Patents by Inventor Wu Lin

Wu Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250149028
    Abstract: Techniques for facilitating natural language interactions with visual interactive content are described. During a build time, a system analyzes various websites and applications relating to a particular user goal to understand website and application navigation and information relating to the user goal. The learned information is used to store configuration data. During runtime, when a user request performance of an action, the system engages in a dialog with the user to complete the user's goal. The system uses the stored configuration data to determine actions to be performed at a website or application to complete the user's goal, and determines system responses to present to the user to facilitate completion of the goal. Such system responses may request information from the user, may inform the user of information displayed at the website or application, etc.
    Type: Application
    Filed: October 23, 2024
    Publication date: May 8, 2025
    Inventors: Amitabh Saikia, Devesh Mohan Pandey, Tagyoung Chung, Shanchan Wu, Chien-Wei Lin, Govindarajan Sundaram Thattai, Aishwarya Naresh Reganti, Arindam Mandal, Prakash Krishnan, Raefer Christopher Gabriel, Meyyappan Sundaram
  • Patent number: 12276849
    Abstract: Disclosed is an optical module, including a circuit board, a thermally conductive substrate, a structural adhesive, a silicon photonic chip, a laser assembly, and a fiber array assembly coupled to the silicon photonic chip. The thermally conductive substrate includes a first surface, a second surface, and a first bearing seat, a second bearing seat and a third bearing seat disposed on the first surface and exposed from the opening of the circuit board. The area of the second surface is smaller than that of the first surface. Part of the first surface contacts the circuit board. The thermally conductive substrate is fixed to the circuit board by the structural adhesive. The silicon photonic chip is disposed on the first bearing seat, the laser assembly is disposed on the second bearing seat, and a joint of the fiber array assembly is disposed on the third bearing seat.
    Type: Grant
    Filed: December 5, 2022
    Date of Patent: April 15, 2025
    Assignee: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventors: QianBing Yan, Min-Sheng Kao, ChunFu Wu, Yueh-Kuo Lin, LinChun Li, Chung-Hsin Fu
  • Patent number: 12271533
    Abstract: Changing a lighting mode for a human interface device is described herein. A first lighting mode can be initiated for a human interface device. Keys on the human interface device can be selected over a period of time at a frequency that is within a defined range. A second lighting mode for the human interface device can be identified based in part on the frequency being within the defined range. The first lighting mode and the second lighting mode can define a lighting scheme for light sources in the human interface device that reflect a user mood. The first lighting mode can be switched to the second lighting mode.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: April 8, 2025
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Shun-Tai Yang, Yu-Wei Chiu, Tsung-Yi Lin, Tony Wu, Yi-Wen Fang
  • Publication number: 20250112137
    Abstract: A method of manufacturing a device includes bonding a first die and a second die to a first side of a substrate, forming a stress buffer structure over the first die and the second die, where the stress buffer structure includes a first portion of a first via extending through a first insulating layer, a second portion of the first via extending through a second insulating layer, and a third portion of the first via extending through a third insulating layer, where the second portion of the first via is disposed between the first portion of the first via and the third portion of the first via, and where a diameter of the second portion of the first via is smaller than diameters of the first portion of the first via and the third portion of the first via, and depositing a metal layer over the stress buffer structure.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 3, 2025
    Inventors: Shih-Wei Liu, Po-Yao Lin, Sing-Da Jiang, Tsunyen Wu, Kathy Wei Yan
  • Patent number: 12266992
    Abstract: Disclosed in the present invention is an electromagnetic pump, including: a pump body; an inner iron core, including a central cylinder, an axis of the central cylinder basically coinciding with an axis of the electromagnetic pump; a plurality of outer iron cores, disposed at least partially surrounding the inner iron core; a winding, at least partially disposed on the outer iron cores; and a pump channel mechanism, at least partially disposed between the outer iron cores and the inner iron core, where the pump channel mechanism includes: a first pump channel wall, a second pump channel wall, a circulation channel, and a cavity dividing structure, and being used for supporting the first pump channel wall and the second pump channel wall, the cavity dividing structure being further used for dividing the circulation channel, to divide the circulation channel into a plurality of channels.
    Type: Grant
    Filed: December 20, 2022
    Date of Patent: April 1, 2025
    Assignee: Zhejiang University
    Inventors: Fang Youtong, Ma Jien, Wu Wenxiao, Qiu Lin, Wu Lijian, Wang Dong, Zhang Jian, Xu Bowen
  • Publication number: 20250103899
    Abstract: Methods and systems of training neural networks with federated learning. Server-maintained machine learning models are sent from a server to clients, yielding local machine learning models. At each client, the models are trained with local data to determine a respective cross entropy loss and a distillation loss based on foundation models. Respective weights are updated at each client for each of the local machine learning model based on the losses. The updated weights are transferred to the server without transferring the locally-stored data, whereupon they are aggregated and transferred back to the clients. At each client, the local machine learning model is updated with the aggregated updated weights.
    Type: Application
    Filed: September 22, 2023
    Publication date: March 27, 2025
    Inventors: Xidong WU, Filipe J. CABRITA CONDESSA, Wan-Yi LIN, Devin T. WILLMOTT, Zhenzhen LI, Madan Ravi GANESH
  • Publication number: 20250103900
    Abstract: Methods and systems of training neural networks with federated learning. Machine learning models are sent from a server to clients, yielding local machine learning models. At each client, the models are trained with locally-stored data, including determining a respective cross entropy loss for each of the plurality of local machine learning models. Weights for each local model are updated, and transferred to the server without transferring locally-stored data. The transferred weights are aggregated at the server to obtain an aggregated server-maintained machine learning model. At the server, a distillation loss based on a foundation model is generated. The aggregated server-maintained machine learning is updated to obtain aggregated respective weights, which are transferred to the clients for updating in the local models.
    Type: Application
    Filed: September 22, 2023
    Publication date: March 27, 2025
    Inventors: Xidong WU, Filipe J. CABRITA CONDESSA, Wan-Yi LIN, Devin T. WILLMOTT, Zhenzhen LI, Madan Ravi GANESH
  • Publication number: 20250096071
    Abstract: Provided are integrated circuit systems and methods for fabricating semiconductor packages. An integrated circuit system includes a circuit board having a top side and a bottom side and defining an opening from the top side to the bottom side; a bottom boiling plate having a recessed portion and having a projection with a terminal surface, wherein the recessed portion is located below the bottom side of the circuit board, wherein the projection extends through the opening, and wherein the terminal surface is located above the top side of the circuit board; a semiconductor substrate located over the top side of the circuit board and including semiconductor devices; and a top boiling plate located over the semiconductor substrate, wherein the bottom boiling plate and the top boiling plate are configured to dissipate heat away from the integrated circuit system.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 20, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsunyen Wu, Po-Yao Lin, Sing-Da Jiang, Shih-Wei Liu, Kathy Yan
  • Publication number: 20250090644
    Abstract: Provided is an E. coli expressed recombinant human microplasmin (E-?Plm), a production method thereof, a pharmaceutical composition and a kit comprising thereof, an application of the pharmaceutical composition and the kit in treating thromboembolism related diseases and a method of treating thromboembolism related diseases by using the pharmaceutical composition and the kit. The zymogen version of the E-?Plm or E-?Plg is unstable and can undergo autoactivation. Moreover, the in vivo half-life of the E-?Plm is significantly shorter than yeast expressed microplasmin (Y-?Plm), which allows the E-?Plm, the pharmaceutical composition and the kit effective in treating thromboembolism diseases but with reduced bleeding side effects.
    Type: Application
    Filed: September 27, 2024
    Publication date: March 20, 2025
    Inventors: Xinli Henry LIN, Yundong WU, Zhengchang LU
  • Publication number: 20250091142
    Abstract: An electrode plate molding device is disclosed, including a conveying mechanism, a cutting mechanism, a first detection mechanism, and a deviation rectification mechanism. The conveying mechanism is configured to convey an electrode plate strip. The cutting mechanism is arranged downstream of the conveying mechanism along a conveying direction of the electrode plate strip. The cutting mechanism is configured to cut the electrode plate strip to form an electrode plate. The first detection mechanism is located upstream of the cutting mechanism along the conveying direction. The first detection mechanism is configured to detect a location of the electrode plate strip along a width direction of the electrode plate strip. The deviation rectification mechanism adjusts relative locations of the electrode plate strip and the cutting mechanism along the width direction in response to a detection result of the first detection mechanism.
    Type: Application
    Filed: December 3, 2024
    Publication date: March 20, 2025
    Applicant: CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITED
    Inventors: Yitai GUO, Zhihui WANG, Wu LIN
  • Patent number: 12256551
    Abstract: A method for forming a semiconductor memory structure includes following operations. A plurality of doped regions are formed in a semiconductor substrate. The doped regions are separated from each other. A stack including a plurality of first insulating layers and a plurality of second insulating layers alternately arranged is formed over the semiconductor substrate. A first trench is formed in the stack. The second insulating layers are replaced with a plurality of conductive layers. A second trench is formed. A charge-trapping layer and a channel layer are formed in the second trench. An isolation structure is formed to fill the second trench. A source structure and a drain structure are formed at two sides of the isolation structure.
    Type: Grant
    Filed: November 20, 2022
    Date of Patent: March 18, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Nuo Xu, Sai-Hooi Yeong, Yu-Ming Lin, Zhiqiang Wu
  • Publication number: 20250085790
    Abstract: A wrist-worn device control method is disclosed. The method includes: collecting first motion data of a wrist-worn device, where the first motion data includes angular velocity information and acceleration information of the wrist-worn device; and identifying, based on the first motion data of the wrist-worn device, that the wrist-worn device changes from a first posture to a second posture, and playing, by the wrist-worn device, media information, where the media information is at least one of a speech message, a text message, or incoming call information that are received by the wrist-worn device, and information displayed by the wrist-worn device, and the second posture is a posture in which a hand of a user wearing the wrist-worn device is close to an ear of the user. Therefore, a message can be played without occupying two hands of the user, interaction is convenient, and user experience is good.
    Type: Application
    Filed: November 22, 2024
    Publication date: March 13, 2025
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Wenhao Wu, Nu Zhang, Qiang Xu, Shuiping Long, Ching Szu Lin, Vijaya Krishna Mulpuri, Siju Wu
  • Patent number: 12248173
    Abstract: Disclosed is an optical module, including a lower housing, an upper housing covering the lower housing, a circuit board, a first metal base, a second metal base, a silicon photonic chip, and a light emission module including a laser chip and an optical path assembly. The first metal base is disposed on one side of the upper housing. The second metal base is disposed on one side of the lower housing. The circuit board with a hollow region is disposed on the second metal base. The silicon photonic chip is disposed on the second metal base exposed from the hollow region. The laser chip is disposed on the first metal base. The optical path assembly is disposed on the first metal base and/or on the second metal base exposed from the hollow region, and guides a third optical signal emitted by the laser chip to the silicon photonic chip.
    Type: Grant
    Filed: December 22, 2022
    Date of Patent: March 11, 2025
    Assignee: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventors: Chung-Hsin Fu, Min-Sheng Kao, ChunFu Wu, Yi-Tseng Lin, Chih-Wei Yu, Chien-Tzu Wu, QianBing Yan, Yueh-Kuo Lin
  • Publication number: 20250066441
    Abstract: The present disclosure relates to IL 12 receptor agonists with improved therapeutic profiles.
    Type: Application
    Filed: July 18, 2022
    Publication date: February 27, 2025
    Applicant: Regeneron Pharmaceuticals, Inc.
    Inventors: Aaron CHANG, Jiaxi WU, Tong ZHANG, Nicolin BLOCH, Erica ULLMAN, Eric SMITH, Chia-Yang LIN, Samuel DAVIS
  • Patent number: 12237312
    Abstract: A light-emitting diode (LED) packaging module includes a plurality of LED chips spaced apart from one another, an encapsulating layer that fills in a space among the LED chips, a light-transmitting layer disposed on the encapsulating layer, a wiring assembly disposed on and electrically connected to the LED chips, and an insulation component that covers the encapsulating layer and the wiring assembly. Each of the LED chips includes an electrode assembly including first and second electrodes. The light-transmitting layer includes a light-transmitting layer that has a light transmittance greater than that of the encapsulating layer.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: February 25, 2025
    Assignee: QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD.
    Inventors: Shuning Xin, Chen-Ke Hsu, Aihua Cao, Junpeng Shi, Weng-Tack Wong, Yanqiu Liao, Zhen-Duan Lin, Changchin Yu, Chi-Wei Liao, Zheng Wu, Chia-En Lee
  • Patent number: 12230611
    Abstract: A light-emitting device includes a number (N) of light-emitting units, a number (a) of first metal pads and a number (b) of second metal pads. Each of the light-emitting units includes a number (n) of light-emitting chips each having two distinct terminals, where N and n are integers and N>1, n>?3. The numbers (a) and (b) are integers and a>1, b>1, and the terminals of each of the light-emitting chips are electrically connected to a unique combination of one of the number (a) of first metal pads and a number (b) of second metal pads, respectively. The numbers (N), (n), (a) and (b) satisfy the equation: a*b=n*N.
    Type: Grant
    Filed: February 8, 2022
    Date of Patent: February 18, 2025
    Assignee: QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD.
    Inventors: Yanqiu Liao, Junpeng Shi, Shuning Xin, Chen-ke Hsu, Zhen-duan Lin, Changchin Yu, Aihua Cao, Chi-Wei Liao, Zheng Wu, Chia-en Lee
  • Patent number: 12230612
    Abstract: A light-emitting diode (LED) packaging module includes light-emitting units arranged in an array having m row(s) and n column(s), an encapsulating layer, and a wiring assembly, where m and n each independently represents a positive integer. Each of the light-emitting units includes LED chips each including a chip first surface, a chip second surface, a chip side surface, and an electrode assembly disposed on the chip second surface. The encapsulating layer covers the chip side surface and fills a space among the LED chips. The wiring assembly is disposed on the chip second surface and is electrically connected to the electrode assembly.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: February 18, 2025
    Assignee: QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD.
    Inventors: Shuning Xin, Zhen-Duan Lin, Yanqiu Liao, Junpeng Shi, Aihua Cao, Changchin Yu, Chen-Ke Hsu, Chi-Wei Liao, Chia-En Lee, Zheng Wu
  • Patent number: 12230222
    Abstract: An electronic device including a display device is provided. The display device includes a sharing area, a junction area, and a privacy area. The junction area is positioned between the sharing area and the privacy area. The display device includes a privacy panel. A transmittance of the privacy panel corresponding to the sharing area is greater than a transmittance of the privacy panel corresponding to the junction area, and the transmittance of the privacy panel corresponding to the junction area is greater than a transmittance of the privacy panel corresponding to the privacy area.
    Type: Grant
    Filed: August 8, 2023
    Date of Patent: February 18, 2025
    Assignees: Innolux Corporation, CARUX TECHNOLOGY PTE. LTD.
    Inventors: Li-Wei Sung, Chia-Hsien Lin, Cheng-Wu Lin, Yu-Ming Wu
  • Publication number: 20250054491
    Abstract: Systems and methods are provided for smart audio segmentation using look-ahead based acousto-linguistic features. For example, systems and methods are provided for obtaining audio, processing the audio, identifying a potential segmentation boundary within the audio, and determining whether to generate a segment break at the potential segmentation boundary. One or more look-ahead words occurring after the potential segmentation boundary are identified, wherein an acoustic segmentation score and a language segmentation score associated with the potential segmentation boundary and the one or more look-ahead words are generated. Systems then either refrain from generating a segment break at the potential segmentation boundary or generate the segment break at the potential segmentation boundary based on the acoustic and/or language segmentation score at least meeting or exceeding a segmentation score threshold.
    Type: Application
    Filed: December 22, 2021
    Publication date: February 13, 2025
    Inventors: Sayan Dev PATHAK, Hosam Adel KHALIL, Naveen PARIHAR, Piyush BEHRE, Shuangyu CHANG, Christopher Hakan BASOGLU, Sharman W TAN, Eva SHARMA, Jian WU, Yang LIU, Edward C LIN, Amit Kumar AGARWAL
  • Patent number: D1064385
    Type: Grant
    Filed: August 11, 2023
    Date of Patent: February 25, 2025
    Inventors: Zhiyuan Lin, Shuanghui Chen, Huajiang Zhu, Wu Chen, Zhoufu Xie