Abstract: A method of fabricating ultra-thin chips is provided. The method includes patterning circuit elements onto a substrate such that sections of the substrate are exposed and etching trenches into the sections of the substrate to define pedestals respectively associated with a corresponding circuit element. The method further includes depositing stressor layer material onto the circuit elements and applying handling tape to the stressor layer material. In addition, the method includes at least one of weakening the substrate in a plane defined by base corners of the pedestals and initiating substrate cracking at the base corners of the pedestals to encourage spalling of the pedestals off the substrate.

Abstract: Systems and methods are for securing link aggregation are provided. According to an embodiment, a network device in a secure domain discovers device information associated with a peer network device in an untrusted domain that is connected through a first link directly connecting a first interface of the network device to a first interface of the peer network device, and authenticates the peer while allowing at least some network traffic to continue to be transmitted through the first interface. The network device establishes a secure session between the network device and the peer over the first link when the peer network device is successfully authenticated. The network device then allows the first link to operate as part of a single aggregated logical link, including a second link coupling a second interface of the network device to a second interface of the peer network device.

Abstract: A docking station includes a tray and a charging stand. The tray is provided with a cleaning structure configured for self-cleaning of a roller brush of the cleaning robot. The charging stand is detachably mounted to the tray. The above arrangement enables self-cleaning of a cleaning robot and improves user experience, with a simple structure and low cost.

Abstract: A reference via in a set of plated vias on a printed circuit board is located. A reference lead is applied to the reference via. A test via in the set of plated vias is located. A test lead is applied to the test via. An electrical conductance between the reference via and the test via is measured. A property of a core layer of the printed circuit board is identified based on the electrical conductance.

Abstract: A method for controlling flight includes displaying, in a real-time manner, a picture photographed and sent by a photographing device carried by an aerial vehicle; determining a no-clicking area in the picture based on a position of an obstacle or a no-fly zone; receiving a click operation of a user on the picture; and controlling a flight of the aerial vehicle based on the click operation. Controlling the flight of the aerial vehicle based on the click operation includes invalidating the click operation in response to determining a click location of the click operation being in the no-clicking area; and controlling the flight of the aerial vehicle based on a position of the click location in response to determining the click location being not in the no-clicking area.

Abstract: A non-destructive testing method of analyzing a sample comprising a composite material is disclosed. The method comprises: emitting an electromagnetic signal onto the sample, the electromagnetic signal having a range of frequencies; detecting a response signal transmitted and/or reflected by the sample in response to the electromagnetic signal; processing the response signal to determine variation with frequency of a dielectric permittivity of the sample over the range of frequencies; and determining an indication of a structural characteristic of the sample from a measure of the variation with frequency of the dielectric permittivity of the sample.

Abstract: A system includes a flight controller. The flight controller is configured to, in response to a first user interface receiving a first user input, generate a first control signal. The first control signal is configured to control an unmanned aerial vehicle (UAV) to effect an autonomous flight with a first flight parameter and a second flight parameter. In response to a second user interface, different from the first user interface, receiving a second user input, the flight controller is further configured to modify the first flight parameter to obtain a modified first flight parameter, generate a second control signal based on the modified first flight parameter and the second flight parameter, and control the UAV to operate based on the second control signal.

Abstract: A draw solute for a forward osmosis process, the draw solute comprising: a thermally responsive ionic compound having at least one of: a lower critical solution temperature (LCST) and an upper critical solution temperature (UCST), the draw solute being regeneratable from a diluted aqueous draw solution after forward osmosis via one of: liquid-liquid phase separation and solid-liquid phase separation, the draw solute being regeneratable when the diluted aqueous draw solution is at a temperature selected from one of: above the LCST and below the UCST.

Abstract: A method for acquiring an obstacle distance including determining a detection mode for detecting an obstacle distance of an obstacle; detecting the obstacle distance using the detection mode. Detecting the obstacle distance includes in response to determining a monocular mode as the detection mode: capturing a first image and a second image using a lens of an imaging device at two different times with a predetermined monocular imaging interval at two different locations; and calculating the obstacle distance via a monocular triangulation based on the first image, the second image, and a displacement of the imaging device between the two different times. Both the first image and the second image contain the obstacle. The predetermined monocular imaging interval varies based upon an altitude of the imaging device changes.

Abstract: A card edge connector includes an elongated housing comprising opposite long walls and defining a card slot between the long walls, two rows of contacts retained in the long walls respectively and a ground member including two long plates retained in the long walls respectively. Each row of contacts includes ground contacts and signal contacts, the ground contacts comprises retaining sections retained in the housing, elastic sections extending upward from the retained sections with mating portions exposed to the card slot and leg sections extending downward from the retaining sections. Each of the ground contacts further comprises an engaging portion curved from the elastic section and touching corresponding long plate.

Abstract: Embodiments of this application disclose a packaged chip and a method for manufacturing a packaged chip. The packaged chip includes a substrate, a chip, and a heat sink. The heat sink includes a first bracket, a second bracket, and a cover. The first bracket and the second bracket are disposed on the substrate. The cover is supported on the substrate by the first bracket and the second bracket. The first bracket is a sealed annular bracket. The first bracket and the cover encircle a first space. The chip is accommodated in the first space. A thermal interface material is disposed between the chip and the cover. A hole connected to the first space is provided on the cover. The hole and the first space are filled with a filling material. The second bracket is located outside the first space.

Abstract: Apparatuses for computing are disclosed herein. An apparatus may include a set of data reduction modules to perform data reduction operations on sets of (key, value) data pairs to reduce an amount of values associated with a shared key, wherein the (key, value) data pairs are stored in a plurality of queues located in a plurality of solid state drives remote from the apparatus. The apparatus may further include a memory access module, communicably coupled to the set of data reduction modules, to directly transfer individual ones of the sets of queued (key, value) data pairs from the plurality of remote solid state drives through remote random access of the solid state drives, via a network, without using intermediate staging storage. Other embodiments may be disclosed or claimed.

Abstract: A card edge connector includes a longitudinal insulating housing including two long walls and a bottom wall connecting with the long wall and defining a card slot in a longitudinal direction among the long walls and the bottom wall, two rows of contact arranged in the long walls respectively. Each contact includes a retaining portion, a spring portion extending from the retaining portion and leg portion extending from the retaining portion and out of the insulating housing. The spring portions define contacting portions projecting into the card slot. Each contact is formed by directly punching out from a metal plate, the retaining portions define an outer edge and inner edge interfered with the insulating housing and two opposite plane faces connecting with the outer and inner edge and disposed perpendicular to the longitudinal direction.

Abstract: A method for controlling flight includes displaying prompt information in a picture received from an aerial vehicle, dividing the picture into at least two portions based on the prompt information, obtaining a location of a click operation on the picture, and controlling a flight direction of the aerial vehicle based on the location and the prompt information.

Abstract: Various embodiments are generally directed to techniques to detect fusible operators with machine learning, such as by evaluating a set of operators in a graph of a machine learning model to identify fusion candidates comprising subgraphs of the graph with two or more operators to combine, for instance. Some embodiments are particularly directed to utilizing a machine learning classifier to evaluate fusion candidates using a set of features of the fusion candidate.

Abstract: The present disclosure discloses a cleaning robot, including a housing, a receiving tank, and a liquid storage tank. The housing is provided with a first groove and a second groove spaced apart from each other. The receiving tank is located in the first groove and configured to receive dirt. The liquid storage tank is located in the second groove and configured to store a cleaning liquid. In the cleaning robot of the present disclosure, the receiving tank and the liquid storage tank are arranged separately and spaced apart from each other, such that the volume of the liquid storage tank is increased, thereby allowing a larger area to be cleaned with a tank of water stored.

Abstract: A method for assisting obstacle avoidance of a mobile platform includes determining to use a detection mode from a plurality of detection modes, detecting a characteristic condition of the mobile platform with respect to an obstacle using the detection mode, and directing the mobile platform to avoid the obstacle based on the detected characteristic condition.

Abstract: A card edge connector includes a longitudinal insulative housing, two rows of terminals and an insulative block fixed therein. The insulative housing includes two side walls and a card slot between the side walls and opening upward, the side walls defines grooves for receiving terminals and opening downward. Each terminal includes a retaining portion fixed in the groove, each row of the terminals including a plurality of signal terminals and a plurality of grounding terminals. Each signal groove loaded with the signal terminal is filled with the insulative block, the block fitly abuts against the retaining portion of the signal terminal.

Abstract: The present disclosure provides methods of controlling the size of cellulose crystals by mixing a first composition comprising cellulose and coagulating this mixture with varying concentrations of hydrogen peroxide.

Abstract: A multi-chip package structure includes a package substrate, an interconnect bridge device, first and second integrated circuit chips, and a connection structure. The first integrated circuit chip is flip-chip attached to at least the interconnect bridge device. The second integrated circuit chip is flip-chip attached to the interconnect bridge device and to the package substrate. The interconnect bridge device includes (i) wiring that is configured to provide chip-to-chip connections between the first and second integrated circuit chips and (ii) an embedded power distribution network that is configured to distribute at least one of a positive power supply voltage and a negative power supply voltage to at least one of the first and second integrated circuit chips attached to the interconnect bridge device. The connection structure (e.g., wire bond, injection molded solder, etc.) connects the embedded power distribution network to a power supply voltage contact of the package substrate.