Patents by Inventor Woon-bae Kim

Woon-bae Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200303276
    Abstract: A chip on film package includes; a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.
    Type: Application
    Filed: November 4, 2019
    Publication date: September 24, 2020
    Inventors: Seung-Tae Hwang, Jae-Choon Kim, Kyung-Suk Oh, Woon-Bae Kim, Jae-Min Jung
  • Publication number: 20200235091
    Abstract: An integrated circuit chip includes a circuit structure, a grounding structure, a bonding layer between the circuit structure and the grounding structure. The circuit structure includes a first substrate, an FEOL structure, and a BEOL structure. The grounding structure includes a second substrate and a grounding conductive layer. The integrated circuit chip includes a first penetrating electrode portion connected to the grounding conductive layer based on extending through the first substrate, the FEOL structure, the BEOL structure, and the bonding layer such that the first penetrating electrode portion is isolated from direct contact with the integrated circuit portion in a horizontal direction extending parallel to an active surface of the first substrate. An integrated circuit package and a display device each include the integrated circuit chip.
    Type: Application
    Filed: October 1, 2019
    Publication date: July 23, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: JUNG-GU KANG, Young-mok Kim, Woon-bae Kim, Dae-cheol Seong, Yune-seok Chung
  • Publication number: 20200227359
    Abstract: An integrated circuit chip includes an SOI substrate having a structure in which a bulk substrate, a buried insulating film, and a semiconductor body layer are sequentially stacked, a conductive ion implantation region formed at a position adjacent to the buried insulating film in the bulk substrate, an integrated circuit portion formed on an active surface of the semiconductor body layer, and a penetrating electrode portion arranged at a position spaced apart from the integrated circuit portion in a horizontal direction, the penetrating electrode portion penetrating the semiconductor body layer and the buried insulating layer in a vertical direction, and the penetrating electrode portion connected to the conductive ion implantation region. An integrated circuit package and a display device include the integrated circuit chip.
    Type: Application
    Filed: October 1, 2019
    Publication date: July 16, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jun-gu KANG, Young-mok KIM, Woon-bae KIM, Dae-cheol SEONG, Yune-seok CHUNG
  • Publication number: 20190304941
    Abstract: A film-type semiconductor package includes a metal lead portion arranged on a film substrate, a semiconductor chip including a pad, and a bump connecting the metal lead portion to the pad of the semiconductor chip. The bump includes a metal pillar arranged on the pad and including a first metal and a soldering portion arranged on an entire surface of the metal pillar, bonded to the metal lead portion, and including the first metal and a second metal that is different from the first metal.
    Type: Application
    Filed: June 20, 2019
    Publication date: October 3, 2019
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jung-woo KIM, Woon-bae KIM, Bo-in NOH, Go-woon SEONG, Ji-yong PARK
  • Patent number: 10349835
    Abstract: Provided are an optical switch, an optical probe including the optical switch, and a medical imaging apparatus including the optical probe. The optical probe includes a probe body that is configured to be insertable into a body cavity, and an optical switch that is disposed in the probe body and includes a first region formed of a material having a first refractive index, and a second region that forms an interface with the first region and is configured to have a fluid is introduced into the second region, wherein the optical switch is configured to change a path of propagation of incident light according to a second refractive index of the second region.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: July 16, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung-wan Lee, Woon-bae Kim, Eun-sung Lee, Jong-hyeon Chang, Min-seog Choi, Hyun Choi
  • Patent number: 10354967
    Abstract: A film-type semiconductor package includes a metal lead portion arranged on a film substrate, a semiconductor chip including a pad, and a bump connecting the metal lead portion to the pad of the semiconductor chip. The bump includes a metal pillar arranged on the pad and including a first metal and a soldering portion arranged on an entire surface of the metal pillar, bonded to the metal lead portion, and including the first metal and a second metal that is different from the first metal.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: July 16, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung-woo Kim, Woon-bae Kim, Bo-in Noh, Go-woon Seong, Ji-yong Park
  • Patent number: 10251559
    Abstract: Laser-induced ultrasonic wave apparatuses and methods of generating images using the same. The laser-induced ultrasonic wave apparatus includes a laser source which irradiates a laser beam to a target object and a thermoelastic material; a thermoelastic material which converts the laser beam to a first ultrasonic wave and irradiates the first ultrasonic wave to the target object; and a receiving unit which receives an echo acoustic wave of the first ultrasonic wave and receives a second ultrasonic wave generated by the target object due to the laser beam.
    Type: Grant
    Filed: May 3, 2013
    Date of Patent: April 9, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-chan Kang, Woon-bae Kim, Jong-seok Kim, Yong-seop Yoon
  • Patent number: 10134667
    Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: November 20, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung-woo Kim, Jae-min Jung, Ji-yong Park, Jeong-kyu Ha, Woon-bae Kim
  • Patent number: 10105102
    Abstract: Provided is a body-implantable package for processing biosensed-data for wireless communication to an external device. The package includes a tube closed by a cover, therein, a chip with a strained layer affixed thereto to form a flexible laminar circuit. The cover is fitted over an open end of the tube after the laminated chip and strained layer are inserted therein. The chip is constructed of and rolled in one or more turns into a generally cylindrical shape. The strained layer is affixed to a surface of the chip automatically to cause the flexible laminar circuit to curl into a generally cylindrical shape to fit within the tube.
    Type: Grant
    Filed: May 4, 2015
    Date of Patent: October 23, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Mitsuo Umemoto, Yung-Cheol Kong, Woon-Bae Kim, Pyoung-Wan Kim, Kyong-Soon Cho
  • Patent number: 10078160
    Abstract: A variable liquid lens system is provided. The variable liquid lens system includes a lens barrel comprising a wall and first and second ends, wherein the first and second ends are substantially transparent, at least one liquid lens disposed in the lens barrel and contacting the wall, the at least one liquid lens comprising a droplet, and a plurality of spaces containing fluid positioned on opposite sides of the at least one liquid lens inside the lens barrel. A plurality of first holes are provided in the wall at a position corresponding to the plurality of spaces. The at least one liquid lens is configured so that a position of the at least one liquid lens within the lens barrel is adjustable by adjusting amounts of the fluid contained in the plurality of spaces via the plurality of first holes.
    Type: Grant
    Filed: October 1, 2014
    Date of Patent: September 18, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun-sung Lee, Woon-bae Kim, Seung-wan Lee, Jong-hyeon Chang, Min-seog Choi
  • Publication number: 20180247882
    Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.
    Type: Application
    Filed: April 27, 2018
    Publication date: August 30, 2018
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung-woo Kim, Jae-min Jung, Ji-yong Park, Jeong-kyu Ha, Woon-bae Kim
  • Patent number: 9978674
    Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: May 22, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung-woo Kim, Jae-min Jung, Ji-yong Park, Jeong-kyu Ha, Woon-bae Kim
  • Publication number: 20180090459
    Abstract: A film-type semiconductor package includes a metal lead portion arranged on a film substrate, a semiconductor chip including a pad, and a bump connecting the metal lead portion to the pad of the semiconductor chip. The bump includes a metal pillar arranged on the pad and including a first metal and a soldering portion arranged on an entire surface of the metal pillar, bonded to the metal lead portion, and including the first metal and a second metal that is different from the first metal.
    Type: Application
    Filed: March 13, 2017
    Publication date: March 29, 2018
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jung-woo KIM, Woon-bae KIM, Bo-in NOH, Go-woon SEONG, Ji-yong PARK
  • Patent number: 9880381
    Abstract: A varifocal-type optical scanning probe including an optical fiber scanner and a varifocal lens is provided. The varifocal lens includes: a first membrane lens comprising a first lens surface with a variable curvature and a first pressure surface configured to induce a curvature variation of the first lens surface; a second membrane lens including a second lens surface with a variable curvature and a second pressure surface configured to induce a curvature variation of the second lens surface; a first pressure member disposed to apply a pressure to the first pressure surface; a second pressure member disposed to apply a pressure to the second pressure surface; and a motor configured to transmit a driving force to at least one of the first pressure member and the second pressure member.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: January 30, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Woon-bae Kim, Seung-wan Lee, Eun-sung Lee, Min-seog Choi
  • Patent number: 9870100
    Abstract: A multi-touch sensing apparatus using a rear view camera of an array type is provided. The multi-touch sensing apparatus may include a display panel to display an image, a sensing light source to emit light to sense a touch image which is generated by an object and displayed on a back side of the display panel, and a camera to divide and sense the touch image. The camera may be arranged in an edge of a lower side of the multi-touch sensing apparatus, or a mirror to reflect the touch image may be included in the multi-touch sensing apparatus.
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: January 16, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kwon Ju Yi, Chang Kyu Choi, Jae Joon Han, Du-Sik Park, Woon Bae Kim, Jong Oh Kwon
  • Publication number: 20180012069
    Abstract: At least some example embodiments provide a fingerprint sensor, a fingerprint sensor package, and a fingerprint sensing system using light sources of a display panel. The fingerprint sensor includes an image sensor including a plurality of sensor pixels, the sensor pixels configured to sense light reflected by a fingerprint and generate image information corresponding to the fingerprint and a pinhole mask defining a plurality of pinholes, wherein each of the pinholes forms a focus for transmitting the light reflected by the fingerprint to the image sensor, wherein light is emitted from a plurality of organic light-emitting diodes (OLEDs) and is reflected by the fingerprint.
    Type: Application
    Filed: June 30, 2017
    Publication date: January 11, 2018
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Dae-young Chung, Hee-chang Hwang, Kun-yong Yoon, Woon-bae Kim, Bum-suk Kim, Min Jang, Min-chul Lee, Jung-woo Kim
  • Patent number: 9837361
    Abstract: A semiconductor package including a semiconductor chip having an active surface and a non-active surface opposite to the active surface, a ground member disposed on the active surface of the semiconductor chip, and an electromagnetic shielding member passing through the semiconductor chip, electrically connected to the ground member, and covering at least some regions of the non-active surface of the semiconductor chip may be provided.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: December 5, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byoung-rim Seo, Woon-bae Kim, Young-doo Jung
  • Publication number: 20170287814
    Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.
    Type: Application
    Filed: April 5, 2017
    Publication date: October 5, 2017
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung-woo KIM, Jae-min JUNG, Ji-yong PARK, Jeong-kyu HA, Woon-bae KIM
  • Patent number: 9717476
    Abstract: The probe includes a probe body that includes an internal empty space and is configured to be inserted into a coelom; an energy source module that is disposed in the probe body, and configured to emit an energy beam; first and second view windows that are provided at an end portion of the probe body, have different fields of view, and are configured to transmit the emitted energy beam; and a path changing unit that is disposed in the probe body, and configured to change a traveling path of the emitted energy beam to travel to one of the first view window and the second view window.
    Type: Grant
    Filed: November 7, 2014
    Date of Patent: August 1, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Woon-bae Kim, Woo-young Jang, Min-seog Choi
  • Patent number: 9664894
    Abstract: A micro optical switch device, an image display apparatus including the same, and a method of manufacturing the micro optical switch device are provided. The micro optical switch device includes a substrate; a first electrode disposed on the substrate and having a plurality of openings; a second electrode disposed above and spaced apart from the first electrode, and having a plurality of openings; and support units disposed on the substrate and configured to support the second electrode, wherein the support units include deformation preventing portions protruding beyond a top surface of the second electrode.
    Type: Grant
    Filed: November 13, 2013
    Date of Patent: May 30, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-sik Shim, Woon-bae Kim, Hyung Choi