Abstract: A preamble acquisition apparatus includes a first PN code generation unit for generating a first PN code having a bit string, a first correlation calculation unit for correlating a received frequency domain preamble signal with the first PN code within a first correlation range to generate a first correlation value, a first correlation value comparison unit for comparing the first correlation value with a first threshold value, a second PN code generation unit for generating a second PN code, a second correlation calculation unit for correlating the received frequency domain preamble signal with the second PN code within a second correlation range to generate a second correlation value, and a preamble acquisition determination unit for comparing the second correlation value with a second threshold value to determine whether to acquire the preamble. The bit values of the first PN code are located in the second PN code.

Abstract: A microelectronic device chip including a hybrid Au bump in which foreign materials are not generated in a probe tip in an electrical die sorting (EDS) test is provided. The microelectronic device chip includes a chip pad which is connected to a microelectronic device formed on a substrate and on which the microelectronic device is brought into electrical contact with the outside of the chip. Further, the microelectronic device chip includes a bump which is formed on the chip pad and made up of a composite layer including two or more layers.

Abstract: A bump may be formed by forming a diffusion barrier layer pattern over a substrate having a conductive pad; forming a seed layer over the substrate having the diffusion barrier layer pattern and the conductive pad; forming a conductive bump over the seed layer; and patterning the seed layer using the conductive bump as an etching mask.

Abstract: A semiconductor chip includes a plurality of chip pads and a plurality of bumps formed on respective chip pads, each bumps including a bump main body and a conductive particle disposed on the bump main body and exposed to the air, the conductive particle including an elastic portion made of an elastic material and a conductive layer enclosing the elastic portion.

Abstract: Disclosed herein are a method and apparatus for acquiring a code group in an asynchronous Wideband Code Division Multiple Access (WCDMA) system. A primary synchronization channel search unit achieves primary synchronization channel slot timing synchronization. Then, the 1-1 search unit and 1-2 search unit of a secondary synchronization channel receive secondary synchronization channels from first and second antennas, respectively, start correlation operations between some of the slots of the received channels and code group candidates, and transmit information about candidates having values exceeding a predetermined threshold value to a determination unit. The determination unit transmits the received information about candidates to a second search unit of the secondary synchronization channel.

Abstract: A microelectronic device chip including a hybrid Au bump in which foreign materials are not generated in a probe tip in an electrical die sorting (EDS) test is provided. The microelectronic device chip includes a chip pad which is connected to a microelectronic device formed on a substrate and on which the microelectronic device is brought into electrical contact with the outside of the chip. Further, the microelectronic device chip includes a bump which is formed on the chip pad and made up of a composite layer including two or more layers.