Abstract: The present disclosure provides a bonding device for a flexible panel including: a transport element, a vacuum chamber, a cover jig, and a bonding jig; wherein the transport element is configured to move the flexible panel into the vacuum chamber or move the flexible panel out of the vacuum chamber; wherein both the cover jig and the bonding jig are disposed in the vacuum chamber, the cover jig is opposite to the bonding jig, and the cover jig is configured to secure thereon a cover plate to be bonded; and wherein the bonding jig has a curved hump protruding toward the cover jig, and the hump is configured to raise the flexible plate up to the cover plate to bond the cover plate with the flexible panel when the transport element transports the flexible plate to a location below the cover plate.

Abstract: A touch screen assembly and an electronic device are provided. The touch screen assembly comprises a first thin film layer, a conductive layer and a second thin film layer stacked together from bottom to top, and a base wherein the first film layer is disposed on the base. A difference value of refractive index between the base and the conductive layer is 0˜0.6, thus improving light transmittance, reducing influence to visual effects and improving touch screen quality.

Abstract: A flexible display is provided. The flexible display includes a flexible panel and a backboard body fixedly connected with the flexible panel. A glue-free surface is disposed on a side of the backboard body away from the flexible panel, and the backboard body includes a first backboard and a second backboard. At least one mark is disposed on the glue-free surface of the first backboard and the glue-free surface of second backboard, and all of the marks on the same backboard are arranged along a length direction of a bending line.

Abstract: The present disclosure provides a touch screen assembly, a method of manufacturing a touch screen assembly and a touch device, including a first protective layer, a conductive layer, and a second protective layer which are sequentially stacked from bottom to top, wherein an upper surface of the conductive layer is provided with a rough structure, the upper surface of the conductive layer is in contact with the second protective layer, the rough structure including a plurality of first grooves regularly arranged, and the rough structure is used for diffusely reflecting and/or scattering an incident light when the incident light illuminates the conductive layer through the second protective layer.

Abstract: A method of manufacturing an organic light emitting diode display is provided. The method includes: pasting a backboard to an underside of the flexible substrate by a viscosity-variable adhesive; severing the backboard located in the bended region from the backboard located in the non-bended region; peeling off the backboard located in the bended region; and performing a viscosity enhancement treatment to the viscosity-variable adhesive on the non-bended region.

Abstract: A rapid cycle pressure swing adsorption (RCPSA) air purification process, apparatus, and device for the removal of at least one of water, carbon dioxide, nitrous oxide, and one or more hydrocarbons from a feed air stream prior to cryogenic air separation.

Abstract: The present embodiment provides a display panel and a display device including a display section and a non-display section wherein the display section is disposed on the non-display section and the non-display section includes a first non-bending area, a bending area, and a second non-bending area; a backplate structure including a first backplate and a second backplate, wherein the first backplate is disposed corresponding to the first non-bending area and the second backplate is disposed corresponding to the second non-bending area; wherein a protection structure is disposed at an end of the backplate structure close to the bending area, and the protection structure is configured to make ends of both the first backplate and the second backplate close to the bending area to be in a same section when bending the non-display area.

Abstract: A method of manufacturing an organic light emitting diode display is provided. The method includes: pasting a backboard to an underside of the flexible substrate by a viscosity-variable adhesive; severing the backboard located in the bended region from the backboard located in the non-bended region; peeling off the backboard located in the bended region; and performing a viscosity enhancement treatment to the viscosity-variable adhesive on the non-bended region.

Abstract: The present disclosure provides a bonding device for a flexible panel including: a transport element, a vacuum chamber, a cover jig, and a bonding jig; wherein the transport element is configured to move the flexible panel into the vacuum chamber or move the flexible panel out of the vacuum chamber; wherein both the cover jig and the bonding jig are disposed in the vacuum chamber, the cover jig is opposite to the bonding jig, and the cover jig is configured to secure thereon a cover plate to be bonded; and wherein the bonding jig has a curved hump protruding toward the cover jig, and the hump is configured to raise the flexible plate up to the cover plate to bond the cover plate with the flexible panel when the transport element transports the flexible plate to a location below the cover plate.

Abstract: A flexible display is provided. The flexible display includes a flexible panel and a backboard body fixedly connected with the flexible panel. A glue-free surface is disposed on a side of the backboard body away from the flexible panel, and the backboard body includes a first backboard and a second backboard. At least one mark is disposed on the glue-free surface of the first backboard and the glue-free surface of second backboard, and all of the marks on the same backboard are arranged along a length direction of a bending line.

Abstract: A power supply includes a main body having a coupling face and a handlebar. The coupling face includes a first end and a second end forming a power socket. The handlebar includes a first beam coupled to the first end and a second beam. The first beam extends a tab outwardly. The handlebar defines a window configured to expose the power socket. The handlebar is transitionable between: (i) a first configuration in which the second beam couples the second end, the window corresponds and exposes the power socket, the tab extends toward a first direction, and (ii) a second configuration in which the second beam is remote from the second end, the window is remote from the power socket, and the tab extends toward a second direction different from the first direction. A method for removing the power supply from a case of an electronic device is also provided.

Abstract: A cardiac troponin I ultra-sensitive detection reagent kit, a preparation method, and a detection method. The reagent kit comprises at least one first anti-cardiac troponin I antibody marked with a trace marker and at least one second anti-cardiac troponin I antibody coated on magnetic microspheres, the first anti-cardiac troponin I antibody and cardiac troponin I binding site being different from the second anti-cardiac troponin I antibody and cardiac troponin I binding site. The reagent kit may further comprise a diluent capable of significantly reducing non-specific binding in a detection process, so as to further increase the detection accuracy and sensitivity. The method using the reagent kit to detect cardiac troponin I sensitively and accurately detects the amount of cardiac troponin I in a sample, and provides more timely and reliable information for the early diagnosis and treatment of AMI.

Abstract: An optical system may include a lens assembly that has two or more single-sided wafer level optics (WLO) lenses arranged to propagate light. The optical system can further include an image sensor, wherein the lens assembly is arranged relative to the image sensor to propagate light received at a first surface of the lens assembly, through the two or more single-sided WLO lenses and to the image sensor. In some embodiments, the optical system further includes a camera which includes the lens assembly and the image sensor. In various embodiments, a smart phone, a tablet computer, or another mobile computing device may include such a camera. In some embodiments, the at least two single-sided wafer level optics (WLO) lenses are each separated by a gap G, wherein the gap may be different between each of the single-sided lenses, and the gap G may be zero.

Abstract: A rapid cycle pressure swing adsorption (RCPSA) air purification process, apparatus, and device for the removal of at least one of water, carbon dioxide, nitrous oxide, and one or more hydrocarbons from a feed air stream prior to cryogenic air separation.

Abstract: The invention discloses an electronic expansion valve. The electronic expansion valve includes: a valve body (10), a first chamber being formed in the valve body (10), a liquid inlet (11) and a liquid outlet (12) being oppositely provided at two ends of the valve body (10); a second chamber, provided in the first chamber, a coil (20) being provided in the second chamber; a third chamber, an inlet end of the third chamber being communicated with the liquid inlet (11), an outlet end of the third chamber being communicated with the liquid outlet (12), the inlet end of the third chamber and the outlet end of the third chamber being coaxially provided, and a valve core (31) being provided in the third chamber; and the first chamber being communicated with the liquid inlet (11) via the first liquid passage hole (33).

Abstract: A system and method for scheduling at least one event includes a component module arranged to receive component data regarding a plurality of possible operation decisions, a modelling module arranged to utilise the plurality of operation decisions to construct a Petri net model to simulate a real world system, a scheduling module arranged to utilise the Petri net and variable data regarding the plurality of operation decisions to determine a schedule of events that is feasible subject to a set of predetermined constraints, and an operation module arranged to provide the schedule of events to at least one external device.

Abstract: Certain aspects relate to systems and techniques for folded optic stereoscopic imaging, wherein a number of folded optic paths each direct a different one of a corresponding number of stereoscopic images toward a portion of a single image sensor. Each folded optic path can include a set of optics including a first light folding surface positioned to receive light propagating from a scene along a first optical axis and redirect the light along a second optical axis, a second light folding surface positioned to redirect the light from the second optical axis to a third optical axis, and lens elements positioned along at least the first and second optical axes and including a first subset having telescopic optical characteristics and a second subset lengthening the optical path length. The sensor can be a three-dimensionally stacked backside illuminated sensor wafer and reconfigurable instruction cell array processing wafer that performs depth processing.

Abstract: Certain aspects relate to wafer level optical designs for a folded optic stereoscopic imaging system. One example folded optical path includes first and second reflective surfaces defining first, second, and third optical axes, and where the first reflective surface redirects light from the first optical axis to the second optical axis and where the second reflective surface redirects light from the second optical axis to the third optical axis. Such an example folded optical path further includes wafer-level optical stacks providing ten lens surfaces distributed along the first and second optical axes. A variation on the example folded optical path includes a prism having the first reflective surface, wherein plastic lenses are formed in or secured to the input and output surfaces of the prism in place of two of the wafer-level optical stacks.

Abstract: A rigid flex board module includes a rigid flex circuit board and a high-density interconnected circuit board. The rigid flex circuit board includes a flexible circuit board, a first rigid circuit board and a first adhesive layer. The flexible circuit board includes a bending portion and a jointing portion connected to the bending part. The rigid flex circuit board is disposed on the jointing portion to expose the bending portion. The first rigid circuit board electrically connects with the flexible circuit board. The first adhesive layer connects the first rigid circuit board and the jointing portion. The high-density interconnected circuit board is disposed in the first rigid circuit board and is electrically connected to the first rigid circuit board.

Abstract: Certain aspects relate to wafer level optical designs for a folded optic stereoscopic imaging system. One example folded optical path includes first and second reflective surfaces defining first, second, and third optical axes, and where the first reflective surface redirects light from the first optical axis to the second optical axis and where the second reflective surface redirects light from the second optical axis to the third optical axis. Such an example folded optical path further includes wafer-level optical stacks providing ten lens surfaces distributed along the first and second optical axes. A variation on the example folded optical path includes a prism having the first reflective surface, wherein plastic lenses are formed in or secured to the input and output surfaces of the prism in place of two of the wafer-level optical stacks.