Patents by Inventor Woon-bae Kim

Woon-bae Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120027397
    Abstract: A micro shutter with an iris function includes a base plate with a transparent portion formed in a circular shape corresponding to an image sensor which allows light to pass through; a plurality of rollup blades which block the light, arranged in a regular polygon at a circumference of the transparent portion on the base plate to cover the transparent portion, and each of the plurality of rollup blades to have a fixing portion fixed to the base plate and a moving portion rolled up toward the fixing portion; and a controller electrically connected with the base plate and the plurality of rollup blades which controls unrolling degrees of the plurality of rollup blades.
    Type: Application
    Filed: October 11, 2011
    Publication date: February 2, 2012
    Applicants: SAMSUNG ELECTRO MECHANICS CO., LTD, SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Che-heung KIM, Woon-bae KIM, Jong-oh KWON, Kyu-Dong JUNG
  • Publication number: 20120007815
    Abstract: A multipurpose sensing apparatus and electronic equipment are provided. The sensing apparatus includes planar type compound eyes, each planar type compound eye including ommatidium arranged in a circular arc such that each ommatidium views a contact surface; three-dimensional (3D) compound eyes, each 3D compound eye including ommatidium arranged in an array such that each ommatidium views an area in front of the contact surface; and an image signal processor that is configured to determine a touch position on the contact surface based on image signals transmitted from the planar type compound eyes, and to recognize a motion of an object existing in front of the contact surface based on image signals transmitted from the 3D compound eyes.
    Type: Application
    Filed: February 25, 2011
    Publication date: January 12, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Woon-bae KIM, Min-Seog CHOI, Eun-Sung LEE, Kyu-Dong JUNG
  • Publication number: 20120002096
    Abstract: An imaging device with a plurality of imaging units is provided. The imaging device includes a supporting substrate, a flexible substrate and a movable unit. The supporting substrate is formed with a hard material, and the flexible substrate includes a plurality of imaging units positioned at least in a width direction. The flexible substrate is fixed at a first edge portion with the supporting substrate, while an opposite second edge portion of the flexible substrate is connected with the movable unit. The movable unit moves the opposite second edge portion of the flexible substrate in the width direction and bends or flattens the flexible substrate. A degree of curvature at which the flexible substrate is bent may vary based on a distance by which the movable unit moves in the width direction, so that a field of view (FOV) of the plurality of imaging units may be adjusted.
    Type: Application
    Filed: February 22, 2011
    Publication date: January 5, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Min-Seog CHOI, Woon-Bae KIM, Eun-Sung LEE, Kyu-Dong JUNG
  • Patent number: 8061910
    Abstract: A micro shutter with an iris function includes a base plate with a transparent portion formed in a circular shape corresponding to an image sensor which allows light to pass through; a plurality of rollup blades which block the light, arranged in a regular polygon at a circumference of the transparent portion on the base plate to cover the transparent portion, and each of the plurality of rollup blades to have a fixing portion fixed to the base plate and a moving portion rolled up toward the fixing portion; and a controller electrically connected with the base plate and the plurality of rollup blades which controls unrolling degrees of the plurality of rollup blades.
    Type: Grant
    Filed: June 6, 2008
    Date of Patent: November 22, 2011
    Assignees: Samsung Electronics Co., Ltd., Samsung Electro Mechanics Co., Ltd.
    Inventors: Che-heung Kim, Woon-bae Kim, Jong-oh Kwon, Kyu-dong Jung
  • Patent number: 8045318
    Abstract: A tunable capacitor using an electrowetting phenomenon includes a first electrode; a second electrode which is spaced apart from the first electrode and faces the first electrode; a fluidic channel which is disposed between the first electrode and the second electrode; a first insulating layer which is disposed between the first electrode and the fluidic channel; and a conductive fluid which is disposed in the fluidic channel and moves along the fluidic channel when a direct current (DC) potential difference occurs between the first and second electrodes. Accordingly, it is possible to fabricate the tunable capacitor with the simplified fabrication process, good reliability and durability, and no restriction on the tuning range.
    Type: Grant
    Filed: January 6, 2010
    Date of Patent: October 25, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung-tae Choi, Ji-hyuk Lim, Woon-bae Kim, Eun-seok Park, Jeong-yub Lee
  • Patent number: 7986466
    Abstract: A varifocal lens includes a hollow case having first and second sidewalls facing each other, the first and second sidewalls through which a light passes; at least one light transmission membrane partitioning an inner space of the case into at least two liquid chambers, the at least one light transmission membrane through which a light passes; at least two liquids filled in the at least two liquid chambers; at least one first operating hole formed at the first sidewall; a first actuator disposed to cover the at least one first operating hole and to pressurize the liquid contacting the first sidewall; and a controller configured to control the first actuator to change a focal distance of an optical lens consisting of the first and second sidewalls, the at least two liquids, and the at least one light transmission membrane of the case.
    Type: Grant
    Filed: April 22, 2008
    Date of Patent: July 26, 2011
    Assignee: Samsung Electro Mechanics Co., Ltd
    Inventors: Seung-wan Lee, Jeong-yub Lee, Woon-bae Kim, Seung-tae Choi
  • Patent number: 7963021
    Abstract: An inductor embedded in a substrate, including a substrate, a coil electrode formed by filling a metal in a spiral hole formed on the substrate, an insulation layer formed on the substrate, and an external connection pad formed on the insulation layer to be connected to the coil electrode. The inductor-embedded substrate can be used as a cap for a micro device package by forming a cavity on its bottom surface.
    Type: Grant
    Filed: February 8, 2008
    Date of Patent: June 21, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Moon-chul Lee, Jong-oh Kwon, Woon-bae Kim, Jea-shik Shin, Jun-sik Hwang, Eun-sung Lee
  • Publication number: 20110134303
    Abstract: An image pickup device and a manufacturing method thereof are disclosed. The image pickup device includes a printed circuit board (PCB), an image sensor module, an optical lens module, a fluidic lens module, and a shutter module. The image sensor module is disposed over the printed circuit board and electrically connected to interconnection pads on the PCB. The optical lens module is disposed over the image sensor module and includes one or more lenses. The fluidic lens module is disposed over the optical lens module, has a variable focus and is electrically connected to interconnection pads on the PCB. The shutter module is disposed over the fluidic lens module, and is electrically connected to remaining interconnection pads on the PCB. The fluidic lens module and the shutter module may be connected to the interconnection pads through bumped plate springs.
    Type: Application
    Filed: May 19, 2010
    Publication date: June 9, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyu-dong JUNG, Woon-bae KIM, Min-seog CHOI
  • Patent number: 7923793
    Abstract: An image sensor module having a sensor chip closely adhered on a concave surface and a fabrication method thereof are disclosed. The image sensor module includes at least one sensor chip, at least one sensor chip-mounting structure comprising a substrate and a polymer layer formed on the substrate, the polymer layer having an concave surface formed on an upper part thereof by a polymer molding method, so that the sensor chip is bent and bonded on the concave surface, and at least one lens fixed on the at least one sensor chip-mounting structure above the sensor chip.
    Type: Grant
    Filed: May 13, 2008
    Date of Patent: April 12, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min-seog Choi, Seung-wan Lee, Woon-bae Kim, Eun-sung Lee, Kyu-dong Jung, Che-heung Kim
  • Publication number: 20110069216
    Abstract: A wafer-level lens module with an extended depth of field (EDF) and an imaging device including the wafer-level lens module are provided. The wafer-level EDF lens module includes a plurality of wafer-scale lenses stacked with fixed distances therebetween. The plurality of wafer-scale lenses includes an effective lens having a profile which satisfies a corrected optimized aspheric function, wherein a profile of a center region of the effective lens is optimized for an infinity-focused image and a profile of an edge region of the effective lens is optimized for a macro-focused image.
    Type: Application
    Filed: September 1, 2010
    Publication date: March 24, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung-Wan LEE, Woon-Bae KIM, Jeong-Yub LEE
  • Patent number: 7906841
    Abstract: A wafer level encapsulation chip and an encapsulation chip manufacturing method. The encapsulation chip includes a device substrate, a circuit module mounted on the device substrate, a bonding layer deposited on a predetermined area of the device substrate, a protection cap forming a cavity over the circuit module and bonded to the device substrate by the bonding layer and encapsulation portions formed on predetermined areas of the bonding layer and the protection cap. Thus, the present invention can minimize damages to a chip upon chip handling and prevent moisture from being introduced into the inside of the chip.
    Type: Grant
    Filed: June 7, 2006
    Date of Patent: March 15, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byung-gil Jeong, In-sang Song, Woon-bae Kim, Min-seog Choi, Suk-jin Ham, Ji-hyuk Lim
  • Publication number: 20100315381
    Abstract: A multi-touch sensing apparatus using a rear view camera of an array type is provided. The multi-touch sensing apparatus may include a display panel to display an image, a sensing light source to emit light to sense a touch image which is generated by an object and displayed on a back side of the display panel, and a camera to divide and sense the touch image. The camera may be arranged in an edge of a lower side of the multi-touch sensing apparatus, or a mirror to reflect the touch image may be included in the multi-touch sensing apparatus.
    Type: Application
    Filed: June 16, 2010
    Publication date: December 16, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kwon Ju YI, Chang Kyu Choi, Jae Joon Han, Du-Sik Park, Woon Bae Kim, Jong Oh Kwon
  • Publication number: 20100283763
    Abstract: A multi-sensing touch panel and a display apparatus using the same are provided. The multi-sensing touch panel includes: a touch pad including an input surface; at least one infrared ray source which irradiates infrared rays to the touch pad; and a camera array including a plurality of infrared ray cameras which are disposed below the touch pad and inclined with respect to a plane of the input surface.
    Type: Application
    Filed: January 15, 2010
    Publication date: November 11, 2010
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Woon-bae KIM, Jong-oh KWON, Seung-wan LEE, Du-sik PARK, Min-seog CHOI, Chang-kyu CHOI
  • Patent number: 7794799
    Abstract: A method for manufacturing an array plate for biomolecules includes coating a surface of a substrate with a hydrophobic material to form a hydrophobic layer having initial hydrophobic properties, etching the hydrophobic layer through an etch mask placed thereon to form a hydrophilic binding site, removing the etch mask, and processing the remaining region of the hydrophobic layer to recover the initial hydrophobic properties. A method for manufacturing a biochip using this array plate, includes processing the surface of the hydrophilic binding site of the array plate to increase an affinity of biomolecules to the hydrophilic binding site, and applying a solution containing biomolecules to the surface of the hydrophilic binding site.
    Type: Grant
    Filed: May 15, 2003
    Date of Patent: September 14, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Woon-bae Kim, Chang-ho Cho, Kae-dong Back, Hwan-young Choi
  • Patent number: 7786573
    Abstract: A packaging chip formed with plural wafers. The packaging chip includes plural wafers stacked in order and plural interconnection electrodes directly connecting the plural wafers from an upper surface of an uppermost wafer of the plural wafers to the other wafers. At least one or more of the plural wafers mounts a predetermined circuit device thereon. Further, at least one or more wafers of the plural wafers have a cavity of a predetermined size. Meanwhile, the packaging chip further includes plural pads independently arranged on the upper surface of the uppermost wafer one another and electrically connected to the plural interconnection electrodes respectively. Accordingly, the present invention can enhance the performance and reliability of a packaging chip and improve fabrication yield.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: August 31, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min-seog Choi, Kae-dong Back, In-sang Song, Woon-bae Kim, Byung-gil Jeong, Kyu-dong Jung
  • Patent number: 7755151
    Abstract: A wafer level package for a surface acoustic wave device and a fabrication method thereof include a SAW device formed with a SAW element on an upper surface of a device wafer; a cap wafer joined on an upper part of the SAW element; a cavity part housing the SAW element between the cap wafer and the SAW device; a cap pad formed on an upper surface of the cap wafer; and a metal line formed to penetrate through the cap wafer to electrically connect the cap pad and the SAW element, the device wafer and the cap wafer being made of the same materials.
    Type: Grant
    Filed: May 2, 2006
    Date of Patent: July 13, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ji-hyuk Lim, Jun-sik Hwang, Woon-bae Kim, Suk-jin Ham, Jong-oh Kwon, Moon-chul Lee, Chang-youl Moon
  • Publication number: 20100165475
    Abstract: Varifocal lens for camera module incorporated in wireless mobile communication device is provided. The varifocal lens includes: a membrane; a frame which is fixed to the membrane and has a receiving hole formed in the middle; a transparent substrate which is fixed to the frame to seal optical fluid received in the receiving hole; one or more actuators to change a curvature of a fluid lens part by bending the circumference of the fluid lens part formed around a central portion of the receiving hole; and a restriction lessening member which is adapted to lessen a restrictive force of an edge of the fluid lens part, is made of a transparent material, has with an area smaller than the fluid lens part to correspond to an inner side of the fluid lens part except the edge of the fluid lens part, and has a larger Young's modulus than the membrane.
    Type: Application
    Filed: August 17, 2009
    Publication date: July 1, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD
    Inventors: Jeong-yub Lee, Seung-wan Lee, Woon-bae Kim, Seung-tae Choi
  • Patent number: 7719167
    Abstract: An electroactive polymer actuator and a method for manufacturing the electroactive polymer actuator are provided. The electroactive polymer actuator includes an actuator unit which is a laminate of a plurality of deformation layers; and a support layer which supports the actuator unit so that the actuator unit provides displacement corresponding to a voltage if the voltage is applied to the actuator unit. Therefore, it is possible to provide an electroactive polymer actuator suitable for a compact mobile device with a low driving voltage.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: May 18, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong-oh Kwon, Seung-tae Choi, Seung-wan Lee, Woon-bae Kim, Min-seog Choi
  • Publication number: 20100118413
    Abstract: Micro-shutter device applicable to display devices including a flexible display device and method of manufacturing same are provided. Micro-shutter device includes membrane. Frame including receiving hole in its center portion is bonded to membrane. Transparent substrate is bonded to frame to encapsulate optical fluid received in receiving hole. Actuator varies refractive power produced by change in curvature of fluid lens formed in the center portion of the receiving hole due to bending of a periphery of the fluid lens. A reflector is disposed to correspond to the fluid lens and be spaced apart from the membrane, such that light intensity transferred to a user is adjusted depending on the refractive power produced by a change in curvature of the fluid lens. Therefore, the device has improved optical efficiency compared to using liquid crystal and a polarizing film, and can have a flexible structure for application to a flexible display device.
    Type: Application
    Filed: September 10, 2009
    Publication date: May 13, 2010
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Woon-bae Kim, Kyu-dong Jung, Seung-wan Lee
  • Publication number: 20100110606
    Abstract: A tunable capacitor using an electrowetting phenomenon includes a first electrode; a second electrode which is spaced apart from the first electrode and faces the first electrode; a fluidic channel which is disposed between the first electrode and the second electrode; a first insulating layer which is disposed between the first electrode and the fluidic channel; and a conductive fluid which is disposed in the fluidic channel and moves along the fluidic channel when a direct current (DC) potential difference occurs between the first and second electrodes. Accordingly, it is possible to fabricate the tunable capacitor with the simplified fabrication process, good reliability and durability, and no restriction on the tuning range.
    Type: Application
    Filed: January 6, 2010
    Publication date: May 6, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung-tae CHOI, Ji-hyuk Lim, Woon-bae Kim, Eun-seok Park, Jeong-yub Lee