacitor including a capacitor body, and an external electrode disposed on an external surface of the capacitor body, an interposer including an interposer body, and an external terminals disposed on an external surface of the interposer body, and an encapsulation portion disposed to cover the multilayer capacitor. The external terminal includes a bonding portion disposed on a first surface of the interposer body to be electrically connected to the external electrode, a mounting portion disposed on a second surface of the interposer opposing the first surface, and a connection portion disposed on an end surface of the interposer to electrically connect the bonding portion to the mounting portion. A thickness of the encapsulation portion is within a range from 0.001 to 0.01 of a length of the electronic component.

Abstract: An electronic component includes: a multilayer ceramic capacitor including a capacitor body and a pair of external electrodes, and an interposer including an interposer body having grooves and a pair of external terminals. Each of the external terminals includes a bonding portion, a mounting portion and a connection portion; and ?L=|A-A?|/2 in which A is a distance from one end portion of the interposer in a length direction to one end portion of the multilayer ceramic capacitor in the length direction, A? is a distance from the other end portion of the interposer in the length direction to the other end portion of the multilayer ceramic capacitor in the length direction, and ?L is an offset between the multilayer ceramic capacitor and the interposer in the length direction, and ?L/L?0.100 in which L is a length of the multilayer ceramic capacitor.

Abstract: An electronic component includes a capacitor array including a plurality of multilayer capacitors; and first and second metal frames disposed on a side surface and another side surface of the capacitor array and electrically connected to first and second external electrodes, respectively, wherein the first metal frame includes a first support portion; a first mounting portion; and a first connection portion, the second metal frame includes a second support portion; a second mounting portion; and a second connection portion, and lengths of the first and second mounting portions in the first direction are smaller than a length of the capacitor array in the first direction.

Abstract: A multi-layered ceramic electronic component has a ceramic body including dielectric layers and a plurality of internal electrodes opposing each other with the dielectric layers interposed therebetween. External electrodes are disposed on an exterior of the ceramic body and are electrically connected to the internal electrodes. Each external electrode includes an electrode layer electrically connected to internal electrodes, and a conductive resin layer arranged on the electrode layer. The conductive resin layer extends to first and second surface of the ceramic body, and a ratio of a thickness (Tb) of the conductive resin layer extending onto the first surface and the second surface of the ceramic body to a length (Lm) of a length direction margin portion of the ceramic body satisfies 2 to 29%.

Abstract: An electronic component includes a body, a pair of external electrodes, disposed on both ends of the body in a first direction, respectively, containing at least one of copper and nickel, while not containing a noble metal, a pair of metal frames connected to the pair of external electrodes, respectively, and a pair of conductive bonding layers, disposed between the external electrode and the metal frame, respectively, containing the same metal component as the external electrode.

Abstract: An electronic component includes: a multilayer ceramic capacitor including a capacitor body and a pair of external electrodes, and an interposer including an interposer body having grooves and a pair of external terminals. Each of the external terminals includes a bonding portion, a mounting portion and a connection portion; and ?L=|A?A?|/2 in which A is a distance from one end portion of the interposer in a length direction to one end portion of the multilayer ceramic capacitor in the length direction, A? is a distance from the other end portion of the interposer in the length direction to the other end portion of the multilayer ceramic capacitor in the length direction, and ?L is an offset between the multilayer ceramic capacitor and the interposer in the length direction, and ?L/L?0.100 in which L is a length of the multilayer ceramic capacitor.

Abstract: An electronic component includes a capacitor array having a plurality of multilayer capacitors consecutively arranged in a first direction, the plurality of multilayer capacitors each comprising a body, and first and second external electrodes respectively comprising first and second head portions, and first and second band portions respectively extending from the first and second head portions to portions of upper and lower surfaces and portions of side surfaces of the body, a first metal frame coupled to the plurality of first band portions by binding the first band portions in belt form so as to be connected to the plurality of first external electrodes, and a second metal frame coupled to the plurality of second band portions by binding the second band portions in belt form so as to be connected to the plurality of second external electrodes.

Abstract: An image forming device includes a communication unit to transmit data to and receive data from an external device, an image forming job unit to perform printing, and a controller to control warming up of the image forming job unit to perform the printing, such that the image forming job unit performs the printing after the warming up is completed. The controller is to receive a print execution request to perform the printing and a predicted value of a print preparation time for the image forming device to create output image data, to perform the printing, from the external device via the communication unit, determine a warm-up start time of when to start the warming up of the image forming job unit by using the received predicted value of the print preparation time, and control the image forming job unit to start the warming up at the determined warm-up start time.

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes, first and second external electrodes disposed on first and second external surfaces of the ceramic body, and an interposer including an insulating body and first and second terminal electrodes. (B1+B2)/2 is greater than or equal to 10 micrometers (?m) and less than C/2, and C is greater than (B1+B2) and less than or equal to 80 ?m, in which B1 is a thickness of an upper portion, of each of the first and second terminal electrodes, disposed above the insulating body, B2 is a thickness of a lower portion, of each of the first and second terminal electrodes, disposed below the insulating body, and C is a thickness of the interposer.

Abstract: A ceramic electronic component includes a body including a dielectric layer, and a first internal electrode and a second internal electrode opposing each other with the dielectric layer interposed therebetween, and having first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other, a first external electrode including a first electrode layer connected to the first internal electrode, and a first conductive resin layer disposed on the first electrode layer, and disposed on the third surface of the body, and a second external electrode including a second electrode layer connected to the second internal electrode, and a second conductive resin layer disposed on the second electrode layer, and disposed on the fourth surface of the body.

Abstract: An electronic component includes a capacitor array including a plurality of multilayer capacitors; and first and second metal frames disposed on a side surface and another side surface of the capacitor array and electrically connected to first and second external electrodes, respectively, wherein the first metal frame includes a first support portion; a first mounting portion; and a first connection portion, the second metal frame includes a second support portion; a second mounting portion; and a second connection portion, and lengths of the first and second mounting portions in the first direction are smaller than a length of the capacitor array in the first direction.

Abstract: An electronic component includes a capacitor array including a plurality of multilayer capacitors; and first and second metal frames disposed on a side surface and another side surface of the capacitor array and electrically connected to first and second external electrodes, respectively, wherein the first metal frame includes a first support portion; a first mounting portion; and a first connection portion, the second metal frame includes a second support portion; a second mounting portion; and a second connection portion, and lengths of the first and second mounting portions in the first direction are smaller than a length of the capacitor array in the first direction.

Abstract: An electronic component includes a multilayer capacitor including a capacitor body, and an external electrode disposed on an external surface of the capacitor body, an interposer including an interposer body, and an external terminals disposed on an external surface of the interposer body, and an encapsulation portion disposed to cover the multilayer capacitor. The external terminal includes a bonding portion disposed on a first surface of the interposer body to be electrically connected to the external electrode, a mounting portion disposed on a second surface of the interposer opposing the first surface, and a connection portion disposed on an end surface of the interposer to electrically connect the bonding portion to the mounting portion. A thickness of the encapsulation portion is within a range from 0.001 to 0.01 of a length of the electronic component.

Abstract: An electronic component includes a body, external electrodes including head portions disposed on external surfaces of the body, and band portions extending from the head portions to top and bottom surfaces and both side surfaces of the body, respectively, each of the band portions including an extending portion disposed on at least one surface of the body extending beyond a band portion disposed on another surface of the body, and metal frames electrically connected to the pair of external electrodes, respectively. The metal frames includes support portions bonded to the head portions, mounting portions extending from ends of the support portions in a first direction and spaced apart from the body and the external electrodes, and bonding portions extending from the support portions to be bonded to the extending portions.

Abstract: An electronic component includes a multilayer capacitor comprising a capacitor body, and an external electrode disposed on an end of the capacitor body, and an interposer comprising an interposer body, and an external terminal disposed on an end of the interposer body. The external terminal includes a connection portion disposed on a first surface of the interposer body and connected to the external electrode, a mounting portion disposed on a second surface of the interposer body opposing the first surface, and a side connection portion disposed on the first and second surfaces and a side surface of the interposer to connect the connection portion and the mounting portion. The side connection portion includes a cutting portion.

Abstract: A multilayer ceramic electronic component array includes a plurality of multilayer ceramic electronic components including a ceramic body including a dielectric layer and first and second internal electrodes, and first and second external electrodes, respectively; and an interposer including an insulating body disposed below the plurality of multilayer ceramic electronic components, a first terminal electrode disposed on the insulating body and connected to at least a portion of the respective first external electrodes of the plurality of multilayer ceramic electronic components, and a second terminal electrode disposed on the insulating body and connected to at least a portion of the respective second external electrodes of the plurality of multilayer ceramic electronic components.

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes, first and second external electrode disposed on first and second external surfaces of the ceramic body to be electrically connected to the first and second internal electrodes, respectively, and an interposer including an insulating body having first and second recess regions and first and second terminal electrodes. The first and second recess regions are disposed in a central region of the insulating body in a width direction. A/B is within a range from 0.14 or more to 0.51 or less, where A is an area of each of the first and second recess regions, viewed in a cross-section in length and width directions, and B is an area of each of the first and second terminal electrodes, viewed in the cross-section in the length and width directions.

Abstract: An electronic component includes a multilayer capacitor including a capacitor body and an external electrode disposed at an end of the capacitor body, and an interposer including an interposer body and an external terminal disposed at an end of the interposer body. The external terminal includes a bonding portion disposed on a first surface of the interposer body and connected to the external electrode, a mounting portion disposed on a second surface of the interposer body opposing the first surface, and a connection portion disposed on an end surface of the interposer body to connect the bonding portion and the mounting portion and having an uneven surface, and a conductive bonding agent is disposed between the external electrode and the bonding portion of the external terminals, and an adhesive extends to a portion of the uneven surface.

Abstract: A multilayer ceramic electronic component array includes: a plurality of multilayer ceramic electronic components; a first terminal structure electrically connected to first external electrodes of each of the plurality of multilayer ceramic electronic components; a second terminal structure electrically connected to second external electrodes of each of the plurality of multilayer ceramic electronic components; a first conductive bonding member bonding the first external electrodes of each of the plurality of multilayer ceramic electronic components and the first terminal structure; a second conductive bonding member bonding the second external electrodes of each of the plurality of multilayer ceramic electronic components and the second terminal structure; and a ceramic bonding member contacting first surfaces of each of the ceramic bodies of each of the plurality of multilayer ceramic electronic components and disposed to extend to second surfaces of each of the ceramic bodies.

Abstract: An electronic component includes a body; first and second external electrodes including first and second connection portions and first and second band portions, respectively; and first and second metal frames connected to the first and second external electrodes, respectively, wherein the first and second metal frames include first and second support portions bonded to the first and second connection portions, and first and second mounting portions extended in the first direction from lower ends of the first and second support portions and spaced apart from the body and the first and second external electrodes, and further include first and second insulating layers formed on external surfaces of the first and second support portions.