Abstract: A method of controlling an unmanned aerial vehicle (UAV) includes receiving an image from one or more vision sensors of the UAV. The image is captured while the UAV is in flight and includes a marker within an environment. The marker has a visual pattern. The method further includes identifying the visual pattern to determine a plurality of instructions encoded in the visual pattern, and controlling, in response to the plurality of instructions, the UAV to perform an action including at least one of adjusting position of a payload, swapping a payload, or capturing an image of a selected subject.

Abstract: Systems and methods are provided for positing an unmanned aerial vehicle (UAV) in an environment. The UAV may be able to identify visual markers and patterns in the environment. The UAV can distinguish between visual markers and other features in the environment. The visual markers can be analyzed with visual sensors to determine the position of the UAV in the environment. The visual markers can encode instructions to the UAV.

Abstract: The present invention discloses and claims a more efficient and economical method and system for osmotic energy production and capture using responsive compounds and molecules. The present invention is an energy harvest system enabled by stimuli responsive draw solutions that are competent in terms of energy production, geographic location flexibility, and the affordable, efficient and economical production and delivery of osmotic power. Specifically, the present invention is a novel osmotic power system that uses stimuli responsive draw solutions, economically feasible larger permeable membranes, and low grade heat sources to deliver osmotic power more efficiently and economically with less negative environmental impact, greater power output, and located in more geographically diverse areas of the world than previously thought possible for supporting such a power source.

Abstract: Embodiments of the present invention provide a computer-implemented method for identifying a specified object. The method includes collecting attributes of a physical object within a physical space, in which the attributes include an object temperature obtained via an (IR) sensor and an object shape obtained via an image sensor. A machine learning algorithm is executed to allocate a coordinate to the object based on the attributes. In response to a request from a user to locate the object, the physical space is scanned via the IR sensor and the image sensor to identify the object and to detect a present location. An indication of a location of the object is then displayed to the user, in which the indication is at least one of the present location of the object or a predicted location of the object.

Abstract: A mechanism to prevent unauthorized physical use of an electronic device includes a main circuit board, a plurality of light sources, a plurality of sensors, a base, a plurality of optical members, and a magnetic member. The base comprises a base body and a plurality of guiding members. Each optical member comprises a main body and a magnetic portion. The main body of each optical member can change either a direction of propagation of light or a wavelength of light emitted from a light source, or both, and can propagate such light to a sensor which can forward to a control unit electrical signals representing a password input. When the electronic device is detached, the magnetic member attracts the magnetized optical members into random disorder on the cover, thereby destroying the predefined order.

Abstract: A navigation processing method includes displaying an image at a graphical user interface. The image is obtained by an imaging device provided at a movable object. The method also includes determining, in response to receiving a location selection operation at the graphical user interface, location information of a location point selected by the location selection operation in the image. The method further includes controlling the movable object to move toward a target navigation point, the target navigation point being obtained based on the location information.

Abstract: A mechanism to prevent unauthorized physical use of an electronic device includes a main circuit board, a plurality of light sources, a plurality of sensors, a base, a plurality of optical members, and a magnetic member. The base comprises a base body and a plurality of guiding members. Each optical member comprises a main body and a magnetic portion. The main body of each optical member can change either a direction of propagation of light or a wavelength of light emitted from a light source, or both, and can propagate such light to a sensor which can forward to a control unit electrical signals representing a password input. When the electronic device is detached, the magnetic member attracts the magnetized optical members into random disorder on the cover, thereby destroying the predefined order.

Abstract: An integrated circuit (IC) structure includes an active area of the IC structure insulator positioned over a substrate. The active area includes an interconnection structure comprised of a first plurality of levels. Each of the interconnect structure levels including an interlayer dielectric (ILD) layer, a barrier layer disposed over the ILD and a conductor metal layer over the barrier layer. The structure also includes a crack stop area which includes a crack stop structure having a second plurality of levels. The interconnect and crack stop structures have an equal number of levels. A third plurality of the crack stop structure levels include a high modulus layer unique to the respective crack stop structure level as compared to the corresponding interconnect structure level.

Abstract: Technologies for network communication using pooled memory include a computing rack having a pooled memory enclosure with a pooled memory controller and a compute enclosure having two or more compute nodes. A first compute node determines a destination virtual network interface controller identifier (vNIC ID) associated with a destination network address. The first compute node transmits a send message to the pooled memory controller that includes the destination vNIC ID and a sender physical address of packet data within the pooled memory. The pooled memory controller transmits a receive message to a second compute node associated with the destination vNIC ID. The second compute node transmits a receiver physical address of a receive buffer within the pooled memory to the pooled memory controller. The pooled memory controller copies the packet data from the sender physical address to the receiver physical address. Other embodiments are described and claimed.

Abstract: A combined nanofluidic and integrated circuit device includes a semiconductor wafer, which includes a substrate with active circuitry formed in the substrate; an oxide layer deposited adjacent the active circuitry; a stressor film deposited onto or into the oxide layer in sections, wherein the stressor film has a higher coefficient of thermal expansion than the oxide layer has; and a nanochannel formed in the oxide layer between the sections of the stressor film. According to an exemplary embodiment, the nanochannel is formed in the oxide layer by cooling the oxide layer and the stressor film to a fracture propagation temperature that is less than first and second temperatures at which the oxide layer and the stressor film are deposited on the substrate.

Abstract: A method of processing a protein in an acid solution is disclosed. The processed protein exhibits various optimized properties including crystallinity, thermal stability, bio-stability, and elastic modulus.

Abstract: The present invention relates to a fluoroallylamine derivative and use thereof. In particular, the present invention relates to a compound as shown in Formula I, a prodrug, an isomer, an isotope-labeled compound, a solvate or a pharmaceutically acceptable salt thereof, which has VAP-1/SSAO inhibitory activity, and can be used for treating a disease associated with VAP-1/SSAO overactivity.

Abstract: Embodiments of the present invention provide a computer-implemented method for identifying a specified object. The method includes collecting attributes of a physical object within a physical space, in which the attributes include an object temperature obtained via an (IR) sensor and an object shape obtained via an image sensor. A machine learning algorithm is executed to allocate a coordinate to the object based on the attributes. In response to a request from a user to locate the object, the physical space is scanned via the IR sensor and the image sensor to identify the object and to detect a present location. An indication of a location of the object is then displayed to the user, in which the indication is at least one of the present location of the object or a predicted location of the object.

Abstract: A card edge connector includes an insulating housing defining a mating slot, two rows of terminals and a grounding member. Each row of terminals includes grounding terminals and signal terminals. The grounding member includes a first grounding bar and a second grounding bar each defining an upper edge and a lower edge. A plurality of elastic tabs extends from the upper edge and contacting with corresponding grounding terminals. The first and second grounding sides are disposed vertically in a bottom and at an outer side of corresponding row of terminals, and extends along the longitudinal direction of the housing under a condition that the upper edges of the grounding sides are disposed below the inner bottom face of the mating slot. The upper edges are located below the inner bottom face of the mating slot.

Abstract: In some examples, a computing device comprises a virtual network endpoint; a network interface card (NIC) comprising a first hardware component and a second hardware component, wherein the first hardware component and the second hardware component provide separate packet input/output access to a physical network interface of the NIC, wherein the NIC is configured to receive a packet inbound from the physical network interface; and a virtual router to receive the packet from the NIC and output, using the first hardware component, in response to determining a destination endpoint of the packet is the virtual network endpoint, the packet back to the NIC, wherein the NIC is further configured to switch, in response to receiving the packet from the virtual router, the packet to the virtual network endpoint and to output, using the second hardware component, the packet to the virtual network endpoint.

Abstract: A method for constructing an advanced crack stop structure is described. An interconnection structure is formed comprised of a plurality of levels. Each level has an interconnect structure section and a crack stop section. In a first level of the interconnection structure, a high modulus layer is formed in the crack stop recess but not the interconnect recess and a barrier layer and a conductive metal layer is formed in both the interconnection recess and the crack stop recess of the first level. In a second level of the interconnection structure and the crack stop structure, a second high modulus layer is formed in the crack stop recess but not the interconnect recess and a barrier layer and a conductive metal layer is formed in both the interconnection recess and the crack stop recess of the second level. The barrier layers and high modulus layers are deposited in different steps.

Abstract: Disclosed herein is a use of an inorganic salt to form and regenerate a draw solute for forward osmosis, wherein the inorganic salt is selected from one or more of the group selected from sodium sulfate, calcium lactate, disodium phosphate, tetrasodium pyrophosphate, and hydrates thereof. Also disclosed herein is a method of forward osmosis using said inorganic salt.

Abstract: An integrated circuit (IC) structure includes an active area of the IC structure insulator positioned over a substrate. The active area includes an interconnection structure comprised of a plurality of levels, each of the interconnect structure levels including an interlayer dielectric (ILD) layer, a barrier layer disposed over the ILD and a conductor metal layer over the barrier layer. The IC structure also includes a crack stop area which includes a crack stop structure having an equal plurality of levels as the interconnect structure. Each of the crack stop structure levels includes at least one of the layers of the interconnection structure at a same level. At least one crack stop structure level also includes a high modulus layer unique to the crack stop structure level as compared to the corresponding interconnect structure level.

Abstract: A method for creating an integrated circuit (IC) structure includes an active area of the IC structure insulator positioned over a substrate. The active area includes an interconnection structure comprised of a plurality of levels, each of the interconnect structure levels including an interlayer dielectric (ILD) layer, a barrier layer disposed over the ILD and a conductor metal layer over the barrier layer. The IC structure also includes a crack stop area which includes a crack stop structure having an equal plurality of levels as the interconnect structure. Each of the crack stop structure levels includes at least one of the layers of the interconnection structure at a same level. At least one crack stop structure level also includes a high modulus layer unique to the crack stop structure level as compared to the corresponding interconnect structure level. In another aspect of the invention, a method for producing the structure is described.

Abstract: A method is provided to supply power to wafer-scale ICs. The method includes receiving a wafer containing ICs placed on the top of the wafer. The wafer has through-silicon vias to provide power from the bottom to the ICs. The method also includes a printed circuit board, which has power rails in a pattern on the top of the printed circuit board, where the rails provide voltage and ground. The method continues with placing metal solder spheres between the bottom of the wafer and the top of the printed circuit board, where the spheres provide connections between the two, and where the spheres are free to move and operate as mechanical springs to resist clamping forces. The method also includes applying clamping pressure to the structure to establish connections by compressing the spheres, where no soldering is required.