Abstract: The present disclosure relates to a flexible display device case that is mounted to a flexible display device including a first body and a second body configured to be movable relative to the first body, and including a first member mounted to the first body to surround a side surface portion of the first body, and a second member mounted to the second body to surround a side surface portion of the second body, wherein an area overlapped by the first member and the second member changes as the first body and the second body move relative to each other.

Abstract: A semiconductor device includes a second insulating layer disposed on a substrate and that includes a first trench that extends in a first direction, a first via disposed in the first hole, a first interconnection layer disposed in the first trench on the first via and that has an upwardly upper region, and a third insulating layer disposed on the second insulating layer and that includes a second hole and a second trench connected to the second hole. The first trench has inclined side surfaces such that a width of the first trench increases in a direction toward the substrate, the second hole has inclined side surfaces such that a width of the second hole decreases in the direction toward the substrate, and a lower portion of the second hole is wider than an upper surface of the first interconnection layer.

Abstract: A metal powder is an ensemble of fine metal particles. The fine metal particles include fine layered metal particles (2). Each of the fine layered metal particles (2) includes a center layer (4), an upper middle layer (6), an upper end layer (8), a lower middle layer (10), and a lower end layer (12). Each of the layers is a flake. The flakes belong to the same crystal. There is a space S1 between the center layer (4) and the upper middle layer (6). There is a space S2 between the upper middle layer (6) and the upper end layer (8). There is a space S3 between the center layer (4) and the lower middle layer (10). There is a space S4 between the lower middle layer (10) and the lower end layer (12).

Abstract: A semiconductor device includes active regions on a substrate, a gate structure intersecting the active regions, a source/drain region on the active regions and at a side surface of the gate structure, a gate spacer between the gate structure and the source/drain region, the gate spacer contacting the side surface of the gate structure, a lower source/drain contact plug connected to the source/drain region, a gate isolation layer on the gate spacer, an upper end of the gate isolation layer being at a higher level than an upper surface of the gate structure and an upper surface of the lower source/drain contact plug, a capping layer covering the gate structure, the lower source/drain contact plug, and the gate isolation layer, and an upper source/drain contact plug connected to the lower source/drain contact plug and extending through the capping layer.

Abstract: A transmission device for a vehicle includes a vehicle state detector for detecting a vehicle state, the vehicle state including a first state which indicates that an ignition of the vehicle is off, and a second state which indicates that the ignition of the vehicle is on, a transmission operation unit that includes a fixed unit provided in a column of a steering wheel for enabling a transmission operation and a movable unit configured to be switched between a first position and a second position with respect to the fixed unit, and a position adjusting unit for adjusting a position of the movable unit based on the detected vehicle state.

Abstract: An integrated circuit (IC) device including a fin-type active region on a substrate and a gate line on the fin-type active and having a first uppermost surface at a first vertical level, an insulating spacer covering a sidewall of the gate line and having a second uppermost surface at the first vertical level, and an insulating guide film covering the second uppermost surface of the insulating spacer may be provided. The gate line may include a multilayered conductive film structure that includes a plurality of conductive patterns and have a top surface defined by the conductive patterns, which includes at least first and second conductive patterns including different materials from each other and a unified conductive pattern that is in contact with a top surface of each of the conductive patterns and has a top surface that defines the first uppermost surface.

Abstract: A semiconductor device has a substrate and two semiconductor die disposed over the substrate. A thermal interface material is disposed over the semiconductor die. A conductive epoxy is disposed on a ground pad of the substrate. A lid is disposed over the semiconductor die. The lid includes a sidewall over the ground pad between the semiconductor die. The lid physically contacts the conductive epoxy and thermal interface material.

Abstract: A semiconductor device includes a substrate including an active pattern, a first interlayer dielectric layer on the substrate, the first interlayer dielectric layer including a recess on an upper portion thereof, and a lower connection line in the first interlayer dielectric layer, the lower connection line being electrically connected to the active pattern, and the lower connection line including a conductive pattern, the recess of the first interlayer dielectric layer selectively exposing a top surface of the conductive pattern, and a barrier pattern between the conductive pattern and the first interlayer dielectric layer, the first interlayer dielectric layer covering a top surface of the barrier pattern.

Abstract: A manufacturing method of a display apparatus includes forming a display layer on a substrate; forming an opening by irradiating laser onto the display layer; and sealing the display layer formed on the substrate. The laser is irradiated according to a spiral movement path, and the opening is formed by irradiating the laser at least twice at the same location.

Abstract: A thin film structure including a dielectric material layer and an electronic device to which the thin film structure is applied are provided. The dielectric material layer includes a compound expressed by ABO3, wherein at least one of A and B in ABO3 is substituted and doped with another atom having a larger atom radius, and ABO3 becomes A1-xA?xB1-yB?yO3 (where x>=0, y>=0, at least one of x and y?0, a dopant A? has an atom radius greater than A and/or a dopant B? has an atom radius greater than B) through substitution and doping. A dielectric material property of the dielectric material layer varies according to a type of a substituted and doped dopant and a substitution doping concentration.

Abstract: An integrated circuit device according to the inventive concepts includes lower wiring structures formed on a substrate, an air gap arranged between the lower wiring structures, a capping layer covering an upper surface of the air gap, an etch stop layer conformally covering an upper surfaces of the lower wiring structures and the capping layer and having a protrusion and recess structure, an insulating layer covering the etch stop layer, and an upper wiring structure penetrating the insulating layer and connected to the upper surface of the lower wiring structure not covered with the etch stop layer, wherein the upper wiring structure covers a portion of an upper surface of the capping layer, and a level of the upper surface of the capping layer is higher than a level of the upper surface of the lower wiring structures.

Abstract: A semiconductor device includes a substrate including an active pattern, a first interlayer dielectric layer on the substrate, the first interlayer dielectric layer including a recess on an upper portion thereof, and a lower connection line in the first interlayer dielectric layer, the lower connection line being electrically connected to the active pattern, and the lower connection line including a conductive pattern, the recess of the first interlayer dielectric layer selectively exposing a top surface of the conductive pattern, and a barrier pattern between the conductive pattern and the first interlayer dielectric layer, the first interlayer dielectric layer covering a top surface of the barrier pattern.

Abstract: In a mobile terminal of the present disclosure, the open portion of an extended part is covered when a state is changed to a second state so that the inside of the mobile terminal can be protected, the mobile terminal comprising: a first frame; a second frame moved in a first direction from the first frame so as to change from a first state to the second state a central bracket rotatably coupled to one side of the first frame or the second frame; and a spiral spring having an inner end portion fixed to the central bracket, and an outer end portion fixed to the other side of the first frame or the second frame, wherein the spiral spring is spirally wound in the first state and unwound in the second state.

Abstract: A mobile terminal according to an embodiment may comprise: a first frame; a second frame which comprises a third rear part provided on the rear surface of the first frame and movable in a first direction and a first roller provided at the end of the third rear part in the first direction; a flexible display panel which is provided to surround the first roller; a driving part for driving the second frame in the first direction or a second direction opposite to the first direction from the first frame; and a side cover which comprises a first plate extending in the second direction from both sides of the first roller and a second plate moving forward and backward on the first plate.

Abstract: A thin film structure including a dielectric material layer and an electronic device to which the thin film structure is applied are provided. The dielectric material layer includes a compound expressed by ABO3, wherein at least one of A and B in ABO3 is substituted and doped with another atom having a larger atom radius, and ABO3 becomes A1-xA?xB1-yB?yO3 (where x>=0, y>=0, at least one of x and y?0, a dopant A? has an atom radius greater than A and/or a dopant B? has an atom radius greater than B) through substitution and doping. A dielectric material property of the dielectric material layer varies according to a type of a substituted and doped dopant and a substitution doping concentration.

Abstract: A semiconductor integrated circuit device includes a substrate; a transistor on the substrate; an interlayer insulating film on the transistor; an insulating liner on the interlayer insulating film; a first insulating film on the insulating liner; and a first wiring layer on the interlayer insulating film and surrounded by the insulating liner. A height of a top surface of the first insulating film in a vertical direction from a main surface of the interlayer insulating film is different than a height of a top surface of the first wiring layer in the vertical direction. A step exists between the top surfaces of the first wiring layer and the first insulating film. A height of the first insulating film is greater than a height of the first wiring layer. A width of the first wiring layer gradually narrows as the first wiring layer extends upwards along the vertical direction.

Abstract: An integrated circuit device according to the inventive concepts includes lower wiring structures formed on a substrate, an air gap arranged between the lower wiring structures, a capping layer covering an upper surface of the air gap, an etch stop layer conformally covering an upper surfaces of the lower wiring structures and the capping layer and having a protrusion and recess structure, an insulating layer covering the etch stop layer, and an upper wiring structure penetrating the insulating layer and connected to the upper surface of the lower wiring structure not covered with the etch stop layer, wherein the upper wiring structure covers a portion of an upper surface of the capping layer, and a level of the upper surface of the capping layer is higher than a level of the upper surface of the lower wiring structures.

Abstract: A semiconductor device includes active regions on a substrate, a gate structure intersecting the active regions, a source/drain region on the active regions and at a side surface of the gate structure, a gate spacer between the gate structure and the source/drain region, the gate spacer contacting the side surface of the gate structure, a lower source/drain contact plug connected to the source/drain region, a gate isolation layer on the gate spacer, an upper end of the gate isolation layer being at a higher level than an upper surface of the gate structure and an upper surface of the lower source/drain contact plug, a capping layer covering the gate structure, the lower source/drain contact plug, and the gate isolation layer, and an upper source/drain contact plug connected to the lower source/drain contact plug and extending through the capping layer.

Abstract: A semiconductor device includes a second insulating layer disposed on a substrate and that includes a first trench that extends in a first direction, a first via disposed in the first hole, a first interconnection layer disposed in the first trench on the first via and that has an upwardly upper region, and a third insulating layer disposed on the second insulating layer and that includes a second hole and a second trench connected to the second hole. The first trench has inclined side surfaces such that a width of the first trench increases in a direction toward the substrate, the second hole has inclined side surfaces such that a width of the second hole decreases in the direction toward the substrate, and a lower portion of the second hole is wider than an upper surface of the first interconnection layer.

Abstract: Provided is a method of forming an interconnect structure. The method includes preparing a substrate including a first metal layer and a first insulating layer, selectively forming a carbon layer having an sp2 bonding structure on the first metal layer, selectively forming a second insulating layer on the first insulating layer, forming a third insulating layer to cover the second insulating layer, and forming a second metal layer electrically connected to the first metal layer.