Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.

Abstract: A film-type semiconductor package includes a metal lead portion arranged on a film substrate, a semiconductor chip including a pad, and a bump connecting the metal lead portion to the pad of the semiconductor chip. The bump includes a metal pillar arranged on the pad and including a first metal and a soldering portion arranged on an entire surface of the metal pillar, bonded to the metal lead portion, and including the first metal and a second metal that is different from the first metal.

Abstract: A varifocal-type optical scanning probe including an optical fiber scanner and a varifocal lens is provided. The varifocal lens includes: a first membrane lens comprising a first lens surface with a variable curvature and a first pressure surface configured to induce a curvature variation of the first lens surface; a second membrane lens including a second lens surface with a variable curvature and a second pressure surface configured to induce a curvature variation of the second lens surface; a first pressure member disposed to apply a pressure to the first pressure surface; a second pressure member disposed to apply a pressure to the second pressure surface; and a motor configured to transmit a driving force to at least one of the first pressure member and the second pressure member.

Abstract: A multi-touch sensing apparatus using a rear view camera of an array type is provided. The multi-touch sensing apparatus may include a display panel to display an image, a sensing light source to emit light to sense a touch image which is generated by an object and displayed on a back side of the display panel, and a camera to divide and sense the touch image. The camera may be arranged in an edge of a lower side of the multi-touch sensing apparatus, or a mirror to reflect the touch image may be included in the multi-touch sensing apparatus.

Abstract: At least some example embodiments provide a fingerprint sensor, a fingerprint sensor package, and a fingerprint sensing system using light sources of a display panel. The fingerprint sensor includes an image sensor including a plurality of sensor pixels, the sensor pixels configured to sense light reflected by a fingerprint and generate image information corresponding to the fingerprint and a pinhole mask defining a plurality of pinholes, wherein each of the pinholes forms a focus for transmitting the light reflected by the fingerprint to the image sensor, wherein light is emitted from a plurality of organic light-emitting diodes (OLEDs) and is reflected by the fingerprint.

Abstract: A semiconductor package including a semiconductor chip having an active surface and a non-active surface opposite to the active surface, a ground member disposed on the active surface of the semiconductor chip, and an electromagnetic shielding member passing through the semiconductor chip, electrically connected to the ground member, and covering at least some regions of the non-active surface of the semiconductor chip may be provided.

Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.

Abstract: The probe includes a probe body that includes an internal empty space and is configured to be inserted into a coelom; an energy source module that is disposed in the probe body, and configured to emit an energy beam; first and second view windows that are provided at an end portion of the probe body, have different fields of view, and are configured to transmit the emitted energy beam; and a path changing unit that is disposed in the probe body, and configured to change a traveling path of the emitted energy beam to travel to one of the first view window and the second view window.

Abstract: A micro optical switch device, an image display apparatus including the same, and a method of manufacturing the micro optical switch device are provided. The micro optical switch device includes a substrate; a first electrode disposed on the substrate and having a plurality of openings; a second electrode disposed above and spaced apart from the first electrode, and having a plurality of openings; and support units disposed on the substrate and configured to support the second electrode, wherein the support units include deformation preventing portions protruding beyond a top surface of the second electrode.

Abstract: An optical zoom probe is disclosed. The optical zoom probe includes: at least one liquid lens having a focus which is configured to be adjusted according to a flow of a fluid through a flow path; and a barrel provided to form the flow path and including a narrowed first end part including a first opening through which an image is captured, the at least one liquid lens being provided inside the barrel.

Abstract: A numerical aperture (NA) controlling unit and a variable optical probe including the same are provided. The NA controlling unit includes: an aperture adjustment unit which controls an aperture through which light is transmitted; and a focus control unit that is disposed in a predetermined position with respect to the aperture adjustment unit, that focuses light transmitted through the aperture, and that has an adjustable focal length. The variable optical probe includes: a light transmission unit; a collimator that collimates light transmitted through the light transmission unit into parallel light; an NA controlling unit that focuses light on a sample to be inspected; and a scanner that varies a path of light transmitted through the light transmission unit such that a predetermined region of the sample is scanned by light that passes through the NA controlling unit.

Abstract: A microfluidic device and a method of controlling a fluid included in the microfluidic device. The microfluidic device includes: a chamber; a first fluid that is disposed in the chamber and in which a hygroscopic material is dissolved; a second fluid that is disposed in the chamber and is immiscible with the first fluid; and an electrode portion provide in the chamber and is configured to form an electrical field in the chamber when a voltage is applied to the electrode portion, wherein an interface between the first and second fluids is varied according to the electrical field.

Abstract: An ultrasonic transducer, and an ultrasonic wave generating apparatus and an ultrasonic system including the same. The ultrasonic transducer includes a light-absorbing layer configured to absorb light incident on the light-absorbing layer and to generate heat based on the absorbed light; and a thermoelastic layer which is disposed on the light-absorbing layer and which is configured to thermally expand based on the heat to generate ultrasonic waves.

Abstract: A fiber scanning projector includes a light source comprising a plurality of monochromatic light sources, a modulator providing a modulation signal according to image information to the light source, a scanner scanning a screen with a light emitted from the light source and controlled according to the modulation signal, the scanner including a fiber bundle and an actuator which 2-axis-drives the fiber bundle, and a synchronization controller synchronizing driving of the actuator and driving of the modulator.

Abstract: An optical apparatus such as a varifocal fluidic lens is provided. Optical apparatus includes a spacer frame, optical fluid, an elastic membrane, an actuator, an actuator frame, and a thermally deformable frame. Spacer frame defines an internal space including a lens portion and a driving portion that connect to each other, and the driving portion is disposed to surround the lens portion disposed in the center area of the internal space. Optical fluid is filled in the internal space defined by the spacer frame. The elastic membrane is attached on a surface of the spacer frame, to cover a side of the internal space, and the thermally deformable plate is attached on the other surface of the spacer frame, to cover the other side of the internal space. The thermally deformable plate deforms to increase or decrease a volume of the internal space according to a change in temperature.

Abstract: A semiconductor package includes a semiconductor chip mounted on a substrate, an insulating layer covering at least a portion of the semiconductor chip and including a thixotropic material or a hot melt material, and a shielding layer covering at least a portion of the semiconductor chip and the insulating layer. A method of manufacturing the semiconductor package includes forming an insulating layer and a shielding layer having a high aspect ratio by using a three-dimensional printer.

Abstract: A semiconductor package including a semiconductor chip having an active surface and a non-active surface opposite to the active surface, a ground member disposed on the active surface of the semiconductor chip, and an electromagnetic shielding member passing through the semiconductor chip, electrically connected to the ground member, and covering at least some regions of the non-active surface of the semiconductor chip may be provided.

Abstract: Provided is a body-implantable package for processing biosensed-data for wireless communication to an external device. The package includes a tube closed by a cover, therein, a chip with a strained layer affixed thereto to form a flexible laminar circuit. The cover is fitted over an open end of the tube after the laminated chip and strained layer are inserted therein. The chip is constructed of and rolled in one or more turns into a generally cylindrical shape. The strained layer is affixed to a surface of the chip automatically to cause the flexible laminar circuit to curl into a generally cylindrical shape to fit within the tube.

Abstract: A multi-touch sensing apparatus using a rear view camera of an array type is provided. The multi-touch sensing apparatus may include a display panel to display an image, a sensing light source to emit light to sense a touch image which is generated by an object and displayed on a back side of the display panel, and a camera to divide and sense the touch image. The camera may be arranged in an edge of a lower side of the multi-touch sensing apparatus, or a mirror to reflect the touch image may be included in the multi-touch sensing apparatus.

Abstract: A micro-optical switching device, an image display apparatus including the micro-optical switching device, and a method of manufacturing the micro-optical switching device are provided. The micro-optical switching device includes a substrate; a first electrode disposed on the substrate and including a first opening array, wherein the first opening array includes a plurality of openings; and a second electrode disposed spaced apart from the first electrode and including a second opening array including a plurality of openings, wherein the plurality of openings of the second opening array do not overlap with the plurality of openings of the first opening array.